Use of residual organic compounds to facilitate gate break on a carrier substrate for a semiconductor device

• US 6,117,708 A
• Filed: 02/05/1998
• Issued: 09/12/2000
• Est. Priority Date: 02/05/1998
• Status: Expired due to Term

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Wensel, Richard W.
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Chambliss, Alonzo
• Application Number:
  US09/019,209
• Time in Patent Office: 950 Days
• Field of Search: 438/110, 438/112, 438/118, 438/107, 438/124, 438/126, 438/127, 257/778, 257/787, 257/788, 257/779, 257/780, 257/784
• US Class Current: 438/118
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01087 Francium [Fr]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

An encapsulant molding technique used in chip-on-board encapsulation wherein a residual organic compound layer on the surface of a substrate is used to facilitate removal of unwanted encapsulant material. An organic compound layer which inherently forms on the substrate during the fabrication of the substrate or during various chip attachment processes is masked in a predetermined location with a mask. The substrate is then cleaned to remove the organic compound layer. The mask protects the masked portion of the organic material layer which becomes a release layer to facilitate gate break.

An encapsulant mold is placed over the substrate and chip and an encapsulant material is injected into the encapsulant mold cavity through an interconnection channel. The release layer is formed in a position to reside as the bottom of the interconnection channel. Preferably, the interconnection channel has a gate adjacent the encapsulant mold cavity. The encapsulant material solidifies and the encapsulant mold is removed, wherein the gate forms an indentation abutting the cavity. Excess encapsulant solidified in the interconnection channel is leveraged from the surface of the substrate and broken free at the indentation. The remaining release layer may then be removed.

Claims

1. A method of forming an encapsulant release layer on a carrier substrate, comprising:

providing said carrier substrate having at least one semiconductor device attached thereto,

wherein said carrier substrate includes an organic material-containing residual layer thereon;

applying a mask over an area on said organic material-containing residual layer; and

removing said organic material-containing residual layer from said carrier substrate while protecting a portion of said organic material-containing residual layer in said area covered by said mask from removal.

2. The method of claim 1, further comprising removing said mask after removal of said organic material-containing residual layer from said carrier substrate.

3. The method of claim 1, wherein removing said organic material-containing residual layer from said carrier substrate comprises plasma cleaning.

4. A method of encapsulating a semiconductor device, comprising:

providing a carrier substrate having at least one semiconductor device attached thereto, wherein said carrier substrate includes an organic material-containing residual layer thereon;

applying a mask over an area on said organic material-containing residual layer;

removing said organic material-containing residual layer from said carrier substrate while protecting a portion of said organic material-containing residual layer in said area covered by said mask from removal;

placing an encapsulant mold having a cavity over said semiconductor device, wherein said semiconductor device resides within said encapsulant mold cavity and wherein said encapsulant mold includes an interconnection channel, said portion of said organic material forming a side of said interconnection channel adjacent said carrier substrate;

injecting an encapsulant material into said encapsulant mold cavity through said interconnection channel and permitting said encapsulant material to substantially solidify in said encapsulant mold cavity and said interconnection channel;

removing said encapsulant mold; and

removing said encapsulant material which solidified in said interconnection channel and over said portion of said organic material from said carrier substrate.

5. The method of claim 4, further comprising removing said mask after removal of said organic material-containing residual layer from said carrier substrate.

6. The method of claim 4, further comprising removing said organic material-containing residual layer portion after removal of said encapsulant material which solidified in said interconnection channel.

7. The method of claim 4, wherein removing said organic material-containing residual layer from said carrier substrate comprises plasma cleaning.