Wafer stack and method of producing sensors

• US 6,106,735 A
• Filed: 01/12/1998
• Issued: 08/22/2000
• Est. Priority Date: 01/11/1997
• Status: Expired due to Term

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Kurle, Jurgen, Lutz, Markus, Schubert, Dietrich, Baumann, Helmut, Pinter, Stefan, Muenzel, Horst, Weiblen, Kurt, Bender, Karl
• Primary Examiner(s): Acquah, Samuel A.
• Application Number:
  US09/005,924
• Time in Patent Office: 953 Days
• Field of Search: 216/2, 216/13, 216/17, 216/39, 257/417, 257/419, 257/684, 257/727
• US Class Current: 216/2
• CPC Class Codes: B29C 33/0022 Multi-cavity moulds B29C33/301 takes precedence
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: G01L 9/0042 Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms details about the integration or bonding of piezoresistor in or on the diaphragm G01L9/0052 and G01L9/0057 respectively
• CPC Class Codes: G01L 9/0073 using a semiconductive diaphragm
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

A wafer stack with sensor elements hermetically sealed in caverns and a method of fabricating the sensors permitting a reduction in the size of the sensors formed after cutting the wafer stack and also yielding considerable savings in chip area in the manufacture of the wafer stack. The wafer stack includes bonding strips arranged between the individual sensor elements. The wafer stack is diced to form individual sensors by sawing in the middle through the bonding strips.

Claims

1. A method for producing sensors, comprising the steps of:

(a) situating at least two sensor elements on a substrate wafer, the sensor elements including electric contacts;

(b) introducing contact holes into a cap wafer;

(c) applying a bonding medium on the cap wafer, the bonding medium including bonding strips;

(d) applying the cap wafer to the substrate wafer, wherein only one of the bonding strips is positioned between two elements of the at least two sensor elements and is positioned around the contact holes;

(e) hermetically sealing caverns using the bonding medium, the at least two sensor elements being arranged in the caverns;

(f) after performing steps (c) through (e), sawing through the cap wafer and the bonding strips at predetermined locations, the predetermined locations subsequently forming lateral external surfaces of the sensors;

(g) after step (f), testing the caverns to determine if the caverns are impervious, the caverns being tested via at least one of the contact holes; and

(h) after step (g), sawing through the substrate wafer to completely separate the sensors.

2. The method according to claim 1, further comprising the step of:

(i) before step (g), heating the cap wafer and the substrate wafer.

3. The method according to claim 1, wherein the at least two sensor elements are arranged in predetermined pairs on the substrate wafer, each of the predetermined pairs having one hole, the one hole providing an access to the electric contacts of the sensor elements of each of the predetermined pairs.

4. The method according to claim 3, wherein the predetermined pairs include at least two pairs, one of the at least two pairs being laterally offset relative to another one of the at least two pairs.

5. The method according to claim 1, further comprising the step of:

(j) providing headers on the substrate wafer, the bonding strips being arranged on the headers for providing the cap wafer on the substrate wafer.

6. An undiced wafer stack, comprising:

a substrate wafer;

at least two sensor elements applied to the substrate wafer;

a cap wafer applied to the substrate wafer, the cap wafer bonding to the substrate wafer through a bonding medium, the bonding medium including bonding strips, the bonding strips hermetically sealing caverns, the caverns containing the at least two sensor elements; and

at least one contact arranged outside each of the caverns for electrically contacting a respective element of the at least two sensor elements,

wherein the cap wafer has at least one contact hole at an external portion of the caverns for providing an access to the at least one contact,

wherein only one of the bonding strips separates one of the caverns from another one of the caverns at predetermined areas between two elements of the at least two sensor elements.

7. The undiced wafer stack according to claim 6, wherein the at least two sensor elements are arranged in predetermined pairs, and wherein one of the contact holes provides the access to a respective contact of each sensor element of the predetermined pairs for each pair of the at least two sensor elements.

8. The undiced wafer stack according to claim 6, wherein the predetermined pairs include at least two pairs, one of the at least two pairs being laterally offset relative to another one of the at least two pairs.

9. The undiced wafer stack according to claim 6, wherein the cap wafer includes webs.

10. The undiced wafer stack according to claim 6, wherein the substrate wafer includes headers.

11. The undiced wafer stack according to claim 9, wherein the webs have a one piece structure with the cap wafer.

12. The undiced wafer stack according to claim 10, wherein the headers and the at least two sensor elements are produced from a polysilicon layer applied to the substrate wafer.