Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate

• US 6,117,705 A
• Filed: 03/30/1998
• Issued: 09/12/2000
• Est. Priority Date: 04/18/1997
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Hollaway, Roy D., Panczak, Anthony E.
• Primary Examiner(s): Whitehead, Jr., Carl
• Assistant Examiner(s): POTTER, ROY KARL
• Application Number:
  US09/050,666
• Time in Patent Office: 897 Days
• Field of Search: 438/106, 438/116, 156/69, 174/52.3
• US Class Current: 438/106
• CPC Class Codes: G11C 16/18 Circuits for erasing optically
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85207 Thermosonic bonding
• CPC Class Codes: H01L 2224/85444 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/85455 Nickel (Ni) as principal constituent
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/538 : the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates H05K takes precedence; manufacture or treatment H01L21/4846 ; mountings per se H01L23/12; materials H01L23/49866
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01037 : Rubidium [Rb]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01058 : Cerium [Ce]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

A package for an integrated circuit is described, as are methods of making the package. The package includes a substrate having a generally planar first surface on which a metal die pad is formed. An integrated circuit die is attached to the metal die pad. An adhesive head surrounds the integrated circuit die and covers the exposed periphery of the metal die pad. A generally planar lid is in a press-fitted interconnection with the bead. An adhesive material covers conductive structures on the die, such as bonding pads, to prevent corrosion. Optionally, the package has vertical peripheral sides. The methods of making the package include methods for making packages individually, or making a plurality of packages simultaneously. Where a plurality of packages are made simultaneously, integrated circuit die are placed on each of a plurality of physically-joined package substrates on a generally planar sheet of substrate material. An adhesive bead is applied around each die. In cross-section, the bead has a central peak and a shorter peak on each side of the central peak. A sheet of lid material is placed onto the beads. After the bead is hardened, individual packages are formed by cutting the substrate sheet, lid sheet, and beads.

Claims

1. A method of making a package containing an integrated circuit die, the method comprising:

providing an integrated circuit die having a perimeter;

providing a planar substrate having a planar first surface, a metal die pad having a perimeter on the first surface of the substrate, and an electrically conductive path through the substrate;

placing the integrated circuit die on the metal die pad, wherein

the metal die pad extends laterally beyond the entire perimeter of the integrated circuit die;

electrically connecting the integrated circuit die to the electrically conductive path through the substrate;

applying a bead of a viscous first adhesive material onto the first surface of the substrate around the integrated circuit die, said adhesive bead covering a peripheral portion of the metal die pad around the metal die pad;

providing a planar lid with a planar first surface;

placing the planar first surface of said lid onto the bead around the die such that the planar first surface of the lid is supported above the planar first surface of the substrate and the integrated circuit die by the adhesive bead; and

hardening the adhesive bead.

2. The method of claim 1, wherein the integrated circuit has a first surface facing the planar first surface of the lid, and a first conductive structure on the first surface of the integrated circuit, said first conductive structure being electrically connected to the electrically conductive path;

and

the method further includes covering the first conductive structure with a viscous second adhesive material and hardening the second adhesive material.

3. The method of claim 1, wherein the lid includes a planar second surface opposite the planar first surface of the lid, and a peripheral edge between the first and second surfaces of the lid around the entire lid, and the method further includes pressing the lid and at least part of the edge into the adhesive bead.

4. The method of claim 1, wherein the integrated circuit has a first surface facing the planar first surface of the lid, and a first conductive structure on the first surface of the integrated circuit;

and

applying the bead of viscous adhesive material includes covering the first conductive structure and a peripheral portion of the first surface of the integrated circuit die with the bead.

9. The method of claim 1, wherein applying the bead of a viscous first adhesive material includes contacting a peripheral portion of the integrated circuit die with the bead.

10. The method of claim 1, wherein electrically connecting the integrated circuit die to the electrically conductive path includes connecting a bond wire to a first conductive structure on the integrated circuit die.

11. The method of claim 10, further comprising covering the bond wire with said bead.

12. The method of claim 10, further comprising covering the first conductive structure with a second adhesive material and hardening the second adhesive material.

13. The method of claim 11, further comprising forming vertical peripheral sides around the entire package.

14. The method of claim 1, wherein the lid is a one-piece structure and is formed of a material selected from the group of plastic, ceramic, and metal.

15. The method of claim 14, further comprising forming vertical peripheral sides around the entire package.

16. The method of claim 1, wherein the lid is a one-piece structure.

17. The method of claim 16, wherein the lid is transparent to light.

18. The method of claim 1, wherein said bead contacts the planar first surface of the lid, and does not cover a peripheral edge of the lid.

