Inductive component and inductive component assembly

• US 6,114,932 A
• Filed: 12/12/1997
• Issued: 09/05/2000
• Est. Priority Date: 12/12/1997
• Status: Expired due to Term

• Current Assignee: Telefonaktiebolaget LM Ericsson
• Original Assignee: Telefonaktiebolaget LM Ericsson
• Inventors: Ohrn, Jan, Wester, Henrik, Ferm, Per
• Primary Examiner(s): Kozma, Thomas J.
• Application Number:
  US08/990,005
• Time in Patent Office: 998 Days
• Field of Search: 336/65, 336/68, 336/83, 336/200, 336/232, 336/223, 336/192
• US Class Current: 336/65
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 2017/046 helical coil made of flat wire, e.g. with smaller extension of wire cross section in the direction of the longitudinal axis
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances

Abstract

An inductive component including a primary coil having first and second terminals, and a secondary coil including a coil substrate, wiring patterns, and conductive terminals. The coil substrate is provided with alignment recesses for receiving and locating the first and second terminals of the primary coil in a fixed relationship to each other and to the conductive terminals of the secondary coil and an inductive component assembly having the inductive component is mounted outside a periphery of a substrate. A magnetic core of the inductive component has a central portion which is displaced off an edge of the magnetic core and has bevelled edges at a base of the central portion of the magnetic core. Terminals of both the primary coil and the secondary coil are located close together on the same side of the inductive component to reduce thermal stress.

Claims

1. An inductive component, comprising:

a primary coil wound from a conductive material and having first and second terminals extending from one edge thereof at a first side of said inductive component for electrical connection to circuitry supported on a substrate;

a secondary coil including a coil substrate, wiring patterns formed on said coil substrate, an conductive terminals extending from one edge of said coil substrate at the first side of said inductive component and connecting said wiring patterns to the circuitry supported on the substrate; and

a magnetic core for supporting said primary coil and said secondary coil in a magnetically coupled relationship;

said coil substrate being provided with alignment recesses receiving and locating said first and second terminals of said primary coil in a fixed relationship to each other and to said conductive terminals of said secondary coil.

2. The inductive component of claim 1, said magnetic core including a central portion, having a bevelled edge at a base thereof to increase flux transfer of said magnetic core.

3. The inductive component of claim 2, wherein the bevelled edge forms a fillet at a base of said central portion.

4. The induction component of claim 1, wherein the magnetic core is provided with an annular recess surrounding the central portion receiving said primary and secondary coils, said magnetic core having one edge thereof intersecting the recess to provide an opening to receive the first and second terminals of said primary coil and the conductive terminals of said secondary coil;

the distance between said one edge and said central portion being sufficient to increase flux transfer.

5. The inductive component of claim 1, wherein said primary coil is a flat coil.

6. The inductive component of claim 1, further comprising a top portion, wherein said magnetic core and said top portion substantially enclose said primary coil and said secondary coil.

7. The inductive component of claim 6, wherein said magnetic core and said top portion are glued, taped or clipped together.

8. The inductive component of claim 1, wherein said inductive component is mounted on the substrate.

9. The inductive component of claim 1, wherein said first and second terminals of said primary coil and said conductive terminals of said secondary coil are connected to circuitry supported on the substrate at substantially adjacent locations thereon to reduce thermal stress caused by differential thermal expansion of said primary and secondary coils and the substrate.

10. The inductive component of claim 1, wherein the substrate is at least one of a printed circuit board and a ceramic substrate.

11. The inductive component of claim 1, wherein said inductive component and the substrate are both mounted on a support.

12. The inductive component of claim 11, wherein said inductive component is mounted outside a periphery of the substrate to increase thermal transfer between said inductive component and the support.

13. The inductive component of claim 11, wherein the support is made of aluminum and is part of a housing for said inductive component.

14. The inductive component of claim 1, wherein said secondary coil acts as a sensing coil to sense a current or voltage within said primary coil.

15. The inductive component of claim 14, wherein said secondary coil provides feedback to control operation of a circuit connected to said primary coil.

16. The inductive component of claim 1, wherein said inductive component is part of a power supply.

17. The inductive component of claim 16, wherein the power supply is part of a base station for a cellular telephone.

18. The inductive component of claim 1 wherein said inductive component is part of a inductive component assembly further comprising:

a substrate; and

a support supporting both said substrate and said inductive component with said inductive component being mounted outside a periphery of said substrate to reduce an overall thickness of said inductive component assembly.

19. The inductive component of claim 18, wherein said inductive component is mounted directly on said support.

20. The inductive component of claim 19, wherein mounting said inductive component on said support increases thermal transfer between said inductive component and said support.

21. The inductive component of claim 20, said first and second primary coil terminals being connected to circuitry on said substrate at substantially adjacent locations thereon to reduce thermal stress caused by differential thermal expansion of said primary and secondary coils and said substrate.