Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing

• US 6,111,634 A
• Filed: 05/28/1997
• Issued: 08/29/2000
• Est. Priority Date: 05/28/1997
• Status: Expired due to Term

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Fielden, John, LaComb, Lloyd J. Jr., Chadda, Saket, Jairath, Rahul, Krusell, Wilbur C., Pecen, Jiri
• Primary Examiner(s): EVANS, FANNIE L
• Application Number:
  US08/863,644
• Time in Patent Office: 1,189 Days
• Field of Search: 356/72, 356/381, 356/382, 250/559.27, 250/559.28
• US Class Current: 356/72
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 49/04 involving measurement of the workpiece at the place of grinding during grinding operation
• CPC Class Codes: B24D 7/12 with apertures for inspecting the surface to be abraded
• CPC Class Codes: G01B 11/0683 measurement during deposition or removal of the layer
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

A method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical mechanical polishing (CMP) of a substrate using a polishing tool and a film thickness monitor. The tool has an opening placed in it. The opening contains a monitoring window secured in it to create a monitoring channel. A film thickness monitor views the substrate through the monitoring channel to provide an indication of the thickness of a film carried by the substrate. This information can be used to determine the end point of the CMP process, determine removal rate at any given circumference of a substrate, determine average removal rate across a substrate surface, determine removal rate variation across a substrate surface, and optimize removal rate and uniformity. The film thickness monitor comprises a spectrometer.

Claims

1. In a chemical mechanical polishing device of the type comprising:

a polishing element, means for moving the polishing element along a polishing path, and a substrate carrier positioned adjacent the polishing element to press a substrate against the polishing element during a polishing operation;

the improvement comprising;

said polishing element having at least one opening formed therein, said opening positioned to move into intermittent alignment with the substrate during the polishing operation;

said polishing element further comprising a monitoring window secured to the polishing element to close the opening and to create a monitoring channel in the polishing element; and

said device further comprising a film thickness monitor, said film thickness monitor comprising a multi-wavelength spectrometer responsive to at least two wavelengths of optical radiation reflected from the substrate through the monitoring channel during the polishing operation to provide an indication of thickness of a film carried by the substrate.

2. The invention of claim 1, wherein the substrate carrier moves along a closed path.

3. The invention of claim 1 or 2, wherein the film thickness monitor comprises a light source operative to illuminate the substrate via the monitoring channel with at least two wavelengths of optical radiation during the polishing operation.

4. The invention of claim 1 or 2, wherein the film thickness monitor comprises a light source and is operative to generate at least two wavelengths of optical radiation between about 300 nm and 1,000 nm.

5. The invention of claim 1 wherein the moving means comprises a plurality of rollers operative to drive the polishing element in a linear path past the substrate.

6. The invention of claim 5, wherein the film thickness monitor further comprises a sensor for detecting when the monitoring window in the polishing element is in alignment with the film thickness monitor.

7. The invention of claim 1, wherein the moving means comprises a platen rotating about an axis that passes through its center operative to drive the polishing element in a curved path past the substrate.

8. The invention of claim 1, wherein the moving means comprises a platen rotating about an axis that does not pass through its center operative to drive the polishing element in a curved path past the substrate.

9. The invention of claim 1, wherein the moving means comprises a platen moving along a closed path operative to drive the polishing element in a curved path past the substrate.

10. The invention of claim 1, wherein the film thickness monitor comprises:

(a) a light source;

(b) a light sensitive detector for monitoring an intensity from the light source;

(c) a spectrometer that dispenses light into multiple wavelengths that are detected by multiple detectors; and

(d) a data processing element for processing signals from the spectrometer and estimating a thickness of a film on a substrate.

11. The invention of claim 10, wherein the light source is a flash lamp emitting optical radiation synchronous with a moving substrate.

12. The invention of claim 10, wherein the light source is a substantially continuously operating light source and wherein the invention further comprises a shutter operating synchronously with a moving substrate in order to output light when the substrate is positioned over the light source.

13. The invention of claim 10, wherein the light sensitive detector is a spectrometer.

14. A method for determining thickness of a layer on a substrate during chemical-mechanical polishing, the method comprising the steps of:

(a) performing chemical-mechanical polishing on a substrate

(b) illuminating the substrate with at least two wavelengths of optical radiation during step (a);

(c) using a multi-wavelength spectrometer to receive said at least two wavelengths of optical radiation after being reflected from the substrate; and

(d) determining the thickness of a film carried by the substrate from said at least two wavelengths of optical radiation received in step (c).

