Method for forming an ohmic electrode
First Claim
1. A method for forming an ohmic electrode, comprising the steps of:
- forming an insulator film on a surface of a substrate made of silicon carbide, the insulator film having an opening through which the surface of the substrate is exposed;
depositing a metal film in the opening on the substrate; and
forming an ohmic electrode of the metal film by heating the metal film through irradiation of laser light onto the substrate and thereby forming an ohmic contact between the metal film and the substrate.
1 Assignment
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Accused Products
Abstract
A first metal film and a second metal film, both of which are made of Ni or the like, are deposited on the upper surface of a substrate made of SiC. In such a state, the interface between the first metal film and the substrate and the interface between the second metal film and the substrate both form a Schottky contact. Next, laser light is irradiated from above the upper surface of the substrate only onto the first metal film on the substrate after the diameter of the top end of the laser light has been reduced. Thus, since the metal-semiconductor interface between the first metal film and the substrate is turned into an alloy owing to the energy of the laser light without heating the entire substrate, an ohmic contact can be formed in the interface between the first metal film and the substrate. As a result, an ohmic electrode can be constituted by the first metal film.
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Citations
1 Claim
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1. A method for forming an ohmic electrode, comprising the steps of:
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forming an insulator film on a surface of a substrate made of silicon carbide, the insulator film having an opening through which the surface of the substrate is exposed; depositing a metal film in the opening on the substrate; and forming an ohmic electrode of the metal film by heating the metal film through irradiation of laser light onto the substrate and thereby forming an ohmic contact between the metal film and the substrate.
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Specification