Prevention of ground fault interrupts in a semiconductor processing system

• US 6,110,322 A
• Filed: 03/06/1998
• Issued: 08/29/2000
• Est. Priority Date: 03/06/1998
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Nguyen, Hanh D., Teoh, Hong Bee, Nguyen, Cuong C., Chen, James Jin-Long
• Primary Examiner(s): DANG, THI D
• Application Number:
  US09/036,536
• Time in Patent Office: 907 Days
• Field of Search: 156/345, 438/715, 118/725, 118/723 E, 219/482, 219/268, 219/385, 219/457, 216/71
• US Class Current: 156/345.52
• CPC Class Codes: C23C 16/4586 Elements in the interior of the support, e.g. electrodes, heating or cooling devices
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins
• CPC Class Codes: H01L 21/68785 characterised by the mechanical construction of the susceptor, stage or support

Abstract

A pedestal heating system provided for heating a pedestal disposed in the processing chamber of a substrate processing system. A pedestal heating system according to the present invention includes: a heater power supply, a transformer, coupled to the heater power supply, a heater element coupled to the transformer, and an RF ground electrode. The transformer is configured to reduce leakage current from the heater element to various elements of the substrate processing system by localizing current leakage loops. The heater element and RF ground electrode are disposed within the pedestal. Preferably, the transformer is simply an isolation transformer. Where an RF energy source is used, such as in a plasma CVD processing system, an EMI filter may be coupled between the transformer and the heater element, or at another point in the power supply chain to prevent feed-through of RF energy to other of the substrate processing system'"'"'s subsystems, or other sensitive electronic circuitry coupled to the facility'"'"'s power supply.

Claims

1. A pedestal heating system configured to heat a pedestal disposed in a processing chamber of a substrate processing system, comprising:

a heater power supply;

an isolation transformer, coupled to said heater power supply;

a heater element, disposed within the pedestal and coupled to said isolation transformer, wherein said isolation transformer is configured to reduce leakage current from said heater element to a chamber wall of said processing chamber.

2. The system of claim 1, wherein said isolation transformer is configured as a 1:

1 isolation transformer.

3. A pedestal heating system configured to heat a pedestal disposed in a processing chamber of a substrate processing system, comprising:

a heater power supply;

a transformer coupled to said heater power supply;

a heater element, disposed within the pedestal and coupled to said transformer, wherein said transformer is configured to reduce leakage current from said heater element to a chamber wall of said processing chamber;

an RF energy source;

an RF electrode, coupled to said RF energy source, and disposed within the processing chamber;

an RF ground electrode, disposed within the pedestal; and

a filter, coupled between said transformer and said heater element, and configured to reduce feedthrough of RF energy from said RF energy source through said transformer.

4. The system of claim 3, wherein said filter is an electromagnetic interference filter.

5. The system of claim 3, wherein said filter is coupled between said heater power supply and said transformer.

6. The system of claim 3, wherein said apparatus further comprises:

a facility power supply, coupled to said heater power supply, wherein said filter is coupled between said facility power supply and said heater power supply.

7. The system of claim 6, wherein said filter is coupled between said facility power supply and a plurality of heater power supplies, each one of said heater power supplies being disposed in one of a plurality of substrate processing systems.

8. A pedestal heating system configured to heat a pedestal disposed in a processing chamber of a substrate processing system, comprising:

a heater power supply;

a transformer coupled to said heater power supply;

a heater element, disposed within the pedestal and coupled to said transformer. wherein said transformer is configured to reduce leakage current from said heater element to a chamber wall of said processing chamber;

wherein a material of the pedestal is ceramic.

9. The system of claim 8, wherein a material of the pedestal is 95% aluminum nitride.

10. The system of claim 8, wherein a material of the pedestal is 99.9% aluminum nitride.

11. A pedestal heating system configured to heat a pedestal disposed in a processing chamber of a substrate processing system, comprising:

a heater power supply;

a transformer, coupled to said heater power supply;

a heater element, disposed within the pedestal and coupled to said transformer; and

an RF ground electrode, disposed within the pedestal, wherein said transformer is configured to reduce leakage current from said heater element to said RF ground electrode.

12. The system of claim 11, wherein said transformer is further configured to localize a current leakage loop to said heater element.

13. The system of claim 11, wherein said transformer is configured as a 1:

1 transformer.

14. The system of claim 11, wherein said apparatus further comprises:

an RF energy source;

an RF electrode, coupled to said RF energy source, and disposed within the processing chamber;

a filter, coupled between said transformer and said heater element, and configured to reduce feedthrough of RF energy from said RF energy source through said transformer.

15. The system of claim 14, wherein said filter is an electromagnetic interference filter.

16. The system of claim 14, wherein said filter is coupled between said heater power supply and said transformer.

17. The system of claim 14, wherein said apparatus further comprises:

a facility power supply, coupled to said heater power supply, wherein said filter is coupled between said facility power supply and said heater power supply.

18. The system of claim 17, wherein said filter is coupled between said facility power supply and a plurality of heater power supplies, each one of said heater power supplies being disposed in one of a plurality of substrate processing systems.

19. The system of claim 11, wherein a material of the pedestal is ceramic.

20. A method for preventing ground fault interrupts in a substrate processing system, the substrate processing system having a pedestal and RF electrode disposed in a processing chamber thereof, comprising the steps of:

isolating a heater element disposed in the pedestal from a heater power supply of the substrate processing system by coupling an isolation transformer between said heater element and said heater power supply; and

isolating an RF power supply from said heater power supply by coupling an electromagnetic filter between said transformer and said heater element, wherein said RF power supply is coupled to said RF electrode.