Article comprising molded circuit

• US 6,110,576 A
• Filed: 10/16/1998
• Issued: 08/29/2000
• Est. Priority Date: 10/16/1998
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Weld, John D., Decker, Robert L.
• Primary Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US09/173,502
• Time in Patent Office: 683 Days
• Field of Search: 428/425.9, 428/300.1, 428/300.7, 428/301.1, 428/301.4, 428/412-414, 428/901, 174/257, 174/258, 174/255, 361/792, 361/794, 361/795, 361/780
• US Class Current: 428/300.1
• CPC Class Codes: B29C 2045/169 injecting electrical circuits, e.g. one layer being made of conductive material
• CPC Class Codes: B29C 45/16 Making multilayered or multicoloured articles B29C45/0062 takes precedence; feeding colouring materials into the injection unit B29C45/1816
• CPC Class Codes: B29C 45/1642 having a "sandwich" structure B29C45/1603 takes precedence
• CPC Class Codes: B29K 2995/0005 Conductive
• CPC Class Codes: B29K 2995/0007 Insulating
• CPC Class Codes: B32B 2262/106 Carbon fibres, e.g. graphite fibres
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/206 Insulating
• CPC Class Codes: B32B 2457/08 PCBs, i.e. printed circuit boards
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/18 characterised by the use of special additives
• CPC Class Codes: B32B 7/02 Physical, chemical or physicochemical properties
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0281 Conductive fibers
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2203/0113 Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/101 by casting or moulding of conductive material
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: Y10S 428/901 : Printed circuit
• CPC Class Codes: Y10T 428/249948 : Fiber is precoated
• CPC Class Codes: Y10T 428/24995 : Two or more layers
• CPC Class Codes: Y10T 428/249951 : Including a free metal or alloy constituent
• CPC Class Codes: Y10T 428/31507 : Of polycarbonate
• CPC Class Codes: Y10T 428/31511 : Of epoxy ether
• CPC Class Codes: Y10T 428/31515 : As intermediate layer
• CPC Class Codes: Y10T 428/31609 : Particulate metal or metal compound-containing

Abstract

An article comprising a molded circuit for providing a path for electrical current is disclosed. The molded circuit is formed of a first material layer and a second material layer. The first material layer is an electrically insulating material. The second material layer is an electrically conductive material. In an alternate embodiment, the second material layer is surrounded between two layers of the first material layer. The molded circuit can be formed using multi-material injection molding such as co-injection molding or two-shot injection molding. A printed circuit board can comprise the molded circuit.

Claims

1. A molded circuit comprising:

at least a first thermoplastic polymeric material layer and a second thermoplastic polymeric material layer;

said first thermoplastic polymeric material layer is an electrically insulating material having a volume resistivity of greater than about 10¹³ ohm-centimeter; and

said second thermoplastic polymeric material layer is an electrically conductive material having a volume resistivity of less than about 2.0 ohm-centimeter, said second thermoplastic polymeric material layer has a composition in which conductive fibers are suspended within a thermoplastic polymeric material, said conductive fibers are present in an amount of at least about 6% by weight and no greater than about 25% by weight of said thermoplastic polymeric material and said fibers have an aspect ratio in the range of about 100;

1 to about 2000;

1,

wherein said second thermoplastic polymeric material layer provides a path for an electrical current in said molded circuit.

2. The molded circuit of claim 1 wherein said first thermoplastic polymeric material layer has a surface resistivity of greater than about 10¹² ohms/square and said second thermoplastic polymeric material has a surface resistivity of less than about 10 ohms/square.

3. The molded circuit of claim 1 further comprising:

a third thermoplastic polymeric material layer,

said third thermoplastic polymeric material layer is formed of an electrically insulating material having a volume resistivity within the range of said first thermoplastic polymeric material layer and wherein said second thermoplastic polymeric material layer is sandwiched between said first thermoplastic polymeric material layer and said third thermoplastic polymeric material layer.

4. The molded circuit of claim 3 wherein said first thermoplastic polymeric material layer or said third thermoplastic polymeric material layer has an opening to provide access to said second thermoplastic polymeric material layer.

5. The molded circuit of claim 1 wherein said first thermoplastic polymeric material layer is selected from the group consisting of acrylonitrile-butadiene styrene (ABS), polycarbonate (PC), PC/ABS blends, polyamide nylon (PA), polyether imide (PEI), polyphenylene sulfide (PPS), polyvinylacetate (PVA), polyethylene (PE), polypropylene (PP), polyvinylchloride (PVC) and polyvinylpyrolidone (PVP).

6. The molded circuit of claim 1 wherein said conductive fibers have an aspect ratio in the range of about 780:

1 to about 820;

1 and said conductive fibers are present in an amount of about 10% to about 20% by weight of said thermoplastic polymeric material.

7. The molded circuit of claim 1 wherein said thermoplastic polymeric material of said second thermoplastic material layer is selected from the group consisting of acrylonitrile-butadiene styrene (ABS), polycarbonate (PC), PC/ABS blends, polyamide nylon (PA), polyether imide (PEI), polyphenylene sulfide (PPS), polyvinylacetate (PVA), polyethylene (PE), polypropylene (PP), polyvinylchloride (PVC) and polyvinylpyrolidone (PVP).

8. The molded circuit of claim 1 wherein said conductive fibers are selected from the group consisting of nickel-coated graphite (NiCG), nickel copper-coated graphite (NiCuCG) fibers, nickel copper nickel-coated graphite (NiCuNiCG) fibers, nickel-coated copper (NiCCu) fibers, stainless steel (SS) fibers, and copper plated stainless steel (CuCSS) fibers.

9. The molded circuit of claim 1 wherein the molded circuit is formed using co-injection molding.

10. The molded circuit of claim 1 wherein the molded circuit is formed using multi-shot injection molding.

11. The molded circuit of claim 1 wherein said second thermoplastic polymeric material layer is a ground plane layer.

12. The molded circuit of claim 1 wherein said second thermoplastic polymeric material layer is a power plane layer.

13. The molded circuit of claim 1 wherein said second thermoplastic polymeric material layer is a signal line interconnection layer.

14. An article comprising the molded circuit of claim 1.

15. The article of claim 14 wherein said article forms a printed circuit board.

16. The article of claim 15 further comprising a plurality of said second thermoplastic polymeric material layers and a plurality of said first thermoplastic polymeric material layers wherein:

a first of said second thermoplastic polymeric material layers is a first signal line interconnection layer;

a second of said second thermoplastic polymeric material layers is a power plane layer;

a third of said second thermoplastic polymeric material layers is a ground plane layer;

a fourth of said second thermoplastic polymeric material layers is a second signal line interconnection layer; and

each of said plurality of first thermoplastic polymeric material layers is molded between adjacent ones of said plurality of second thermoplastic polymeric material layers.

17. The article of claim 16 wherein said first signal line interconnection layer is connected to said second signal line interconnection layer with said second thermoplastic polymeric material.

18. A molded circuit comprising:

at least a first thermoplastic polymeric material layer and a second thermoplastic polymeric material layer;

said first thermoplastic polymeric material layer is an electrically insulating material having a volume resistivity of greater than about 10¹³ ohm-centimeter; and

said second thermoplastic polymeric material layer is an electrically conductive material having a volume resistivity of less than about 2.0 ohm-centimeter,

wherein said second thermoplastic polymeric material layer provides a path for an electrical current in said molded circuit and is formed using multi-shot injection molding.