15. A method for determining an end point of a chemical-mechanical polishing process, the method comprising the steps of:

(a) illuminating a substrate with at least two wavelengths of optical radiation during chemical-mechanical polishing of the substrate;

(b) using a multi-wavelength spectrometer to receive said at least two wavelengths of optical radiation after being reflected from the substrate;

(c) determining a thickness of a film carried by the substrate from said at least two wavelengths of optical radiation received in step (b); and

(d) indicating that end point has been reached in response to the film thickness determined in step (c) reaching a predefined thickness.

16. The invention of claim 15 further comprising the step of terminating the chemical-mechanical polishing process when the film thickness reaches a predefined thickness.

17. A method for determining removal rate per polishing element revolution at any given circumference of a substrate while performing a chemical-mechanical polishing process, the method comprising the steps of:

(a) measuring a first film thickness of a substrate during a chemical-mechanical polishing process when a monitoring channel in a polishing element aligns with a film thickness monitor comprising a spectrometer; and

then

(b) measuring a second film thickness of a substrate during a chemical-mechanical polishing process when the monitoring channel in a polishing element realigns with the film thickness monitor comprising a spectrometer; and

then

(c) calculating a difference between the second film thickness and the first film thickness.

18. A method for determining average removal rate per polishing element revolution across a substrate surface while performing a chemical-mechanical polishing process, the method comprising the steps of:

(a) measuring a first film thickness of a substrate during a chemical-mechanical polishing process when a first monitoring channel in a polishing element aligns with a first film thickness monitor comprising a spectrometer; and

then

(b) measuring a second film thickness of a substrate during a chemical-mechanical polishing process when the first monitoring channel in a polishing element realigns with the first film thickness monitor comprising a spectrometer; and

then

(c) measuring a third film thickness of a substrate during a chemical-mechanical polishing process when a second monitoring channel in a polishing element aligns with a second film thickness monitor comprising a spectrometer; and

then

(d) measuring a fourth film thickness of a substrate during a chemical-mechanical polishing process when the second monitoring channel in a polishing element realigns with the second film thickness monitor comprising a spectrometer; and

then

(e) calculating a difference between the second film thickness of step (b) and the first film thickness of step (a); and

(f) calculating a difference between the fourth film thickness of step (d) and the third film thickness of step (c); and

then

(g) calculating an average of the differences of steps (e) and (f).

19. A method for determining removal rate variation per polishing element revolution across a substrate surface while performing a chemical-mechanical polishing process, the method comprising the steps of:

(a) measuring a first film thickness of a substrate during a chemical-mechanical polishing process when a first monitoring channel in a polishing element aligns with a first film thickness monitor comprising a spectrometer; and

then

(b) measuring a second film thickness of a substrate during a chemical-mechanical polishing process when the first monitoring channel in a polishing element realigns with the first film thickness monitor comprising a spectrometer; and

then

(c) measuring a third film thickness of a substrate during a chemical-mechanical polishing process when a second monitoring channel in a polishing element aligns with a second film thickness monitor comprising a spectrometer; and

then

(d) measuring a fourth film thickness of a substrate during a chemical-mechanical polishing process when the second monitoring channel in a polishing element realigns with the second film thickness monitor comprising a spectrometer; and

then

(e) calculating a difference between the second film thickness of step (b) and the first film thickness of step (a); and

(f) calculating a difference between the fourth film thickness of step (d) and the third film thickness of step (c); and

then

(g) calculating a variation of the differences of steps (e) and (f).

20. A method of optimizing a chemical-mechanical polishing process comprising the steps of:

(a) illuminating a substrate with at least two wavelengths of optical radiation;

(b) using a multi-wavelength spectrometer to receive said at least two wavelengths of optical radiation after being reflected from the substrate,

(c) determining a removal rate of a film carried by the substrate from said at least two wavelengths of optical radiation received in step (b); and

then

(d) adjusting polishing process parameters to optimize the removal rate.

21. The invention of claim 20 further comprising the steps of:

(e) determining removal rate variation; and

then

(f) adjusting polishing process parameters to optimize uniformity.