Wedge mount for integrated circuit sensors

• US 6,115,261 A
• Filed: 06/14/1999
• Issued: 09/05/2000
• Est. Priority Date: 06/14/1999
• Status: Expired due to Term

• Current Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Mortenson, Douglas P., Hagenson, Dale J., Platt, William P.
• Primary Examiner(s): Picard, Leo P.
• Assistant Examiner(s): Foster, David
• Application Number:
  US09/332,616
• Time in Patent Office: 449 Days
• Field of Search: 361/760, 361/765, 361/748, 361/784, 361/792, 361/796, 73/493, 73/514.38, 73/431, 73/777, 200/61.45 R
• US Class Current: 361/760
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence

Abstract

A sensor mount for mounting a sensor to a substrate having a support member, a substrate attachment surface, and a sensor attachment surface. The support member can be attached to the substrate at the substrate attachment surface and the sensor can be attached to the support member at the sensor attachment surface. The sensor mount is shaped so an oblique angle is formed between the plane that includes the substrate attachment surface and the plane that includes the sensor attachment surfaces. Preferably, the support member has a wedge shape.

Claims

1. A sensor mount for mounting a sensor to a substrate, comprising:

a support member;

a substrate attachment surface on the support member defining a first plane, wherein the support member can be attached to the substrate at the substrate attachment surface; and

a sensor attachment surface on the support member defining a second plane, wherein the sensor attachment surface is disposed on the support member so that the second plane forms an oblique angle with respect to the first plane, and wherein the sensor can be attached to the support member at the sensor attachment surface.

2. The sensor mount of claim 1, wherein the support member has a wedge shape.

3. The sensor mount of claim 2, further comprising a cavity formed in the support member opposite the sensor attachment surface.

4. The sensor mount of claim 1, wherein the oblique angle formed between the first and second planes is in the range of about 35°

to about 45°

.

5. The sensor mount of claim 4, wherein the oblique angle formed between the first and second planes is about 35°

.

6. The sensor mount of claim 1, further comprising a sensor mounted to the sensor attachment surface.

7. The sensor mount of claim 6, wherein the sensor is a parallel axis sensor.

8. The sensor mount of claim 6, wherein the sensor is a perpendicular axis sensor.

9. The sensor mount of claim 6, further comprising an electrical interconnect structure so that the sensor can be electrically connected to circuitry that is mounted on the substrate.

10. The sensor mount of claim 1, wherein the substrate is a printed wiring board.

11. The sensor mount of claim 1, wherein the support member has a plurality of sensor attachment surfaces, wherein each sensor attachment surface is disposed on the support member so that the plane defined by each sensor attachment surface forms an oblique angle with respect to the first plane, and wherein one or more sensors can be attached to each sensor attachment surface.

12. The sensor mount of claim 11, wherein the support member is a Y-shaped support member having three legs, wherein three sensor attachment surfaces are located at distal end portions of each of the legs.

13. The sensor mount of claim 12, wherein the three legs are angularly spaced about 120°

from each other.

14. A sensor mount assembly, comprising:

a substrate;

a plurality of sensors; and

a plurality of sensor mounts, wherein each sensor mount has;

a support member;

a substrate attachment surface on the support member defining a first plane, wherein each support member is attached to the substrate at the substrate attachment surface; and

a sensor attachment surface on the support member defining a second plane, wherein the sensor attachment surface is disposed on the support member so that the second plane forms an oblique angle with respect to the first plane, and wherein one of the plurality of sensors can be attached to each support member at the sensor attachment surface.

15. The sensor mount assembly of claim 14, wherein the plurality of support members comprises three support members arranged in a circular configuration on the substrate so that each sensor mount is angularly spaced from the other two sensor mounts by about 120°

.

16. The sensor mount assembly of claim 15, wherein the oblique angle formed between the first and second planes of each support member is about 35°

.