Apparatus and method of detecting a polishing endpoint layer of a semiconductor wafer which includes a metallic reporting substance

• US 6,121,147 A
• Filed: 12/11/1998
• Issued: 09/19/2000
• Est. Priority Date: 12/11/1998
• Status: Expired due to Term

• Current Assignee: Bell Semiconductor, LLC (Hilco Inc. (d/b/a Hilco Global))
• Original Assignee: LSI Logic Corporation (Broadcom, Inc.)
• Inventors: Allman, Derryl D. J., Daniel, David W., Gregory, John W.
• Primary Examiner(s): POWELL, WILLIAM A
• Application Number:
  US09/209,704
• Time in Patent Office: 648 Days
• Field of Search: 438/691, 438/692, 438/693, 438/745, 438/747, 438/753, 438/8, 438/14, 216/38, 216/84, 216/85, 216/88, 216/89, 216/91, 156/345 LC, 156/345 LP
• US Class Current: 438/692
• CPC Class Codes: B24B 37/04 designed for working plane surfaces
• CPC Class Codes: B24B 49/12 involving optical means
• CPC Class Codes: B24B 57/02 for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
• CPC Class Codes: H01L 21/31053 involving a dielectric removal step

Abstract

A method of planarizing a semiconductor wafer to a distance from a semiconductor substrate of the wafer is disclosed. The method includes the step of forming in the wafer a metallic reporting substance that is at the predetermined distance from the substrate of the wafer. The method also includes the step of polishing a first side of the wafer in order to remove material from the wafer. The method further includes the step of utilizing an atomic absorption spectroscopic technique to detect the presence of the metallic reporting substance in the material removed from the wafer. Moreover, the method includes the step of terminating the polishing step in response to the detection of the metallic reporting substance. An associated apparatus for polishing a semiconductor wafer down to a metallic reporting substance of the wafer is also described.

Claims

1. A method of planarizing a semiconductor wafer having a polishing endpoint layer that includes a metallic reporting substance, comprising the steps of:

polishing a first side of said wafer in order to remove material from said wafer;

utilizing an atomic absorption spectroscopic technique to detect the presence of said metallic reporting substance in said material removed from said wafer; and

terminating said polishing step in response to detecting the presence of said metallic reporting substance.

2. The method of claim 1, wherein:

said terminating step includes the step of detecting an increase in the concentration of said metallic reporting substance.

3. The method of claim 1, wherein:

said terminating step includes the step of detecting a decrease in the concentration of said metallic reporting substance.

4. The method of claim 1, further comprising the step of:

forming said polishing endpoint layer a distance from a substrate of said wafer.

5. The method of claim 4, wherein:

said forming step includes the step of chemically depositing said polishing endpoint layer at said distance from said substrate of said wafer.

6. The method of claim 1, wherein:

said atomic absorption spectroscopic technique utilizes a flame atomic absorption spectrophotometer or a flameless atomic absorption spectrophotometer.

7. The method of claim 1, wherein:

said polishing step includes the step of applying a slurry to said first side of said wafer, said slurry receiving said material removed from said wafer, and

said detecting step includes the step of analyzing said slurry with said atomic absorption spectroscopic technique to determine whether said metallic reporting substance is present in said slurry.

8. The method of claim 1, wherein:

said metallic reporting substance includes a metallic element selected from the group consisting of tungsten, aluminum, titanium, copper, lead, iron, gold, and silver.

9. A method of planarizing a semiconductor wafer to a distance from a semiconductor substrate of said wafer, comprising the steps of:

forming in said wafer a metallic reporting substance that is at said distance from said substrate of said wafer;

polishing a first side of said wafer in order to remove material from said wafer;

utilizing an atomic absorption spectroscopic technique to detect the presence of said metallic reporting substance in said material removed from said wafer; and

terminating said polishing step in response to detection of said metallic reporting substance.

10. The method of claim 9, wherein:

said terminating step includes the step of detecting an increase in the concentration of said metallic reporting substance.

11. The method of claim 9, wherein:

said terminating step includes the step of detecting a decrease in the concentration of said metallic reporting substance.

12. The method of claim 9, wherein:

said forming step includes the step of chemically depositing said metallic reporting substance at said distance from said substrate of said wafer.

13. The method of claim 9, wherein:

said atomic absorption spectroscopic technique utilizes a flame atomic absorption spectrophotometer or a flameless atomic absorption spectrophotometer.

14. The method of claim 9, wherein:

said polishing step includes the step of applying a slurry to said first side of said wafer, said slurry receiving said material removed from said wafer, and

said detecting step includes the step of analyzing said slurry with said atomic absorption spectroscopic technique to determine whether said metallic reporting substance is present in said slurry.

15. The method of claim 9, wherein:

said metallic reporting substance includes a metallic element selected from the group consisting of tungsten, aluminum, titanium, copper, lead, iron, gold, and silver.

16. An apparatus for polishing a semiconductor wafer down to a metallic reporting substance of said wafer, said wafer having a first side and a second side, comprising:

a polishing platen having a polishing surface;

a wafer carrier configured to (i) engage said wafer by said second side of said wafer and (ii) press said first side of said wafer against said polishing surface of said polishing platen;

a slurry supply system configured to apply a chemical slurry to said first side of said wafer which (i) facilities removal of said metallic reporting substance from said wafer, and (ii) receives said metallic reporting substance removed from said wafer, wherein said polishing platen and said wafer carrier are configured to rub said first side of said wafer against said polishing surface in the presence of said chemical slurry in order to remove said metallic reporting substance from said wafer; and

a polishing endpoint detector that (i) utilizes an atomic absorption spectroscopic technique to detect the presence of said metallic reporting substance in said material removed from said wafer, and (ii) is operable so as to cause said polishing of said wafer to terminate in response to detecting the presence of said metallic reporting substance.

17. The apparatus of claim 16, wherein said polishing endpoint detector comprises:

a slurry extractor that is operable to extract said chemical slurry from said polishing platen.

18. The apparatus of claim 16, wherein said polishing endpoint detector comprises:

an analyzer which is operable to detect a change in the concentration of said metallic reporting substance in said chemical slurry from said polishing platen.

19. The apparatus of claim 16, further comprising:

a nebulizer operable to atomize said chemical slurry prior to said polishing endpoint detector utilizing said atomic absorption spectroscopic technique to detect the presence of said metallic reporting substance in said material removed from said wafer.

20. The apparatus of claim 16, wherein:

said metallic reporting substance includes a metallic element selected from the group consisting of tungsten, aluminum, titanium, copper, lead, iron, gold, and silver.