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Semiconductor device

  • US 6,107,689 A
  • Filed: 07/29/1997
  • Issued: 08/22/2000
  • Est. Priority Date: 07/30/1996
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • a wiring substrate having a chip mounting face on which a connected portion is formed;

    a semiconductor chip having an element forming face on which externally connecting terminals are formed, said externally connecting terminals being electrically connected to said connected portion; and

    a resin-sealed layer formed between said wiring substrate and said semiconductor chip so as to cover at least a periphery of said semiconductor chip,wherein said wiring substrate has a through hole supplied with a resin for fixing the semiconductor chip, wherein the through hole is bored from the chip mounting face to an undersurface thereof, the through hole having a main part and a sub-part, the main part formed to avoid the electrically connected portion between the semiconductor chip and the wiring substrate and the sub-Part formed as a branch extending from part of a periphery of the main part.

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