19. The method of claim 15, wherein said bead contacts the planar first surface of the lid, and does not cover a peripheral edge of the lid.

20. The method of claim 17, wherein said bead contacts the planar first surface of the lid, and does not cover a peripheral edge of the lid.

5. A method of making a plurality of integrated circuit packages each containing an integrated circuit die, the method comprising:

providing a planar first sheet of an insulating material, said first sheet including a plurality of physically-joined package substrates, wherein each package substrate has a planar first surface in a common plane;

placing an integrated circuit die on the planar first surface of each package substrate;

electrically connecting each integrated circuit die to an electrically conductive path through the die'"'"'s respective package substrate;

applying a bead of an adhesive material onto the planar first surface of each package substrate of the first sheet around each integrated circuit die;

providing a planar second sheet of a material for forming a lid for each package, said second sheet having a planar first surface and an area which is at least sufficient to cover the adhesive beads around the integrated circuit dies;

placing the planar first surface of said second sheet onto the adhesive beads around the dies such that the planar first surface of the second sheet is supported above all of the planar first surfaces of the package substrates of the first sheet and all of the integrated circuit dies by the adhesive beads;

hardening the adhesive beads around all of the integrated circuit dies; and

separating individual packages each having a package substrate, an enclosed integrated circuit die, and a lid.

6. The method of claim 5, wherein applying the bead of a viscous adhesive material includes applying a single bead of the viscous adhesive material between adjacent integrated circuit die of adjacent package substrates of the first sheet, and separating individual packages includes splitting the single bead between two packages.

7. The method of claim 6, wherein each package formed has vertical peripheral sides around the entire package.

8. The method of claim 7, wherein applying the bead of a viscous adhesive material includes forming a bead having a central first peak and two shorter second peaks.

21. The method of claim 5, wherein applying the bead of adhesive material includes applying criss-crossing rows and columns of beads so that each integrated circuit die is surrounded by beads of the adhesive material.

22. The method of claim 5, wherein separating individual packages includes cutting with a saw.

23. The method of claim 5, wherein each package formed has vertical peripheral sides around the entire package.

24. The method of claim 5, wherein the second sheet is formed of a material selected from the group of plastic, ceramic, and metal.

25. The method of claim 5, wherein the lid of each package is a one-piece structure.

26. The method of claim 5, wherein the second sheet is transparent to light.

27. The method of claim 5, wherein the integrated circuit die has a perimeter, and applying said bead around each integrated circuit die includes contacting a peripheral portion of each die with said bead.

28. The method of claim 5, wherein the first surface of each package substrate includes a planar metal die pad, and further comprising placing each integrated circuit die on the die pad of the respective package substrate.

29. The method of claim 28, wherein each die pad has a perimeter that extends beyond a perimeter of the integrated circuit die on the die pad, and further comprising applying said bead so as to cover a peripheral portion of said die pad.

30. The method of claim 29, further comprising applying said bead so as to contact a peripheral portion of each die with said bead.

31. The method of claim 29, wherein electrically connecting each integrated circuit die to the electrically conductive path includes connecting a bond wire to a first conductive structure on the integrated circuit die.

32. The method of claim 31, further comprising covering the bond wire and the first conductive structure with said bead.

33. The method of claim 31, further comprising covering the first conductive structure with a second adhesive material and hardening the second adhesive material.

34. The method of claim 5, wherein electrically connecting the integrated circuit die to the electrically conductive path includes connecting a bond wire to a first conductive structure on the integrated circuit die.

35. The method of claim 34, further comprising covering the bond wire with said bead.

36. A method of making a package containing an integrated circuit die, the method comprising:

providing an integrated circuit die;

providing a planar substrate having a planar first surface and an electrically conductive path through the substrate;

placing the integrated circuit die on the planar first surface of the substrate;

electrically connecting a bond wire to a conductive pad on the integrated circuit, said bond wire being electrically connected to the electrically conductive path;

applying a bead of an adhesive material on the planar first surface of the substrate around the integrated circuit die, said bead covering the bond wire;

providing a planar lid having a planar first surface;

placing the planar first surface of the lid onto the bead so that the planar first surface of the lid is above the integrated circuit die; and

hardening the bead.

37. The method of claim 36, further comprising forming vertical peripheral sides around the entire package.

38. The method of claim 37, wherein applying the bead of viscous first adhesive material includes contacting a peripheral portion of the integrated circuit die with the bead.