Low-profile, integrated radiator tiles for wideband, dual-linear and circular-polarized phased array applications

• US 6,114,997 A
• Filed: 05/27/1998
• Issued: 09/05/2000
• Est. Priority Date: 05/27/1998
• Status: Expired due to Term

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Chau, Loc, Wang, Allen T. S., Lee, Kuan M.
• Primary Examiner(s): Wimer, Michael C.
• Application Number:
  US09/085,157
• Time in Patent Office: 832 Days
• Field of Search: 343/700 MS, 343/846, 343/848, 343/829, 343/830, 343/853, 343/778
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 21/0006 Particular feeding systems
• CPC Class Codes: H01Q 5/378 Combination of fed elements with parasitic elements
• CPC Class Codes: H01Q 9/0414 in a stacked or folded configuration

Abstract

A planar, low-profile, very wide frequency bandwidth, wide-scan, dual-linear or circular-polarized phased array antenna using integrated stacked-disc radiator tiles. The stacked-disc radiator configuration comprises a lower active radiator fed by a pair of probes for each polarization state, and a parasitic radiator separated from the active radiator by dielectric material. The stacked-disc radiator is integrated with its multi-layer feed circuits in a very compact package. The feed circuits include 90° hybrid coupler circuits and 180° hybrid coupler circuits that couple dual linear or dual circular polarized energy to and from the disk radiators.

Claims

1. An integrated radiator tile for use in a phased array antenna, comprising:

a bottom dielectric layer having a ground plane disposed on an exposed surface, and having first and second via transitions formed through the bottom dielectric layer;

a coupling circuit layer adjacent to the bottom dielectric layer comprising 90°

hybrid coupler circuits respectively coupled to the first and second via transitions;

a balun layer adjacent to the coupling circuit layer comprising lower and upper ground planes formed on opposite surfaces, 180°

hybrid coupler circuits, a plurality of RF transitions selectively connected between the 180°

hybrid coupler circuits and the 90°

hybrid coupler circuits, and a plurality of radiator to RF transitions coupled to the 180°

hybrid coupler circuits;

a plurality of grounding vias interconnecting the lower and upper ground planes of the balun layer, a plurality of grounding vias interconnecting the lower ground plane of the balun layer and the ground plane of the bottom dielectric layer, and a plurality of grounding vias surrounding each of the radiator to RF transitions;

a stacked disk radiator adjacent to the balun layer comprising a dielectric puck having an active radiator formed on an upper surface, an upper dielectric layer adjacent to the active radiator, a parasitic radiator adjacent to the upper dielectric layer, and a pair of excitation probes coupled between the radiator to RF transitions and the active radiator.

2. The integrated radiator tile of claim 1 further comprising a radome covering the parasitic radiator and the upper dielectric layer.

3. The integrated radiator tile of claim 1 further comprising first and second coaxial connectors coupled to the ground plane and having center pins coupled to the first and second transitions.

4. The integrated radiator tile of claim 1 further comprising connectorless coax-like structures coupled to the ground plane and to the first and second transitions.

5. The integrated radiator tile of claim 1 wherein the 180°

hybrid coupler circuits comprises modified ratrace couplers.

6. The integrated radiator tile of claim 1 further comprising a plurality of vias coupled between the upper ground plane of the balun layer and the active radiator, and disposed around the excitation probes.

7. The integrated radiator tile of claim 1 wherein the upper dielectric layer surrounds the dielectric puck, and the dielectric puck is disposed in a recess formed in the upper dielectric layer.

8. The integrated radiator tile of claim 1 further comprising a flat foam spacer disposed between dielectric puck and the radome.

9. The integrated radiator tile of claim 7 wherein the upper dielectric layer surrounding the dielectric puck comprises a dielectric material having a dielectric constant that is equal to that of the dielectric puck.

10. The integrated radiator tile of claim 1 wherein the dielectric puck is fully surrounded by air dielectric.

11. The integrated radiator tile of claim 1 wherein the dielectric puck is partially surrounded by air dielectric.

12. The integrated radiator tile of claim 1 wherein the coupling circuit layer and the balun layer produce both senses of circular polarization.

13. The integrated radiator tile of claim 1 wherein the coupling circuit layer and the balun layer produce dual-linear polarization.

14. The integrated radiator tile of claim 1 wherein the upper dielectric layer comprises a relatively low dielectric constant material relative to the dielectric constant of the balun layer.

15. The integrated radiator tile of claim 1 wherein the dielectric materials comprising the dielectric puck, the balun layer, and the 90°

coupling circuit layer similar coefficients of thermal expansion.

16. An antenna comprising:

a plurality of integrated radiator tiles abutting each other that form an array, each integrated radiator tile comprising;

a bottom dielectric layer having a ground plane disposed on an exposed surface, and having first and second via transitions formed through the bottom dielectric layer,

a coupling circuit layer adjacent to the bottom dielectric layer comprising 90°

hybrid coupler circuits respectively coupled to the first and second via transitions;

a balun layer adjacent to the coupling circuit layer comprising lower and upper ground planes formed on opposite surfaces, 180°

hybrid coupler circuits, a plurality of RF transitions selectively connected between the 180°

hybrid coupler circuits and the 90°

hybrid coupler circuits, and a plurality of radiator to RF transitions coupled to the 180°

hybrid coupler circuits;

a plurality of grounding vias interconnecting the lower and upper ground planes of the balun layer, a plurality of grounding vias interconnecting the lower ground plane of the balun layer and the ground plane of the bottom dielectric layer, and a plurality of grounding vias surrounding each of the radiator to RF transitions;

a stacked disk radiator adjacent to the balun layer comprising a dielectric puck having an active radiator formed on an upper surface, an upper dielectric layer adjacent to the active radiator, a parasitic radiator adjacent to the upper dielectric layer, and a pair of excitation probes coupled between the radiator to RF transitions and the active radiator.

17. The antenna of claim 16 further comprising a radome covering the parasitic radiator and the upper dielectric layer.

18. The antenna of claim 16 further comprising first and second coaxial connectors coupled to the ground plane and having center pins coupled to the first and second transitions.

19. The antenna of claim 16 further comprising connectorless coax-like structures coupled to the ground plane and to the first and second transitions.

20. The antenna of claim 16 wherein the coupling circuit layer and the balun layer selectively produce both senses of circular polarization or dual-linear polarization.