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Multi-functional shipping system for integrated circuit devices

  • US 6,116,423 A
  • Filed: 07/23/1999
  • Issued: 09/12/2000
  • Est. Priority Date: 07/23/1999
  • Status: Expired due to Term
First Claim
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1. A method for using a shipping container assemblage for integrated circuit devices;

  • the method comprising the steps of;

    a) providing a multifunctional shipping container including shock absorbing pads, said container having dimensions to fit either IC carrier trays or reels, and a means to expand the container cavity,b) loading a plurality of empty primary carriers for integrated circuit into the base of said container, positioning a lid on the base, and shipping said container to a user site,c) removing the primary carriers from the container, and reloading the container with carriers filled with integrated circuit devices at each subsequent work station, including sites for assembly, electrical testing, distribution, and end product user production, andd) loading the empty primary carriers into said container and shipping to a re-cycle center.

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