Circuit boards using heat resistant resin for adhesive layers

• US 6,121,553 A
• Filed: 10/23/1997
• Issued: 09/19/2000
• Est. Priority Date: 03/03/1997
• Status: Expired due to Term

• Current Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Original Assignee: Hitachi Chemical Company Limited (Resonac Holdings Corp.)
• Inventors: Shimayama, Yuuichi, Horiuchi, Takeshi, Kanno, Masao, Shinada, Eiichi, Tsuru, Yoshiyuki
• Primary Examiner(s): SOUGH, HYUNG SUB
• Application Number:
  US08/957,011
• Time in Patent Office: 1,062 Days
• Field of Search: 174/251, 174/255, 174/259, 174/261, 174/266, 174/52.4, 361/784, 361/792, 29/829, 29/846, 29/850, 156/182, 156/307.1, 156/307.7, 156/325, 156/330, 428/901, 428/528, 428/209
• US Class Current: 174/259
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/49109 outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49894 Materials of the insulating layers or coatings
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01068 Erbium [Er]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/30111 : matching
• CPC Class Codes: H05K 2201/0154 : Polyimide
• CPC Class Codes: H05K 2201/0355 : Metal foils
• CPC Class Codes: H05K 2201/09127 : PCB or component having an integral separable or breakable part
• CPC Class Codes: H05K 2201/10287 : Metal wires as connectors or conductors
• CPC Class Codes: H05K 2203/063 : of preperforated insulating layer
• CPC Class Codes: H05K 3/0035 : of blind holes, i.e. having a metal layer at the bottom
• CPC Class Codes: H05K 3/0094 : Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
• CPC Class Codes: H05K 3/103 : by bonding or embedding conductive wires or strips
• CPC Class Codes: H05K 3/386 : by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/429 : Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
• CPC Class Codes: H05K 3/4623 : the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards H05K3/462 takes precedence
• CPC Class Codes: H05K 3/4626 : characterised by the insulating layers or materials H05K3/4688 takes precedence
• CPC Class Codes: H05K 3/4652 : Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: H05K 3/4655 : by using a laminate characterized by the insulating layer general-purpose insulating materials H05K1/03, H05K3/4673
• CPC Class Codes: H05K 3/4697 : having cavities, e.g. for mounting components H05K3/4691 takes precedence
• CPC Class Codes: Y10S 428/901 : Printed circuit
• CPC Class Codes: Y10T 428/24917 : including metal layer

Abstract

An adhesive composition including (a) a polyamide-imide resin preferably having a molecular weight of 80,000 or more and (b) a thermosetting component preferably including an epoxy resin and a curing agent and/or a curing accelerator therefor is used for providing an insulating adhesive layer having a storage elastic modulus at 300° C. of 30 MPa or more and a glass transition temperature of 180° C. or higher. The insulating adhesive is suitable for use in wire scribed circuit boards, multilayer printed circuit boards, and circuit boards for chip carriers.

Claims

1. A multilayer printed circuit board comprising a plurality of insulating substrate having conductor circuits thereon, insulating adhesive layers interposed between these insulating substrates alternately, and a plurality of plated through holes electrically connecting conductor circuits, said insulating adhesive layer having a storage elastic modulus at 300°

C. of 30 MPa or more and a glass transition temperature of 180°

C. or higher, and made from an adhesive composition comprising a polyamide-imide resin and a thermosetting component, wherein the adhesive composition comprises (a) 100 parts by weight of said polyamide-imide resin, said polyamide-imide resin having a molecular weight of 80,000 or more, and (b) 10 to 150 parts by weight of said thermosetting component, said thermosetting component comprising an epoxy resin and a curing agent therefor and/or a curing accelerator therefor, wherein the polyamide-imide resin is an aromatic polyamide-imide resin obtained by reacting an aromatic diimide carboxylic acid, which is obtained by reacting a diamine having 3 or more aromatic rings with trimellitic anhydride, with an aromatic diisocyanate, and wherein the diamine having 3 or more aromatic rings is at least one member selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]-propane, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, bis[4-(4-aminophenoxy)phenyl]methane, 4,4-bis-(4-aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ketone, 1,3-bis(4-aminophenoxy)benzene, and 1,4-bis(4-aminophenoxy)benzene, and the aromatic diisocyanate is at least one member selected from the group consisting of 4,4'"'"'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, and 2,4-tolylene dimer.

2. A wire scribed circuit board comprising an insulating substrate having conductor circuit thereon, an insulating adhesive layer formed thereon, a plurality of wires having an insulating coating and fixed in said insulating adhesive layer, and a plurality of plated through holes formed in portions necessary for electrical connection, said insulating adhesive layer having a storage elastic modulus at 300°

C. of 30 MPa or more and a glass transition temperature of 180°

C. or higher, and made from an adhesive composition comprising a polyamide-imide resin and a thermosetting component, wherein the adhesive composition comprises (a) 100 parts by weight of the polyamide-imide resin, said polyamide-imide resin having a molecular weight of 80,000 or more, and (b) 10 to 150 parts by weight of said thermosetting component, said thermosetting component comprising an epoxy resin and a curing agent therefor and/or a curing accelerator therefor, wherein the polyamide-imide resin is an aromatic polyamide-imide resin obtained by reacting an aromatic diimide carboxylic acid, which is obtained by reacting a diamine having 3 or more aromatic rings with trimellitic anhydride, with an aromatic diisocyanate, and wherein the diamine having 3 or more aromatic rings is at least one member selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, bis[4-(4-aminophenoxy)phenyl]-methane, 4,4-bis-(4-aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ketone, 1,3-bis(4-aminophenoxy)benzene, and 1,4-bis(4-aminophenoxy)benzene, and the aromatic diisocyanate is at least one member selected from the group consisting of 4,4'"'"'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, and 2,4-tolylene dimer.

3. A circuit board for chip carrier comprising:

a plurality of insulating layers,

a plurality of interlayer substrates each having conductor circuits thereon,

a plurality of insulating adhesive layers, each insulating adhesive layer bonding each insulating layer and each interlayer substrate or each insulating layer,

a plurality of through holes having conductors on inner wall surfaces thereof and electrically connected to the conductor circuits, and

a cavity for housing at least one semiconductor chip,

each insulating adhesive layer having a storage elastic modulus at 300°

C. of 30 MPa or more and a glass transition temperature of 180°

C. or higher, and made from an adhesive composition comprising a polyamide-imide resin and a thermosetting component, wherein the adhesive composition comprises (a) 100 parts by weight of said polyamide-imide resin, said polyamide-imide resin having a molecular weight of 80,000 or more, and (b) 10 to 150 parts by weight of said thermosetting component, said thermosetting component comprising an epoxy resin and a curing agent therefor and/or a curing accelerator therefor, wherein the polyamide-imide resin is an aromatic polyamide-imide resin obtained by reacting an aromatic diimide carboxylic acid, which is obtained by reacting a diamine having 3 or more aromatic rings with trimellitic anhydride, with an aromatic diisocyanate, and wherein the diamine having 3 or more aromatic rings is at least one member selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane, bis[4-(4-aminophenoxy)-phenyl]methane, 4,4-bis-(4-aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ketone, 1,3-bis(4-aminophenoxy)benzene, and 1,4-bis(4-aminophenoxy)benzene, and the aromatic diisocyanate is at least one member selected from the group consisting of 4,4'"'"'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, and 2,4-tolylene dimer.