3-D laser patterning process utilizing horizontal and vertical patterning
First Claim
1. A three-dimensional patterning process, comprising:
- depositing at least one metal layer on a surface to be patterned,isotropically depositing a layer of photoresist on vertical and horizontal surfaces of the thus deposited metal layer,patterning the photoresist on vertical and horizontal surface areas using a directed light source,developing the thus patterned areas of the photoresist to expose metal in the patterned areas,processing exposed metal in the patterned areas by a technique selected from a group consisting of etching the metal and plating the metal,stripping the remaining photoresist, andremoving any of the unprocessed remainder of the metal layer.
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Accused Products
Abstract
A process which vastly improves the 3-D patterning capability of laser pantography (computer controlled laser direct-write patterning). The process uses commercially available electrodeposited photoresist (EDPR) to pattern 3-D surfaces. The EDPR covers the surface of a metal layer conformally, coating the vertical as well as horizontal surfaces. A laser pantograph then patterns the EDPR, which is subsequently developed in a standard, commercially available developer, leaving patterned trench areas in the EDPR. The metal layer thereunder is now exposed in the trench areas and masked in others, and thereafter can be etched to form the desired pattern (subtractive process), or can be plated with metal (additive process), followed by a resist stripping, and removal of the remaining field metal (additive process). This improved laser pantograph process is simpler, faster, move manufacturable, and requires no micro-machining.
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Citations
28 Claims
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1. A three-dimensional patterning process, comprising:
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depositing at least one metal layer on a surface to be patterned, isotropically depositing a layer of photoresist on vertical and horizontal surfaces of the thus deposited metal layer, patterning the photoresist on vertical and horizontal surface areas using a directed light source, developing the thus patterned areas of the photoresist to expose metal in the patterned areas, processing exposed metal in the patterned areas by a technique selected from a group consisting of etching the metal and plating the metal, stripping the remaining photoresist, and removing any of the unprocessed remainder of the metal layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A process for interconnecting IC chips to a substrate via sidewall patterning, comprising:
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attaching the chip to the substrate utilizing an adhesive, and forming a fillet at the region of connection following attaching the chip to the substrate. - View Dependent Claims (15, 16)
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17. A process for 3-D laser patterning, comprising:
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sputtering an adhesion layer on a surface of a substrate, depositing a film seed layer on the adhesive surface, and carrying out a subtractive process or an additive process on horizontal and vertical surfaces of the film seed layer following depositing the film seed layer. - View Dependent Claims (18, 19)
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20. A three dimensional patterning process, comprising:
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isotropic deposition of a photodefinable layer on both vertical and horizontal areas of a surface, patterning at least one area on the layer by exposure of the photodefinable layer to a directed light source, developing the thus patterned areas to form exposed material processing the exposed material under the patterned areas, and stripping the remaining photodefinable layer. - View Dependent Claims (21, 22, 23, 24, 25)
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26. A three dimensional patterning process comprising;
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depositing at least one seed layer on vertical and horizontal areas of a surface to be patterned, isotropic deposition of a photodefinable layer on the seed layer, exposing material under patterned horizontal and vertical areas of the layer, developing the patterned areas, processing the exposed material, stripping the remaining photodefinable layer, and removing any remainder of the seed layer. - View Dependent Claims (27, 28)
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Specification