Device for the encapsulated reception of a material

• US 6,114,658 A
• Filed: 01/04/1999
• Issued: 09/05/2000
• Est. Priority Date: 03/15/1996
• Status: Expired due to Term

• Current Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Original Assignee: Fraunhofer Gesellschaft Zur Foerderung Der Angewandten Forsching E.V.
• Inventors: Trankler, Hans-Rolf, Roth, Mathias, Endres, Hanns-Erik
• Primary Examiner(s): Walberg, Teresa
• Assistant Examiner(s): DAHBOUR, HENRY
• Application Number:
  US09/142,634
• Time in Patent Office: 610 Days
• Field of Search: 219/201, 219/209, 219/210, 219/385, 219/521, 219/543, 219/544, 219/546, 219/552, 338/306, 338/307, 338/308, 338/309, 338/34, 338/35, 73/204.11, 73/204.16, 73/204.17, 73/204.23, 73/204.25, 73/204.26, 430/315, 257/253
• US Class Current: 219/209
• CPC Class Codes: B01L 2300/0663 Whole sensors
• CPC Class Codes: B01L 2400/0677 phase change valves; Meltable, freezing, dissolvable plugs; Destructible barriers
• CPC Class Codes: B01L 3/502738 characterised by integrated valves microvalves F16K99/0001
• CPC Class Codes: G01N 2035/00237 Handling microquantities of analyte, e.g. microvalves, capillary networks

Abstract

An encapsulating device having a material encapsulated therein comprises aasic body provided with a recess for receiving therein the material and formed by microsystem technology in such a way that the material is fully arranged within the recess. A diaphragm extends across the basic body and is implemented in microsystem or thin-film technology. The diaphragm is used for encapsulating the material in the recess of the basic body in such a way that the diaphragm extends in spaced relationship with the material. An electrically actuable heating means is provided for destroying the diaphragm so as to expose the material.

Claims

1. An encapsulating device having a material encapsulated therein, said encapsulating device comprising the following features:

a basic body formed by microsystem technology and provided with a recess for receiving therein the material in such a way that the whole material is arranged within said recess in spaced relationship with the face of the basic body in which an opening of said recess is formed;

a diaphragm implemented in microsystem or thin-film technology and extending across said basic body and said opening of said recess such that the material is encapsulated in said recess of the basic body in such a way that the diaphragm extends in spaced relationship with said material; and

a electrically actuable heating means for destroying said diaphragm so as to expose the material.

2. A device according to claim 1, wherein said basic body (1, 4) comprises a sensor component (1, 2, 3) on which the material is arranged in the form of an indicator material.

3. A device according to claim 2, wherein the sensor component comprises a support material (1, 2), a sensor structure (2, 3) and a layer of indicator material (6) covering said sensor structure at least partially.

4. A device according to claim 2 or 3, wherein said basic body (1, 4) includes a diaphragm support structure (4) which encloses the sensitive area of the sensor component (2, 3) covered with said indicator material (6) and which supports the diaphragm (5) on the side facing away from the sensor component (2, 3).

5. A device according to one of the claims 2 to 4, wherein the sensor component (1-3) and the indicator material (6) form together a gas sensor.

6. A sensor array comprising a plurality of devices according to one of the claims 2 to 5, which are formed on a common support material (1).