Using a temporary substrate to attach components to a display substrate when fabricating a passive type display device

• US 6,118,502 A
• Filed: 04/20/1998
• Issued: 09/12/2000
• Est. Priority Date: 03/10/1995
• Status: Expired due to Term

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Nakajima, Setsuo, Arai, Yasuyuki, Takemura, Yasuhiko, Yamazaki, Shunpei
• Primary Examiner(s): Sikes, William L.
• Assistant Examiner(s): Parker, Kenneth
• Application Number:
  US09/062,873
• Time in Patent Office: 876 Days
• Field of Search: 349/153, 349/152, 349/151, 349/45, 438/30
• US Class Current: 349/45
• CPC Class Codes: G02F 1/1303 Apparatus specially adapted to the manufacture of LCDs
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

A method of fabricating a driver circuit for use with a passive matrix or active matrix electrooptical display device such as a liquid crystal display. The driver circuit occupies less space than heretofore. A circuit (stick crystal) having a length substantially equal to the length of one side of the matrix of the display device is used as the driver circuit. The circuit is bonded to one substrate of the display device, and then the terminals of the circuit are connected with the terminals of the display device. Subsequently, the substrate of the driver circuit is removed. This makes the configuration of the circuit much simpler than the configuration of the circuit heretofore required by the TAB method or COG method, because conducting lines are not laid in a complex manner. The driver circuit can be formed on a large-area substrate such as a glass substrate. The display device can be formed on a lightweight material having a high shock resistance such as a plastic substrate. Hence, a display device having excellent portability can be obtained.

Claims

1. A method of manufacturing a passive type display device, the method comprising the steps of:

forming a driver circuit on a temporary substrate;

forming an electrode arrangement on a display substrate of the passive type display device; and

attaching the driver circuit formed on the temporary substrate onto the display substrate,

wherein the electrode arrangement is operationally connected to the driver circuit.

2. A method according to claim 1 wherein the display substrate is made of plastic.

3. A method according to claim 2 wherein the plastic comprises flexible material.

4. A method according to claim 1 wherein the passive type display device is a liquid crystal display device.

19. A method according to claim 1 further comprising the steps of:

forming a sealing member on a periphery of one of the display substrate and an opposite substrate;

mating the display substrate and the opposite substrate with the sealing member therebetween.

5. A method of manufacturing a passive type display device, the method comprising the steps of:

forming an amorphous semiconductor film over a temporary substrate;

introducing a material capable of crystallizing the amorphous semiconductor film;

crystallizing the amorphous semiconductor film by thermally annealing to form a crystalline semiconductor film;

forming a driver circuit using the crystalline semiconductor film; and

attaching the driver circuit formed over the temporary substrate onto a display substrate of the passive type display device.

6. A method according to claim 5 wherein the display substrate is made of plastic.

7. A method according to claim 6 wherein the plastic comprises flexible material.

8. A method according to claim 5 further comprising a step of sticking the display substrate and an opposite substrate by curing a sealing member with pressing the substrates at 160°

C. for 3 hours.

9. A method according to claim 5 wherein the passive type display device is a liquid crystal display device.

20. A method according to claim 5 further comprising the steps of:

forming a sealing member on a periphery of one of the display substrate and an opposite substrate;

mating the display substrate and the opposite substrate with the sealing member therebetween.

10. A method of manufacturing a passive type display device, the method comprising the steps of:

forming a peeling layer comprising silicon on a glass substrate;

forming an underlying film on the peeling layer;

forming a semiconductor integrated circuit on the underlying film;

forming a passivation film on the semiconductor integrated circuit;

sticking a transfer substrate to the passivation film;

etching the peeling layer with a halogen fluoride thereby separating said semiconductor integrated circuit from the glass substrate; and

after separating the semiconductor integrated circuit, attaching the semiconductor integrated circuit to a display substrate with said underlying film therebetween.

11. A method according to claim 10 wherein the passive type display device is a liquid crystal display device.

12. A method according to claim 10 wherein the underlying film comprises silicon oxide.

13. A method according to claim 10 wherein the passivation film comprises polyimide resin.

14. A method according to claim 10 wherein curing the passivation film is performed under an atmosphere containing N₂ at 300 C.

15. A method according to claim 10 wherein the etching process is performed under a pressure of 1 to 10 torr at a room temperature.

16. A method according to claim 10 wherein the transfer substrate is made of plastic.

17. A method according to claim 10 wherein the display substrate is made of plastic.

18. A method according to claim 17 wherein the plastic comprises polyethersulfate having a thickness of 0.3 mm.

21. A method according to claim 10 further comprising the steps of:

forming a sealing member on a periphery of one of the display substrate and an opposite substrate;

mating the display substrate and the opposite substrate with the sealing member therebetween.

22. A method according to claim 10, wherein said halogen fluoride is at least one selected from the group consisting of chlorine monofluoride (ClF), chlorine trifluoride (ClF₃), bromine monofluoride (BrF), bromine trifluoride (BrF₃), iodine monofluoride (IF), and iodine trifluoride (IF₃).