Device for re-directing light from optical waveguide

• US 6,108,472 A
• Filed: 02/06/1998
• Issued: 08/22/2000
• Est. Priority Date: 02/07/1997
• Status: Expired due to Term

• Current Assignee: Mellanox Technologies Silicon Photonics Inc. (NVIDIA Corporation)
• Original Assignee: Bookham Incorporated (Oclaro (North America), Inc.)
• Inventors: Gorton, Stephen, Morris, Robin Jeremy Richard, Asghari, Mehdi, Harpin, Arnold Peter Roscoe, Rickman, Andrew George
• Primary Examiner(s): Arroyo, Teresa M.
• Assistant Examiner(s): Wise, Robert E.
• Application Number:
  US09/019,729
• Time in Patent Office: 928 Days
• Field of Search: 385/48, 385/49
• US Class Current: 385/48
• CPC Class Codes: G02B 6/4214 the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device G02B6/4246 takes precedence
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01S 5/02 Structural details or components not essential to laser action

Abstract

The device is formed on a silicon-on-insulator chip (which comprises a layer of silicon (1) separated from a substrate (3) by an insulator layer (2)) and comprises an integrated waveguide (4) formed in the silicon layer (1) and a reflective facet (6) formed in a recess in the silicon layer (1). The facet (6) is positioned to redirect light in a desired direction. The waveguide (4) and facet (6) are both formed in the silicon layer (1) so their positions can be defined by the same lithographic steps so they are automatically aligned with each other.

Claims

1. A device for re-directing light from an optical waveguide on a silicon-on-insulator chip which comprises a layer of silicon separated from a substrate by an insulator layer, the device comprising an integrated waveguide formed in the silicon layer and a reflective facet formed in a recess in the silicon layer, the facet being positioned to receive light from the waveguide and angled so as to re-direct the light in a desired direction, the waveguide and facet both being formed in the silicon layer so their locations can be defined by the same lithographic step.

2. A device as claimed in claim 1 in which the facet is angled to direct light out of the plane of the chip.

3. A device as claimed in claim 2 in which the facet is angled to direct light in a direction substantially perpendicular to the plane of the chip.

4. A device as claimed in claim 2 in which the facet is angled to direct light out of the plane of the chip at an angle to the normal of the chip.

5. A device as claimed in claim 4 in which the facet is angled so its edges do not lie perpendicular to light received from the waveguide.

6. A device as claimed in claim 1 arranged to direct light received from the optical fiber to a photodiode mounted on the chip.

7. A device as claimed in claim 6 in which the photodiode is mounted over the recess in which the facet is formed.

8. A device as claimed in claim 1 in which a laser or light emitting diode is mounted over the recess in which the facet is formed.

9. A device as claimed in claim 1 in which the distance between the end of the waveguide and the facet is less than 15 microns, and preferably less than 10 microns.

10. An integrated optical circuit including a device for re-directing light from an optical waveguide on a silicon-on-insulator chip which comprises a layer of silicon separated from a substrate by an insulator layer, the device comprising an integrated waveguide formed in the silicon layer and a reflective facet formed in a recess in the silicon layer, the facet being positioned to receive light from the waveguide and angled so as to re-direct the light in a desired direction, the waveguide and facet both being formed in the silicon layer so their locations can be defined by the same lithographic step.