Semiconductor flip-chip package and method for the fabrication thereof
First Claim
1. An electrical component assembly, comprising:
- a substrate having a plurality of pads on a first surface thereof;
an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate; and
a layer of flux adhesive between a subassembly comprising the encapsulant and the electrically conductive material and the substrate.
8 Assignments
0 Petitions
Accused Products
Abstract
A simplified process for flip-chip attachment of a chip to a substrate is provided by pre-coating the chip with an encapsulant underfill material having separate discrete solder columns therein to eliminate the conventional capillary flow underfill process. Such a structure permits incorporation of remeltable layers for rework, test, or repair. It also allows incorporation of electrical redistribution layers. In one aspect, the chip and pre-coated encapsulant are placed at an angle to the substrate and brought into contact with the pre-coated substrate, then the chip and pre-coated encapsulant are pivoted about the first point of contact, expelling any gas therebetween until the solder bumps on the chip are fully in contact with the substrate. There is also provided a flip-chip configuration having a complaint solder/flexible encapsulant understructure that deforms generally laterally with the substrate as the substrate undergoes expansion or contraction. With this configuration, the complaint solder/flexible encapsulant understructure absorbs the strain caused by the difference in the thermal coefficients of expansion between the chip and the substrate without bending the chip and substrate.
231 Citations
43 Claims
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1. An electrical component assembly, comprising:
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a substrate having a plurality of pads on a first surface thereof; an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate; and a layer of flux adhesive between a subassembly comprising the encapsulant and the electrically conductive material and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 28, 29)
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9. An electrical component assembly, comprising:
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a substrate having a plurality of pads on a first surface thereof; and an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate, wherein the electrically conductive material in the plurality of holes comprises electrically conductive adhesive. - View Dependent Claims (10, 11, 12, 13, 14)
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15. An electrical component assembly, comprising:
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a substrate having a plurality of pads on a first surface thereof; and an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate, wherein a first portion of the coated encapsulant and the electrically conductive material are located on the integrated circuit chip and a second portion is located on the substrate, the first portion comprises a polymeric adhesive and a filler and the second portion is an adhesive material with solder fluxing properties. - View Dependent Claims (16, 17, 18, 19, 20)
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21. An electrical component assembly, comprising:
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a substrate having a plurality of pads on a first surface thereof; and an integrated circuit chip having an encapsulant coated on an active surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the active surface aligned with the holes through the encapsulant to the plurality of pads on the substrate, and wherein the coated encapsulant includes a printed circuit layer having electrical circuitry thereon. - View Dependent Claims (22, 23, 24, 25, 26, 27)
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30. An electrical component assembly, comprising:
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an integrated circuit chip having a plurality of pads on an active surface thereof; and a substrate having an encapsulant coated on a first surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the first surface aligned with the holes through the encapsulant to the plurality of pads on the integrated circuit chip, wherein a first portion of the coated encapsulant and the electrically conductive material are located on the substrate and a second portion is located on the integrated circuit chip, the first portion comprises a polymeric adhesive and a filler and the second portion is an adhesive material with solder fluxing properties. - View Dependent Claims (31, 32, 33, 34, 35)
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36. An electrical component assembly, comprising:
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an integrated circuit chip having a plurality of pads on an active surface thereof; and a substrate having an encapsulant coated on a first surface thereof, the encapsulant having a plurality of holes therethrough filled with an electrically conductive material that extends from contacts on the first surface aligned with the holes through the encapsulant to the plurality of pads on the integrated circuit chip, wherein the coated encapsulant includes a printed circuit layer having electrical circuitry thereon. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43)
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Specification