Radio frequency identification tag having an article integrated antenna

• US 6,107,920 A
• Filed: 06/09/1998
• Issued: 08/22/2000
• Est. Priority Date: 06/09/1998
• Status: Expired due to Term

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Ghaem, Sanjar, Eberhardt, Noel H.
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US09/094,261
• Time in Patent Office: 805 Days
• Field of Search: 340/572.7, 343/872, 343/873, 257/673, 361/767, 361/783, 361/808
• US Class Current: 340/572.7
• CPC Class Codes: B65D 2203/10 Transponders
• CPC Class Codes: B65D 5/4233 Cards, coupons, labels or the like formed separately from the container or lid
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate

Abstract

A radio frequency identification tag (14) utilizes an antenna (22) formed in association with, and thus integral to, an article, package, package container, label and/or identification badge (10). In a preferred embodiment, a radio frequency identification tag circuit chip assembly (12) is secured to the article (10) and is electrically coupled to the antenna (22) formed on the article (10). Printing a conductive pattern on the article using conductive ink forms a preferred antenna.

Claims

1. An antenna arranged for use with an electrostatic radio frequency identification (RFID) tag, the antenna comprising:

a first substrate; and

a conductive pattern formed on the first substrate, the conductive pattern including a first antenna element having a first coupling region and a second antenna element having a second coupling region, the first antenna element isolated from the second antenna element by a non-conductive region disposed in the conductive pattern.

2. The antenna of claim 1, wherein the first substrate is at least part of one of a badge, a package, a container, and a label.

3. The antenna of claim 1, wherein the conductive pattern is a conductive ink printed on the first substrate, only.

4. The antenna of claim 1, wherein the first coupling region and the second coupling region are electrically coupled to a radio frequency identification tag circuit chip.

5. The antenna of claim 1, wherein the first antenna element and the second antenna element are arranged for electrostatically coupling to an interrogator.

6. The antenna of claim 1, wherein the first substrate comprises a first surface, the conductive pattern being formed on the first surface.

7. The antenna of claim 6, wherein the conductive pattern covers substantially the entire surface area of the first surface.

8. The antenna of claim 1, wherein the first coupling region and the second coupling region are electrically coupled to a RFID chip assembly.

9. The antenna of claim 8, wherein the RFID chip assembly comprises an RFID circuit chip.

10. The antenna of claim 9, wherein the RFID circuit chip is attached to a conductive pattern disposed on a second substrate by at least one of an isotropic adhesive and an anisotropic adhesive.

11. A package container arranged for use with an electrostatic radio frequency identification tag, the package container comprising:

a package medium, and

a conductive pattern formed on the package medium, the conductive pattern including a first antenna element having a first coupling region and a second antenna element having a second coupling region, and the package medium having a locally compressed region about the first coupling region and the second coupling region.

12. The package container of claim 11, wherein the conductive pattern forms an antenna for the electrostatic radio frequency identification tag.

13. The package container of claim 11, wherein the conductive pattern is conductive ink printed on the package medium.

14. The package container of claim 11, wherein the first coupling region and the second coupling region are electrically coupled to a radio frequency identification tag circuit chip.

15. The package container of claim 11, wherein the first antenna element and the second antenna element are arranged for electrostatically coupling to an interrogator.

16. The package container of claim 11, wherein the package medium comprises a substrate including a plurality of scores and a plurality of cutouts, the plurality of scores and the plurality of cutouts arranged for forming the substrate into a box.

17. The package container of claim 11, wherein the package medium comprises a first surface and a second surface, the first surface and the second surface being non-parallel and the conductive pattern being formed on the first surface.

18. An electrostatic radio frequency identification (RFID) tag comprising a first substrate formed to include a recess in a surface thereof and an antenna formed on the surface, the antenna extending into the recess and contacting side walls thereof, and a RFID chip assembly secured within the recess and electrically coupled to the antenna.

19. The electrostatic radio frequency identification (RFID) tag of claim 18, wherein the RFID chip assembly comprises an RFID circuit chip.

20. The electrostatic radio frequency identification (RFID) tag of claim 19, wherein a conductive adhesive bonds the RFID circuit chip to a conductive pattern disposed on a second substrate comprising a part of the RFID chip assembly.

21. The radio frequency identification tag of claim 20, the conductive adhesive comprising at least one of an anisotropic adhesive and an isotropic adhesive.

22. The radio frequency identification (RFID) tag of claim 18, wherein the first substrate and a cover form a portion of an article.

23. The radio frequency identification (RFID) tag of claim 22, the first substrate and the cover forming a portion of a laminated package.

24. A radio frequency identification tag comprising a substrate formed to include a recess in a surface thereof and an antenna formed on the surface, a radio frequency identification tag circuit chip secured within the recess and electrically coupled to the antenna, and a cover secured over the surface, the cover formed to include a cover recess, and the cover recess arranged to register with the recess.

25. The radio frequency identification tag of claim 24, the radio frequency identification tag circuit chip comprising a radio frequency identification tag circuit chip assembly.

26. The radio frequency identification tag of claim 24, a conductive adhesive bonding the radio frequency identification tag circuit chip within the recess.

27. The radio frequency identification tag of claim 26, the conductive adhesive comprising at least one of an anisotropic adhesive and an isotropic adhesive.

28. The radio frequency identification tag of claim 24, the substrate and the cover forming a portion of an article.

29. The radio frequency identification tag of claim 28, the substrate and the cover forming a portion of a laminated package.

30. A radio frequency identification tag comprising a substrate having an antenna formed on a surface thereof, a radio frequency identification tag circuit chip secured to the surface and electrically coupled to the antenna, and a cover secured over the surface, the cover formed to include a cover recess, and the cover recess arranged to surround the radio frequency identification tag circuit chip.

31. The radio frequency identification tag of claim 30, the radio frequency identification tag circuit chip comprising a radio frequency identification tag circuit chip assembly.

32. The radio frequency identification tag of claim 30, a conductive adhesive bonding the radio frequency identification tag circuit chip within the cover recess.

33. The radio frequency identification tag of claim 32, the conductive adhesive comprising at least one of an anisotropic adhesive and an isotropic adhesive.

34. The radio frequency identification tag of claim 30, the substrate and the cover forming a portion of an article.

35. The radio frequency identification tag of claim 34, the substrate and the cover forming a portion of a laminated package.