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Device for electrically contacting a floating semiconductor wafer having an insulating film

  • US 6,114,865 A
  • Filed: 04/21/1999
  • Issued: 09/05/2000
  • Est. Priority Date: 04/21/1999
  • Status: Expired due to Fees
First Claim
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1. A device for electrically contacting a semiconductor substrate having an insulating film disposed over at least a portion of the semiconductor substrate, the device comprising:

  • a chuck having a wafer support surface which holds the wafer;

    a scriber movably attached to the chuck, the scriber configured to produce a perforation through the insulating film; and

    an electrically conductive probe electrically contacting ground and movably attached to the chuck, the conductive probe configured to contact the semiconductor substrate through the perforation.

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