System and method for detecting particles produced in a process chamber by scattering light

• US 6,115,120 A
• Filed: 10/06/1999
• Issued: 09/05/2000
• Est. Priority Date: 10/08/1998
• Status: Expired due to Fees

• Current Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Original Assignee: NEC Corporation
• Inventors: Moriya, Tsuyoshi, Uesugi, Fumihiko, Ito, Natsuko
• Primary Examiner(s): Pham, Hoa Q.
• Assistant Examiner(s): Nguyen, Sang H.
• Application Number:
  US09/413,590
• Time in Patent Office: 335 Days
• Field of Search: 356/337, 356/338, 356/339, 356/340, 356/341, 356/342, 358/343, 382/203, 382/236, 382/145, 348/87
• US Class Current: 356/337
• CPC Class Codes: G01N 15/0227 using imaging; using holography
• CPC Class Codes: G01N 21/53 within a flowing fluid, e.g. smoke

Abstract

Particles generated within a semiconductor wafer process chamber are monitored by emitting a rastered laser beam into the process chamber and detecting a two-dimensional image of scattered radiant energy within the process chamber. A video frame representing a matrix array of pixel intensities is produced and processed by a processor. The processor receives first and second video frames, the first frame representing a matrix array of pixels of a background image of the process chamber before a wafer processing is started and the second frame representing a matrix array of corresponding pixels of a target image of the process changer after a wafer processing is started. Differential intensities between the pixels of the background image and corresponding pixels of the target image are detected and a decision is made on the detected intensities to produce an output signal representing presence or absence of the particles.

Claims

1. A particle detection system for detecting particles generated within a semiconductor wafer process chamber, comprising:

a radiation source for the emission of radiant energy of visible spectrum into said process chamber;

an image sensor for detecting a two-dimensional image of scattered radiant energy within said process chamber and producing therefrom a video frame representing a matrix array of pixel intensities; and

a processor connected to said image sensor for detecting differential pixel intensities between a first video frame representing a background image obtained by the image sensor before said process chamber begins a wafer processing and a second video frame representing a target image obtained by the image sensor after said wafer processing is started, and making a decision on said differential pixel intensities to produce an output signal representing presence or absence of said particles,

wherein said processor is arranged to;

divide the background pixel intensities into a first plurality of groups according to different values of the intensities,

divide the target pixel intensities into a second plurality of groups corresponding to the first plurality of groups according to different values of the target pixel intensities,

determine a differential pixel count between the number of pixels contained in each of said first plurality of groups and the number of pixels contained in each corresponding ground of the second plurality of groups, and

multiply the respective intensity of each of the second plurality of groups with the differential pixel count of the group to thereby produce said differential pixel intensities.

2. The particle detection system of claim 1, wherein the emitted radiant energy is a rastered laser beam.

3. The particle detection system of claim 1, further comprising a display unit for providing a visual display of said output signal.

4. A particle detection system for detecting particles generated within a semiconductor wafer process chamber, comprising:

a radiation source for the emission of radiant energy of visible spectrum into said process chamber;

an image sensor for detecting a two-dimensional image of scattered radiant energy within said process chamber and producing therefrom a video frame representing a matrix array of pixel intensities; and

a processor connected to said image sensor for detecting differential pixel intensities between a first video frame representing a background image obtained by the image sensor before said process chamber begins a wafer processing and a second video frame representing a target image obtained by the image sensor after said wafer processing is started, and making a decision on said differential pixel intensities to produce an output signal representing presence or absence of said particles; and

first and second memories, wherein said processor is arranged to;

store said first and second video frames in said first and second memories, respectively,

divide the background pixel intensities stored in the first memory into a first plurality of groups according to different values of the intensities and divide the target pixel intensities stored in the second memory into a second plurality of groups corresponding to the first plurality of groups according to different values of the target pixel intensities,

identify the intensity of one of the groups having a maximum number of pixels of background image and identify the intensity of one of the groups having a maximum number of pixels of target image,

determine a differential intensity between the identified intensities,

add the differential intensity to all target pixel intensities stored in said second memory, and

detect said differential pixel intensities between the background pixel intensities stored in said first memory and corresponding target pixel intensities stored in said second memory.

5. A particle detection system for detecting particles generated within a semiconductor wafer process chamber, comprising:

a radiation source for the emission of radiant energy of visible spectrum into said process chamber;

an image sensor for detecting a two-dimensional image of scattered radiant energy within said process chamber and producing therefrom a video frame representing a matrix array of pixel intensities; and

a processor connected to said image sensor for detecting differential pixel intensities between a first video frame representing a background image obtained by the image sensor before said process chamber begins a wafer processing and a second video frame representing a target image obtained by the image sensor after said wafer processing is started, and making a decision on said differential pixel intensities to produce an output signal representing presence or absence of said particles; and

first and second memories, wherein said processor is arranged to;

store said first and second video frames in said first and second memories, respectively,

determine an average intensity of the background pixel intensities stored in the first memory and an average intensity of the target pixel intensities stored in the second memory,

determine a differential intensity between the average intensities,

add the differential intensity to all target pixel intensities stored in said second memory, and

detect said differential pixel intensities between the background pixel intensities stored in said first memory and corresponding target pixel intensities stored in said second memory.

