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Method and apparatus for establishing electrical contact between a wafer and a chuck

  • US 6,121,783 A
  • Filed: 04/22/1997
  • Issued: 09/19/2000
  • Est. Priority Date: 04/22/1997
  • Status: Expired due to Term
First Claim
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1. A method for making electrical contact between a semiconductor wafer having a dielectric layer and a wafer chuck holding said wafer, said dielectric layer having a breakdown voltage, said method comprising:

  • urging a pointed contact against said dielectric layer; and

    momentarily applying a voltage equal or greater than said breakdown voltage between said contact and said chuck, thereby creating an ohmic connection between said wafer and said chuck.

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