RF tag having strain relieved stiff substrate and hydrostatic protection for a chip mounted thereto
First Claim
1. An RF tag for inclusion in a smart label, comprising:
- a stiff substrate sized and dimensioned to be received in the smart label wherein selected portions of the substrate are formed to provide strain relief for the substrate in at least one direction;
an antenna carried by the substrate; and
an integrated circuit having a memory circuit carried by the substrate and coupled to the antenna by at least one bonding wire.
1 Assignment
0 Petitions
Accused Products
Abstract
An RF tag for inclusion in a smart label comprises a stiff substrate sized to be received in the smart label, an antenna carried by the substrate and an integrated circuit having a memory circuit carried by the substrate and coupled to the antenna by wire bonding. The substrate may be strain relieved, for example, by forming a pair of generally opposed serpentine edges on the substrate, or forming a plurality of grooves in at least one surface of the substrate. A smart label comprises the RF tag between a face sheet and an adhesive. A release liner may cover the adhesive. A compressably deformable material having a low viscoelastic modulus is received between the first surface of the substrate and the face sheet partially surrounding the circuit structure and wire bonds to hydrostatically protect against damage. A film layer with a blister may envelop the low viscoelastic modulus material.
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Citations
36 Claims
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1. An RF tag for inclusion in a smart label, comprising:
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a stiff substrate sized and dimensioned to be received in the smart label wherein selected portions of the substrate are formed to provide strain relief for the substrate in at least one direction; an antenna carried by the substrate; and an integrated circuit having a memory circuit carried by the substrate and coupled to the antenna by at least one bonding wire. - View Dependent Claims (2, 3, 4, 5)
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6. A smart label, comprising:
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a stiff strain relieved substrate; an antenna carried by the substrate; an integrated circuit having a memory circuit carried by the substrate and coupled to the antenna; a face sheet disposed over a first surface of the substrate; and and adhesive disposed over a second surface of the substrate. - View Dependent Claims (7)
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8. A substrate for forming an RF tag, comprising:
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a stiff substrate sized and dimensioned to be received in a smart label; and a number of strain relief structures formed into the substrate. - View Dependent Claims (9, 10, 11, 16)
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12. A method of forming an RF tag for inclusion in a smart label, comprising:
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dimensioning a stiff substrate to be received in the smart label; strain relieving the substrate; forming an antenna on a first surface of the stiff substrate; locating a circuit structure including a memory circuit on the stiff substrate; and wire bonding the circuit structure to the antenna. - View Dependent Claims (13, 14, 15)
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17. A method of forming an electronic device, comprising:
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providing a stiff substrate; forming strain relief features in the stiff substrate; forming an antenna on the stiff substrate; coupling a circuit structure to the antenna; positioning a face sheet over at least a portion of a first surface of the substrate; disposing an adhesive over at least a portion of a second surface of the substrate; and positioning a release liner over the adhesive.
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18. An electronic device, comprising:
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a substrate having a first surface; a circuit structure carried on the first surface of the substrate; a face sheet positioned over at least a portion of the first surface of the substrate and the circuit structure; and a compressibly deformable material received between the first surface of the substrate and the face sheet and at least partially surrounding the circuit structure. - View Dependent Claims (19, 20, 21, 22, 23)
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24. An smart label, comprising;
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a substrate having a first surface; a circuit structure carried on the first surface of the substrate; a face sheet positioned over at least a portion of the first surface of the substrate and the circuit structure; and an intermediate material positioned between the first surface of the substrate and the face sheet and at least partially enveloping the circuit structure, the intermediate material having a viscoelastic modulus of less than approximately 200,000 psi. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32)
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33. A method of forming a memory tag, comprising:
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supplying a substrate having a first surface; locating an electrical structure on the first surface of the substrate; positioning a cover layer over the electrical structure and the first surface of the substrate; and depositing an intermediate material having a low viscoelastic modulus between the first surface of the substrate and the cover layer, the intermediate material overlying the electrical structure to hydrostatically cushion the electrical structure. - View Dependent Claims (34, 35, 36)
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Specification