Method of making integrated circuit package having adhesive bead supporting planar lid above planar substrate
First Claim
1. A method of making a package containing an integrated circuit die, the method comprising:
- providing an integrated circuit die having a perimeter;
providing a planar substrate having a planar first surface, a metal die pad having a perimeter on the first surface of the substrate, and an electrically conductive path through the substrate;
placing the integrated circuit die on the metal die pad, whereinthe metal die pad extends laterally beyond the entire perimeter of the integrated circuit die;
electrically connecting the integrated circuit die to the electrically conductive path through the substrate;
applying a bead of a viscous first adhesive material onto the first surface of the substrate around the integrated circuit die, said adhesive bead covering a peripheral portion of the metal die pad around the metal die pad;
providing a planar lid with a planar first surface;
placing the planar first surface of said lid onto the bead around the die such that the planar first surface of the lid is supported above the planar first surface of the substrate and the integrated circuit die by the adhesive bead; and
hardening the adhesive bead.
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0 Petitions
Accused Products
Abstract
A package for an integrated circuit is described, as are methods of making the package. The package includes a substrate having a generally planar first surface on which a metal die pad is formed. An integrated circuit die is attached to the metal die pad. An adhesive head surrounds the integrated circuit die and covers the exposed periphery of the metal die pad. A generally planar lid is in a press-fitted interconnection with the bead. An adhesive material covers conductive structures on the die, such as bonding pads, to prevent corrosion. Optionally, the package has vertical peripheral sides. The methods of making the package include methods for making packages individually, or making a plurality of packages simultaneously. Where a plurality of packages are made simultaneously, integrated circuit die are placed on each of a plurality of physically-joined package substrates on a generally planar sheet of substrate material. An adhesive bead is applied around each die. In cross-section, the bead has a central peak and a shorter peak on each side of the central peak. A sheet of lid material is placed onto the beads. After the bead is hardened, individual packages are formed by cutting the substrate sheet, lid sheet, and beads.
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Citations
38 Claims
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1. A method of making a package containing an integrated circuit die, the method comprising:
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providing an integrated circuit die having a perimeter; providing a planar substrate having a planar first surface, a metal die pad having a perimeter on the first surface of the substrate, and an electrically conductive path through the substrate; placing the integrated circuit die on the metal die pad, wherein the metal die pad extends laterally beyond the entire perimeter of the integrated circuit die; electrically connecting the integrated circuit die to the electrically conductive path through the substrate; applying a bead of a viscous first adhesive material onto the first surface of the substrate around the integrated circuit die, said adhesive bead covering a peripheral portion of the metal die pad around the metal die pad; providing a planar lid with a planar first surface; placing the planar first surface of said lid onto the bead around the die such that the planar first surface of the lid is supported above the planar first surface of the substrate and the integrated circuit die by the adhesive bead; and hardening the adhesive bead. - View Dependent Claims (2, 3, 4, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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5. A method of making a plurality of integrated circuit packages each containing an integrated circuit die, the method comprising:
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providing a planar first sheet of an insulating material, said first sheet including a plurality of physically-joined package substrates, wherein each package substrate has a planar first surface in a common plane; placing an integrated circuit die on the planar first surface of each package substrate; electrically connecting each integrated circuit die to an electrically conductive path through the die'"'"'s respective package substrate; applying a bead of an adhesive material onto the planar first surface of each package substrate of the first sheet around each integrated circuit die; providing a planar second sheet of a material for forming a lid for each package, said second sheet having a planar first surface and an area which is at least sufficient to cover the adhesive beads around the integrated circuit dies; placing the planar first surface of said second sheet onto the adhesive beads around the dies such that the planar first surface of the second sheet is supported above all of the planar first surfaces of the package substrates of the first sheet and all of the integrated circuit dies by the adhesive beads; hardening the adhesive beads around all of the integrated circuit dies; and separating individual packages each having a package substrate, an enclosed integrated circuit die, and a lid. - View Dependent Claims (6, 7, 8, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A method of making a package containing an integrated circuit die, the method comprising:
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providing an integrated circuit die; providing a planar substrate having a planar first surface and an electrically conductive path through the substrate; placing the integrated circuit die on the planar first surface of the substrate; electrically connecting a bond wire to a conductive pad on the integrated circuit, said bond wire being electrically connected to the electrically conductive path; applying a bead of an adhesive material on the planar first surface of the substrate around the integrated circuit die, said bead covering the bond wire; providing a planar lid having a planar first surface; placing the planar first surface of the lid onto the bead so that the planar first surface of the lid is above the integrated circuit die; and hardening the bead. - View Dependent Claims (37, 38)
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Specification