Multi-functional shipping system for integrated circuit devices
First Claim
1. A method for using a shipping container assemblage for integrated circuit devices;
- the method comprising the steps of;
a) providing a multifunctional shipping container including shock absorbing pads, said container having dimensions to fit either IC carrier trays or reels, and a means to expand the container cavity,b) loading a plurality of empty primary carriers for integrated circuit into the base of said container, positioning a lid on the base, and shipping said container to a user site,c) removing the primary carriers from the container, and reloading the container with carriers filled with integrated circuit devices at each subsequent work station, including sites for assembly, electrical testing, distribution, and end product user production, andd) loading the empty primary carriers into said container and shipping to a re-cycle center.
1 Assignment
0 Petitions
Accused Products
Abstract
A multifunctional shipping container for integrated circuits, and methods of using and reusing the container are described. The compact container coupled with foam inserts is dimensioned to securely ship and store integrated circuits in either tray or reel format. The container with an expandable cavity allows ease of access for loading and unloading the contents at multiple work stations, and may be converted to an in-house "tote". Multifunctionality of the container supports use as a shipping system from the tray or reel supplier, to the IC assembly and test site, to distribution centers, and to the IC customer, thus eliminating multiple costs of disposal, inventory and new shipping materials.
110 Citations
19 Claims
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1. A method for using a shipping container assemblage for integrated circuit devices;
- the method comprising the steps of;
a) providing a multifunctional shipping container including shock absorbing pads, said container having dimensions to fit either IC carrier trays or reels, and a means to expand the container cavity, b) loading a plurality of empty primary carriers for integrated circuit into the base of said container, positioning a lid on the base, and shipping said container to a user site, c) removing the primary carriers from the container, and reloading the container with carriers filled with integrated circuit devices at each subsequent work station, including sites for assembly, electrical testing, distribution, and end product user production, and d) loading the empty primary carriers into said container and shipping to a re-cycle center. - View Dependent Claims (2, 3)
- the method comprising the steps of;
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4. A method for using a shipping container assemblage for integrated circuit devices;
- the method comprising the steps of;
a) providing a multifunctional container comprising; a base unit having a plurality of side-walls, said side-walls extending essentially perpendicular from the bottom of the base unit to form a container having an inner cavity, a first set of the parallel said side-walls in a fixed position perpendicular to the bottom of the base, a transverse second parallel set of side-walls having a means to move and expand said cavity in the longitudinal direction, said first and second set of side-walls attached to and hinged from the bottom of the base unit, a pair of shock absorbing pads positioned inside and adjacent to the transverse side-walls, and extending partially along the length of the fixed side-walls, a lid having a plurality of side-walls, the first set of said side-walls approximately equal in length to the transverse side-walls of the base, the second set of side-walls approximately equal in length to the fixed side-walls of the base, and said side-walls extending essentially perpendicular from the top to form an inner cavity, inner dimensions of the lid being slightly larger than the outer dimensions of said base unit, a series of self-aligning openings in said transverse side-walls of the base, in the first set of side-walls of the lid, and in the shock absorbing pad, and a pair of interlocking, flanged handles capable of mating said openings, b) loading a plurality of empty primary carriers for integrated circuit into said container base having shock absorbing pads, positioning the lid on the base, affixing the handles and shipping to a user site, c) removing the primary carriers from the container, and reloading the container with carriers filled with integrated circuit devices at each subsequent work station, including assembly, test, distribution centers, and end product user production work sites, d) loading the empty carriers into the container and shipping to a re-cycle center. - View Dependent Claims (5, 6, 7, 8, 9, 10, 11, 12, 13)
- the method comprising the steps of;
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14. A multiple use transport container comprising:
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a base unit having a plurality of side-walls, said side-walls extending essentially perpendicular from the bottom of the base unit to form a container having an inner cavity, one parallel set of said side-walls in a fixed position perpendicular to the bottom of the base, a transverse second parallel set of side-walls having a means to move and expand said cavity in the longitudinal direction, said first and second set of side-walls attached to and hinged from the bottom of the base unit, a pair of shock absorbing pads positioned inside and adjacent to the transverse side-walls, and extending partially along the length of the fixed side-walls, a lid having a plurality of side-walls, the first set of said side-walls approximately equal in length to the transverse side-walls of the base, the second set of side-walls approximately equal in length to the fixed side-walls of the base, and said side-walls extending essentially perpendicular from the top to form an inner cavity, said lid inner dimensions slightly larger than the outer dimensions of said base, a series of self-aligning openings in said transverse side-walls of the base, the first set of side-walls in the lid, and in the shock absorbing pads, and a pair of interlocking, flanged handle capable of mating said openings. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification