Composite film comprising low-dielectric resin and paraoriented aromatic polyamide

• US 6,121,171 A
• Filed: 04/08/1998
• Issued: 09/19/2000
• Est. Priority Date: 04/08/1997
• Status: Expired due to Term

• Current Assignee: Sumitomo Chemical Company Limited
• Original Assignee: Sumitomo Chemical Company Limited
• Inventors: Takahashi, Tsutomu, Kumada, Hiroaki
• Primary Examiner(s): Copenheaver, Blaine
• Assistant Examiner(s): Guarriello, John J.
• Application Number:
  US09/056,864
• Time in Patent Office: 895 Days
• Field of Search: 442/289, 442/291, 442/286, 428/308.4
• US Class Current: 442/289
• CPC Class Codes: C08J 2377/10 Polyamides derived from aromatically bound amino and carboxyl groups of amino carboxylic acids or of polyamines and polycarboxylic acids
• CPC Class Codes: C08J 5/04 Reinforcing macromolecular compounds with loose or coherent fibrous material
• CPC Class Codes: C08J 5/18 Manufacture of films or sheets
• CPC Class Codes: C08L 25/00 Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 77/10 Polyamides derived from aromatically bound amino and carboxyl groups of amino-carboxylic acids or of polyamines and polycarboxylic acids
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/015 Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
• CPC Class Codes: H05K 2201/0166 Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
• CPC Class Codes: H05K 2201/0278 Polymeric fibers
• CPC Class Codes: H05K 2201/0293 Non-woven fibrous reinforcement
• CPC Class Codes: Y10T 428/249958 Void-containing component is synthetic resin or natural rubbers
• CPC Class Codes: Y10T 442/3854 Woven fabric with a preformed polymeric film or sheet
• CPC Class Codes: Y10T 442/3878 Fluorinated olefin polymer or copolymer sheet or film [e.g., Teflon@, etc.]
• CPC Class Codes: Y10T 442/3894 Amide condensation polymer sheet or film [e.g., nylon 6, etc.]

Abstract

Provided is a composite film comprising a continuous phase of para-oriented aromatic polyamide and a phase of low-dielectric resin, said film having a dielectric constant at 1 MHz of not more than 3.2 and a linear thermal expansion coefficient at 200 to 300° C. of within ±50×10^-6 /°C. The composite film has characteristics such as a low dielectric constant, favorable mechanical strength, homogeneous structure, light weight, and a low linear thermal expansion coefficient, and the film is useful as a base substrate for a flexible printed circuit board.

Claims

1. A composite film comprising a continuous phase of para-oriented aromatic polyamide and a phase of low-dielectric resin, said film having a dielectric constant at 1 MHz of not more than 3.2 and a linear thermal expansion coefficient at 200 to 300°

C. of within ±

50×

10^-6 /°

C.,

wherein the continuous phase of para-oriented aromatic polyamide comprises fibrils having a diameter of not more than 1 μ

m, and the fibrils are planarly arranged and layered in the form of a network or a non-woven fabric.

2. A composite film according to claim 1, wherein said film further comprises heat-resistant short fiber and/or pulp which does not melt at a temperature of lower than 230°

C.

3. A composite film according to claim 2, wherein the short fiber has an aspect ratio of not less than 50 and a linear thermal expansion coefficient at 200-300°

C. of within ±

50×

10^-6 /°

C., and exists in the film as a planarly arranged form parallel to the film plane.

4. A composite film according to claim 2, wherein the pulp is prepared from a raw fiber having a linear thermal expansion coefficient at 200-300°

C. of within ±

50×

10^-6 /°

C., and exists as a uniformly dispersed state in the film.

5. A composite film according to claim 1, wherein the low-dielectric resin is not thermally degraded at a temperature of not higher than 300°

C. and has a dielectric constant at 1 MHz of not more than 3.0.

6. A composite film according to claim 1, wherein the low-dielectric resin is selected from the group consisting of a tetrafluoroethylene resin, a perfluoroalkoxy rein, a tetrafluoroethylene-hexafluoropropylene copolymer resin, a tetrafluoroethylene-ethylene copolymer resin a vinylidene fluoride resin, and a chlorotrifluoroethylene resin.

7. A composite film according to claim 1, wherein a ratio of the low-dielectric resin is 20 to 80% by weight of said composite film.

8. A composite film according to claim 1, wherein the para-oriented aromatic polyamide is selected from the group consisting of poly(para-phenylene terephthalamide), poly(para-benzamide), poly(4,4'"'"'-benzanilide terephthalamide), poly(para-phenylene-4,4'"'"'-biphenylene dicarboxylic acid amide), poly(para-phenylene-2,6-naphthalene dicarboxylic acid amide), poly(2-chloro-para-phenylene terephthalamide), and para-phenylene diamine/2,6-dichloro-para-phenylene diamine/terephthalic acid dichloride) copolymer.

9. A flexible printed circuit board comprising the composite film according to any one of claims 1, 2, 5, 6, 7 or 8, as a base substrate.

10. A composite film according to claim 1, wherein the composite film is a porous composite film having a percentage of vacant spaces of 30 to 95 volume %.

11. A prepreg comprising a porous composite film according to claim 10, wherein the composite film is impregnated with a thermoplastic resin and/or a thermosetting resin.

12. A prepreg according to claim 11, wherein the thermoplastic resin is selected from the group consisting of a polyether sulfone, a polysulfone, a polyether imide, a polysulfide sulfone, and a polycarbonate.

13. A prepreg according to claim 11, wherein the thermosetting resin is selected from the group consisting of an epoxy resin a bismaleimide-triazine resin, a polyimide resin, a diallyl phthalate resin, an unsaturated polyester resin, a cyanate resin, and an aryl-modified polyphenylene ether resin.

14. A base substrate for a printed circuit board comprising a prepreg according to any one of claims 11 to 13.

15. A laminated board for a printed circuit board comprising the base substrate for a printed circuit board of claim 14 as an insulating layer and a metallic foil as a conductive layer.

16. A process of manufacturing the composite film of claim 1 comprising:

(a) obtaining a film material from a solution containing 1 to 10% by weight of a para-oriented aromatic polyamide having an inherent viscosity of 1.0 to 2.8 dl/g, 1 to 10% by weight of an alkali metal or alkaline earth metal chloride, and a low-dielectric resin in a polar amide solvent or a polar urea solvent;

(b) depositing the para-oriented aromatic polyamide from the film material;

(c) soaking the film material obtained in (b) in an aqueous solution or an alcohol solution in order to elute the solvent and the alkali metal or alkaline earth metal chloride, and then drying the resulting film material to yield a porous composite film; and

(e) rolling the porous composite film obtained in (c) to yield a composite film.