6. A method of detection particles generated within a semiconductor wafer process chamber, comprising the steps of:

a) emitting radiant energy of visible spectrum into said process chamber;

b) detecting a two-dimensional background image of scattered radiant energy within said process chamber before a wafer processing begins and producing a background video frame representing a matrix array of background pixel intensities;

c) detecting a two-dimensional target image of scattered radiant energy within said process chamber after said wafer processing begins and producing a target video frame representing a matrix array of target pixel intensities;

d) detecting differential pixel intensities between the background video frame and the target video frame; and

e) making a decision on said differential pixel intensities to produce an output signal representing presence or absence of said particles.

7. The method of claim 6, further comprising the steps of repeating the steps (c) to (e) by using the target video frame of the step (c) as the background video frame of the step (d), instead of the background video frame previously obtained from the background image of the step (b).

8. A method of detection particles generated within a semiconductor wafer process chamber, comprising the steps of:

a) emitting radiant energy of visible spectrum into said process chamber;

b) detecting a two-dimensional background image of scattered radiant energy within said process chamber before a wafer processing begins and producing a background video frame representing a matrix array of pixels of background intensities;

c) dividing the background pixel intensities into a plurality of groups according to different values of the intensities;

d) detecting a two-dimensional target image of scattered radiant energy within said process chamber after said wafer processing begins and producing a target video frame representing a matrix array of pixels of target intensities;

e) dividing the target pixel intensities into a plurality of groups corresponding to the groups of the step (c) according to different values of the target pixel intensities;

f) subtracting the number of pixels contained in each of said groups of background pixel intensities from the number of pixels contained in each corresponding group of target pixel intensities to determine a differential pixel count and multiplying the respective intensity of each group of the step (e) with the differential pixel count of the group to thereby produce a plurality of differential pixel intensities; and

g) making a decision on said differential pixel intensities to produce an output signal representing presence or absence of said particles.

9. The method of claim 8, further comprising the steps of repeating the steps (d) to (g) by using said each group of target pixel intensities of the step (e) as said each group of background pixel intensities of the step (f), instead of said each group of background video frame previously obtained from the background image of the step (b).

10. A method of detection particles generated within a semiconductor wafer process chamber, comprising the steps of:

a) emitting radiant energy of visible spectrum into said process chamber;

b) detecting a two-dimensional background image of scattered radiant energy within said process chamber before a wafer processing begins and producing a background video frame representing a matrix array of pixels of background intensities;

c) storing said matrix array of background pixel intensities in a first memory;

d) dividing the stored background pixel intensities into a plurality of groups according to different values of the intensities;

e) identifying the intensity of one of the groups of background pixel intensities containing a maximum number of pixels;

f) detecting a two-dimensional target image of scattered radiant energy within said process chamber after said wafer processing begins and producing a target video frame representing a matrix array of pixels of target intensities;

g) storing said matrix array of target pixel intensities in a second memory;

h) dividing the stored target pixel intensities into a plurality of groups corresponding to the groups of the step (d) according to different values of the target pixel intensities;

i) identifying the intensity of one of the groups of target pixel intensities containing a maximum number of pixels;

j) determining a differential intensity between the intensity identified by the step (e) and the intensity identified by the step (i);

k) summing the differential intensity to all target pixel intensities stored in said second memory;

l) detecting differential pixel intensities between the background pixel intensities stored in said first memory and corresponding target pixel intensities stored in said second memory; and

m) making a decision on said differential pixel intensities to produce an output signal representing presence or absence of said particles.

11. The method of claim 10, further comprising the steps of repeating the steps (f) to (m) by using the intensity of the group identified by the step (i) as the intensity of the group identified by the step (e), instead of the identified intensity of the group previously obtained from the background image of the step (b).

13. The method of claim 10, further comprising the steps of repeating the steps (e) to (k) by using the average intensity of the step (g) as the average intensity of the step (d), instead of the average intensity previously obtained from the background image of the step (b).

12. A method of detection particles generated within a semiconductor wafer process chamber, comprising the steps of:

a) emitting radiant energy of visible spectrum into said process chamber;

b) detecting a two-dimensional background image of scattered radiant energy within said process chamber before a wafer processing begins and producing a background video frame representing a matrix array of pixels of background intensities;

c) storing said matrix array of background pixel intensities in a first memory;

d) determining an average intensity of the background pixel intensities stored in the first memory;

e) detecting a two-dimensional target image of scattered radiant energy within said process chamber after said wafer processing begins and producing a target video frame representing a matrix array of pixels of target intensities;

f) storing said matrix array of target pixel intensities in a second memory;

g) determining an average intensity of the target pixel intensities stored in the second memory;

h) determining a differential intensity between the average intensities respectively determined by the steps (d) and (g);

i) summing the differential intensity to all target pixel intensities stored in said second memory;

j) detecting differential pixel intensities between the background pixel intensities stored in said first memory and corresponding target pixel intensities stored in said second memory; and

k) making a decision on said differential pixel intensities to produce an output signal representing presence or absence of said particles.