System for the measurement of acceleration in three axes

• US 6,122,965 A
• Filed: 12/01/1997
• Issued: 09/26/2000
• Est. Priority Date: 11/30/1996
• Status: Expired due to Term

• Current Assignee: Temic Telefunken Microelectronic GmbH (Continental AG)
• Original Assignee: Temic Telefunken Microelectronic GmbH (Continental AG), Daimler Chrysler Company LLC (Stellantis NV)
• Inventors: Schalk, Josef, Prechtel, Ulrich, Seidel, Helmut
• Primary Examiner(s): MOLLER, RICHARD ALAN
• Application Number:
  US08/980,795
• Time in Patent Office: 1,030 Days
• Field of Search: 73/514.01, 73/514.16, 73/514.33, 73/514.36, 73/514.35, 73/514.32
• US Class Current: 73/514.36
• CPC Class Codes: G01P 15/18 in two or more dimensions
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: G01P 2015/0845 using a plurality of spring-mass systems being arranged on one common planar substrate, the systems not being mechanically coupled and the sensitive direction of each system being different

Abstract

A system for measuring acceleration in three axes comprises four individual sensors arranged in a rectangle on a common substrate with each having one main sensitivity axis. Each individual sensor has a seismic mass in the form of a cantilevered paddle connected by a bending beam to an outer frame and having a center of gravity. Each beam is arranged parallel to the substrate surface and each contains means for measuring the bending that occurs when acceleration forces act upon the system. The actual acceleration occurring on each axis can then be determined as a function of the error angle formed between the sensitivity axis and the normal to the substrate surface.

Claims

1. A system for the measurement of accelerations, comprising:

a substrate, said substrate including

a substantially rectangular frame having first, second, third and fourth sides, said first and third sides being opposite each other, and said second and fourth sides being orthogonal to said first and third sides;

first, second, third and fourth sensors arranged in a rectangle on a surface of said substrate, each of said sensors including

a seismic mass in the form of a paddle having a main sensitivity axis which passes through a center of gravity of said paddle and is displaced from an axis normal to a surface of said paddle by an error angle, the direction of the main sensitivity axis of the paddle of each of said first, second, third and fourth sensors extending in a different direction;

a bending beam extending in a plane parallel to the surface of said substrate attached to said paddle and a respective side of said outer frame, the paddles of said first, second, third and fourth sensors being cantilevered from the first, second, third and fourth sides respectively of said outer frame by first, second, third and fourth bending beams; and

means secured to the bending beam of each of said first, second, third and fourth sensors for measuring a deflection of the seismic mass attached thereto.

2. A system according to claim 1 wherein said error angle corresponds to the displacement of said seismic mass from the plane of said bending beam during acceleration of said mass.

3. A system according to claim 1 wherein said error angle is between 10 degrees and 20 degrees.

4. A system according to claim 2 wherein said error angle is between 10 degrees and 20 degrees.

5. A system according to claim 1 wherein said means secured to the bending beam of each of said four sensors comprises four piezoresistors.

6. A system according to claim 5 wherein said four piezoresistors form a Wheatstone resistance bridge.

7. A system according to claim 1 which further comprises a lower covering wafer affixed to said substrate, an air gap being provided between said lower covering wafer and each of said paddles so that when accelerated the paddles are deflected in the direction of said wafer.

8. A system according to claim 1 wherein the substrate and all components thereof are made of silicon.

9. A system according to claim 5 wherein said paddles and bending beams are formed in said substrate by an etching process, and wherein said piezoresistors are adhered to the bending beams by a diffusion process, said system being produced micromechanically.