Integrated circuit carrier package with battery coin cell

• US 6,109,530 A
• Filed: 07/08/1998
• Issued: 08/29/2000
• Est. Priority Date: 07/08/1998
• Status: Expired due to Fees

• Current Assignee: General Instrument Corporation (CommScope Holding Company, Inc.), Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: General Instrument Corporation (CommScope Holding Company, Inc.), Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Candelore, Brant, Larson, Erik N.
• Primary Examiner(s): HANTIS, KAREN
• Application Number:
  US09/111,806
• Time in Patent Office: 783 Days
• Field of Search: 235/492, 235/487-489, 235/437-438, 235/441, 235/380, 235/382, 257/678-679, 257/666, 257/691, 257/684, 257/688, 257/700, 361/679, 361/737, 361/728, 361/785-786, 361/820, 361/772-774, 361/807-810, 361/813, 340/825.54, 340/825.49
• US Class Current: 235/492
• CPC Class Codes: G06K 19/0702 the arrangement including a battery
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15173 : in a single layer of the multilayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01M 10/4257 : Smart batteries, e.g. electronic circuits inside the housing of the cells or batteries
• CPC Class Codes: H01M 10/48 : Accumulators combined with arrangements for measuring, testing or indicating the condition of cells, e.g. the level or density of the electrolyte constructional details of current conducting connections for detecting conditions inside cells or batteries, e.g. details of voltage sensing terminals, H01M50/569
• CPC Class Codes: H01M 50/216 : adapted for button or coin cells
• CPC Class Codes: Y02E 60/10 : Energy storage using batteries

Abstract

A chip-battery micro-module and fabrication method thereof wherein an integrated circuit "chip" is secured to a battery coin cell using various conductive and insulative layers that provide power to the chip while also forming a protective structure for protecting the chip. The chip-battery micro-module may be used to power an electronic accessory which is directly attached thereto, such as an LCD display or speaker, or to power a circuit in a smart card or electronic device such as a portable telephone. The chip may be secured to the battery using epoxy layers, epoxy bodies, dielectric layers, and plasma- or vapor-deposited layers. The above elements may be conductive or insulative as required. The chip-battery micro-module can be integrated into a plastic smart card. The use of the rigid battery coin cell provides the chip-battery micro-module with improved strength characteristics for withstanding loads and impacts during assembly and handling. Moreover, this protection can be extended to other components that are packaged with the chip as an assembly, such as electronic accessories. Furthermore, electromagnetic shielding and heat sink properties may be realized.

Claims

1. An integrated circuit chip package, comprising:

a coin cell battery having oppositely disposed anode and cathode surfaces;

an integrated circuit chip supported by one of said surfaces;

circuitry tor electrically coupling said anode and cathode surfaces to said integrated chip; and

a plurality of contact points provided within the perimeter of said battery for coupling said integrated circuit chip to an external circuit;

wherein the entire integrated circuit chip package, including said battery and chip, is substantially provided within the perimeter of said battery.

2. The package of claim 1, wherein the surfaces are substantially planar.

3. The package of claim 1, further comprising:

a deposited insulation layer on the surface which supports the chip;

a deposited conductive layer altitudinally away from the surface which supports the chip after said deposited insulation layer; and

means for electrically coupling said deposited conductive layer to one of said anode and cathode surfaces;

wherein;

said chip is secured to said deposited conductive layer altitudinally away from the surface which supports che hip after said deposited conductive layer.

4. The package of claim 3, further comprising:

an epoxy body encapsulating said chip, at least in part.

5. The package of claim 1, further comprising:

a conductive layer on the surface which supports the chip;

wherein said conductive layer is electrically coupled to said chip and to one of said anode and cathode surfaces.

6. The package of claim 5, wherein:

said conductive Layer comprises conductive epoxy.

7. The package of claim 5, wherein:

said chip is encapsulated, at least in part, in a non-conductive body.

8. The package of claim 5, wherein said circuitry comprises:

a first bond wire extending from said chip for electrically coupling said chip to said conductive layer and one of said anode and cathode surfaces.

9. The package of claim 8, wherein said circuitry comprises:

a second bond wire extending from said chip for electrically coupling said chip to the other of said anode and cathode surfaces.

10. The package of claim 5, further comprising:

a dielectric layer disposed altitudinally away from the surface which supports the chip after said conductive layer.

11. The package of claim 10, wherein:

said dielectric layer substantially surrounds said chip.

12. The package of claim 10, further comprising:

a bottom foil layer disposed between said conductive layer and said dielectric layer.

13. The package of claim 10, further comprising:

a top foil portion, including at least first and second electrically separated portions thereof, disposed altitudinally away from the surface which supports the chip after said dielectric layer.

14. The package of claim 13, wherein:

said first and second top foil portions are respective foil layers that extend over at least a portion of an area of the surface which supports the chip.

15. The package of claim 13, wherein:

said chip is secured to said first and second top foil portions altitudinally away from the surface which supports the chip after said first and second top foil portions.

16. The package of claim 13, wherein:

said chip is secured to said first and second top foil portions altitudinally away from the surface which supports the chip before said first and second top foil portions.

17. The package of claim 15, further comprising:

an epoxy body encapsulating said chip, at least in part.

18. The package of claim 13, further comprising:

at least one via extending in said dielectric layer for electrically coupling said first top foil portion to one of said anode and cathode surfaces.

19. The package of claim 18, further comprising:

means for electrically coupling said second top foil portion to the other of said anode and cathode surfaces.

20. The package of claim 19, wherein said means for electrically coupling comprises:

a flexible flap extending from said second top foil portion, and past said dielectric Layer toward said other of said anode and cathode surfaces.

21. The package of claim 20, further comprising:

a ring surrounding said battery for securing said flexible flap to said other of said anode and cathode surfaces.

