Semiconductor device

• US 6,107,689 A
• Filed: 07/29/1997
• Issued: 08/22/2000
• Est. Priority Date: 07/30/1996
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Kozono, Hiroyuki
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US08/902,093
• Time in Patent Office: 1,120 Days
• Field of Search: 257/738, 257/778, 257/723, 257/774, 257/737, 257/787
• US Class Current: 257/778
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/18161 of a flip chip

Abstract

A semiconductor device according to the present invention includes a wiring substrate having a chip mounting face on which a connected portion is formed, a semiconductor chip having an element forming face on which externally connecting terminals are formed, the externally connecting terminals being electrically connected to the connected portion, and a resin-sealed layer formed between the wiring substrate and the semiconductor chip so as to cover at least a periphery of the semiconductor chip. The wiring substrate has a through hole bored from the chip mounting face to an undersurface thereof. Part of the through hole is formed outside a chip mounting region of the wiring substrate.

Claims

1. A semiconductor device comprising:

a wiring substrate having a chip mounting face on which a connected portion is formed;

a semiconductor chip having an element forming face on which externally connecting terminals are formed, said externally connecting terminals being electrically connected to said connected portion; and

a resin-sealed layer formed between said wiring substrate and said semiconductor chip so as to cover at least a periphery of said semiconductor chip,

wherein said wiring substrate has a through hole supplied with a resin for fixing the semiconductor chip, wherein the through hole is bored from the chip mounting face to an undersurface thereof, the through hole having a main part and a sub-part, the main part formed to avoid the electrically connected portion between the semiconductor chip and the wiring substrate and the sub-Part formed as a branch extending from part of a periphery of the main part.

2. The semiconductor device according to claim 1, wherein said semiconductor chip is mounted face down such that the element forming face is opposed to the chip mounting face of said wiring substrate.

3. The semiconductor device according to claim 1, wherein said resin-sealed layer is formed by transfer mold.

4. The semiconductor device according to claim 1, further comprising externally connecting terminals formed on the undersurface of said wiring substrate and electrically connected to said semiconductor chip.

5. The semiconductor device according to claim 1, wherein said resin-sealed layer covers all over said semiconductor chip.

6. The semiconductor device according to claim 1, wherein said through hole has a square main part formed so as to face a region surrounded with said externally connecting terminals, and the sub-part extending outside the chip mounting region from at least one corner portion of said main part.

7. The semiconductor device according to claim 6, wherein the sub-part of said through hole has a strip-like plane pattern having a width of 0.3 mm or more.

8. The semiconductor device according to claim 6, wherein the corner portion of the main part of said through hole is located within a region of at least 0.6 mm×

0.6 mm of a corner portion of the chip mounting region.

9. The semiconductor device according to claim 1, wherein the sub-part of said through hole has a strip-like plane pattern having a width of 0.3 mm or more.

10. The semiconductor device according to claim 1, wherein the main part of said through hold has a corner portion located within a region of at least 0.6 mm×

0.6 mm of a corner portion of the chip mounting region.

11. A semiconductor device comprising:

a wiring substrate having a chip mounting face on which a connected portion is formed;

a first semiconductor chip having an element forming face on which externally connecting terminals are formed, said externally connecting terminals being electrically connected to said connected portion;

a second semiconductor chip having an element forming face on which externally connecting terminals are formed, said externally connecting terminals being electrically connected to said connected portion; and

a resin-sealed layer formed between said wiring substrate and said first semiconductor chip and between said wiring substrate and said second semiconductor chip, so as to cover at least a periphery of each of said first semiconductor chip and said second semiconductor chip,

wherein said wiring substrate has a first through hole bored from the chip mounting face to an undersurface thereof, part of said first through hole extending outside an area defined by the first semiconductor chip mounting region of said wiring substrate, and said wiring substrate has a second through hole bored in said second semiconductor chip from the chip mounting face to an undersurface thereof, part of said second through hole extending outside an area defined by the second semiconductor chip mounting region of said wiring substrate, wherein the first and the second through holes have a main part and a sub-part, the main part formed to avoid the electrically connected portion and the sub-part formed as a branch extending from part of a periphery of the main part and,

wherein the first hole is supplied with a resin for fixing the first semiconductor chip and the second through hole is supplied with the resin for fixing the second semiconductor chip.

12. The semiconductor device according to claim 11, wherein said first semiconductor chip is mounted face down such that the element forming face is opposed to the chip mounting face of said wiring substrate.