22. The package of claim 13, wherein:

at least one of said first and second top foil portions are adapted to carry an electronic accessory thereon.

23. The package of claim 13, further comprising:

a second conductive layer on the surface which opposes the surface which supports the chip;

said second conductive layer electrically coupled to one of said anode and cathode surfaces;

a second dielectric layer disposed after said second conductive layer and altitudinally away from said surface which is opposing; and

a second top foil layer disposed after said second dielectric layer and altitudinally away from said surface which is opposing.

24. The package of claim 23, whereon:

said second top foil layer is adapted to carry art electronic accessory thereon.

25. The package of claim 23, further comprising:

a second bottom foil layer disposed between said second conductive layer and said second dielectric layer.

26. The package of claim 1, wherein:

the contact points are disposed altitudinally away from the surface which supports the chip after said chip; and

at least one of the contact points are electrically coupled to at least one of said anode and cathode surfaces.

27. The package of claim 1, wherein:

said contact points are orientation-less.

28. The package of claim 13, wherein:

the contact points are disposed altitudinally away from the surface which supports the chip after said chip;

the contact points are coupled to at least one of said anode and cathode contacts; and

said top foil portion is patterned according to said contact points.

29. The package of claim 28, wherein:

the contact points are orientation-less.

30. A smart card for use with the package of claim 1, comprising:

an electrical circuit; and

means for electrically coupling said contact points and at least one of said anode and cathode surfaces to said electrical circuit.

31. A smart card for use with the package of claim 1, comprising:

an electrical circuit; and

means for electrically coupling said chip to said electrical circuit to allow the communication of control signals therebetween.

32. A method for fabricating an integrated circuit chip package, comprising the steps of:

providing a coin cell battery having oppositely disposed anode and cathode surfaces;

supporting an integrated circuit c-hip on one of said surfaces;

electrically coupling said anode and cathode surfaces to said chip; and

providing a plurality of contact points within the perimeter of said battery for coupling said integrated circuit chip to an external circuit;

wherein the entire integrated circuit chip package, including said battery and chip, is substantially provided within the perimeter of said battery.

33. The method of claim 32, comprising the further steps of:

depositing an insulation layer on the surface which supports the chip;

depositing a conductive layer altitudinally away from the surface which supports the chip after said deposited insulation layer; and

electrically coupling said deposited conductive layer to one of said anode and cathode surfaces;

wherein;

said chip is secured to said deposited conductive layer altitudinally away from the surface which supports the chip after said deposited conductive layer.

34. The method of claim 33, comprising the further step of:

encapsulating said chip, at least in part, with an epoxy body.

35. The method of claim 32, comprising the further steps of:

providing a conductive layer on the surface which supports the chip; and

electrically coupling said conductive layer to said chip and to one of said anode and cathode surfaces.

36. The method of claim 35, wherein said electrically coupling step comprises the step of:

providing a first bond wire extending from said chip for electrically coupling said chip to said conductive layer and one of said anode and cathode surfaces.

37. The method of claim 36, wherein said electrically coupling step comprises the step of:

providing a second bond wire extending from said chip for electrically coupling said chip to the other of said anode and cathode surfaces.

38. The method of claim 35, comprising the further step of:

providing a dielectric layer disposed altitudinally away from the surface which supports the chip after said conductive layer.

39. The method of claim 38, comprising the further step of:

providing a bottom foil layer disposed between said conductive Layer and said dielectric layer.

40. The method of claim 38, comprising the further step of:

providing a top foil portion, including at least first and second electrically separated portions thereof, disposed altitudinally away from the surface which supports the chip after said di electric layer.

41. The method of claim 40, comprising the further step of:

securing said chip to said first and second top foil portions altitudinally away from the surface which supports the chip after said first and second top foil portions.

42. The method of claim 40, comprising the further step of:

securing said chip to said first and second top foil portions altitudinally away from the surface which supports the chip before said first and second top foil portions.

43. The method of claim 41, comprising the further step of:

encapsulating said chip, at least An part, with an epoxy body.

44. The method of claim 40, wherein said electrically coupling step comprises the step of:

providing at least one via in said dielectric layer for electrically coupling said first top foil portion to one of said anode and cathode surfaces.

45. The method of claim 40, comprising the further steps of:

providing a second conductive layer on a surface of said battery opposing the surface which supports the chip;

electrically coupling said second conductive layer to one of said anode and cathode surfaces;

providing a second dielectric layer disposed after said second conductive layer and altitudinally away from said surface which is opposing; and

providing a second top foil layer disposed after said second dielectric layer and altitudinally away from said surface which is opposing.

46. The method of claim 35, wherein:

the contact points are disposed altitudinally away from the surface which supports the chip after said chip; and

at least one of the contact points are electrically coupled to at least one of said anode and cathode surfaces.

47. The method of claim 32, wherein:

the contact points are orientation-less.

48. The method of claim 40, wherein:

the contact points are disposed altitudinally away from the surface which supports the chip after said chip;

the contact points are electrically coupled to at least one of said anode and cathode surfaces; and

the top foil portion is patterned according to said contact points.

49. The method of claim 48, wherein:

said contact points are orientation-less.

50. The method of claim 46, comprising the further steps of:

securing said package in a smart card; and

electrically coupling said contact points and at least one of said anode and cathode surfaces to an electrical circuit in said smart card.

51. The method of claim 32, comprising the further steps of:

securing said package in a smart card; and

electrically coupling said chip to an electrical circuit in said smart card to allow the communication of control signals therebetween.

52. The method of claim 32, comprising the further steps of:

securing said package in a smart card; and

electrically coupling said contact points and at least one of said anode and cathode surfaces to an electrical circuit of said smart card.