13. The semiconductor device according to claim 11, wherein said second semiconductor chip is mounted face down such that the element forming face is opposed to the chip mounting face of said wiring substrate.

14. The semiconductor device according to claim 11, wherein said resin-sealed layer is formed by transfer mold.

15. The semiconductor device according to claim 11, further comprising externally connecting terminals formed on the undersurface of said wiring substrate and electrically connected to said first semiconductor chip.

16. The semiconductor device according to claim 11, further comprising externally connecting terminals formed on the undersurface of said wiring substrate and electrically connected to said second semiconductor chip.

17. The semiconductor device according to claim 11, wherein said first through hole has a first main part formed except at an electrically connecting portion between said first semiconductor chip and said wiring substrate, and a first sub-part extending outside the first semiconductor chip mounting region from part of a periphery of said first main part.

18. The semiconductor device according to claim 17, wherein the first sub-part of said first through hole has a strip-like plane pattern having a width of 0.3 mm or more.

19. The semiconductor device according to claim 17, wherein the first main part of said first through hole has a corner portion located within a region of at least 0.6 mm×

0.6 mm of a corner portion of the first semiconductor chip mounting region.

20. The semiconductor device according to claim 11, wherein said second through hole has a second main part formed except at an electrically connecting portion between said second semiconductor chip and said wiring substrate, and a second sub-part extending outside the second semiconductor chip mounting region from part of a periphery of said first main part.

21. The semiconductor device according to claim 20, wherein the second sub-part of said second through hole has a strip-like plane pattern having a width of 0.3 mm or more.

22. The semiconductor device according to claim 20, wherein the second main part of said second through hole has a corner portion located within a region of at least 0.6 mm×

0.6 mm of a corner portion of the second semiconductor chip mounting region.

23. The semiconductor device according to claim 11, wherein said resin-sealed layer covers all over said first semiconductor chip.

24. The semiconductor device according to claim 11, wherein said resin-sealed layer covers all over said second semiconductor chip.

25. The semiconductor device according to claim 11, wherein said first through hole has a square, first main part formed so as to face a region surrounded with said externally connecting terminals, and a first sub-part extending outside the first chip mounting region from at least one corner portion of said first main part.

26. The semiconductor device according to claim 25, wherein the first sub-part of said first through hole has a strip-like plane pattern having a width of 0.3 mm or more.

27. The semiconductor device according to claim 25, wherein the first main part of said first through hole has a corner portion located within a region of at least 0.6 mm×

0.6 mm of a corner portion of the first chip mounting region.

28. The semiconductor device according to claim 11, wherein said second through hole has a square, second main part formed so as to face a region surrounded with said externally connecting terminals, and a second sub-part extending outside the second chip mounting region from at least one corner portion of said second main part.

29. The semiconductor device according to claim 28, wherein the second sub-part of said second through hole has a strip-like plane pattern having a width of 0.3 mm or more.

30. The semiconductor device according to claim 28, wherein the corner portion of the first main part of said first through hole is located within a region of at least 0.6 mm×

0.6 mm of a corner portion of the first semiconductor chip mounting region.

31. A semiconductor device comprising:

a wiring substrate having a chip mounting face on which a connected portion is formed;

a semiconductor chip having an element forming face on which externally connecting terminals are formed, said externally connecting terminals being electrically connected to said connected portion; and

a resin-sealed layer formed between said wiring substrate and said semiconductor chip so as to cover at least a periphery of said semiconductor chip,

wherein said wiring substrate has a groove extending outward beyond the area defined by a chip mounting region, the groove having a main part and a sub-part, the main part formed to avoid the electrically connected portion and the sub-part formed as a branch extending from part of a periphery of the main part and the groove is supplied with a resin for fixing the semiconductor chip.

32. The semiconductor device according to claim 31, wherein said groove has a depth of 0.25 mm or more.

33. The semiconductor device according to claim 31, wherein said semiconductor chip is mounted face down such that the element forming face is opposed to the chip mounting face of said wiring substrate.

34. The semiconductor device according to claim 31, wherein said resin-sealed layer is formed by transfer mold.

35. The semiconductor device according to claim 31, further comprising externally connecting terminals formed on the undersurface of said wiring substrate and electrically connected to said semiconductor chip.

36. The semiconductor device according to claim 31, wherein said resin-sealed layer covers all over said semiconductor chip.