Lan patch panel and wall mount unit assembly

• US 6,123,577 A
• Filed: 02/06/1997
• Issued: 09/26/2000
• Est. Priority Date: 02/06/1996
• Status: Expired due to Fees

• Current Assignee: Energy Transformation Systems Incorporated
• Original Assignee: Energy Transformation Systems Incorporated
• Inventors: Contois, Dennis R., Andresen, Jack, Christenson, Paul E.
• Primary Examiner(s): NGUYEN, KHIEM M
• Application Number:
  US08/797,486
• Time in Patent Office: 1,328 Days
• Field of Search: 174/53, 174/54, 361/761, 361/763, 361/766, 439/44, 439/47, 439/395, 439/404, 439/532, 439/535, 439/536, 439/540.1, 439/76.1, 439/676, 439/941
• US Class Current: 439/535
• CPC Class Codes: H01R 13/518 for holding or embracing several coupling parts, e.g. frames
• CPC Class Codes: H01R 13/6464 by adding capacitive elements
• CPC Class Codes: H01R 13/6658 on printed circuit board H01R13/6666 - H01R13/6691 take precedence
• CPC Class Codes: H01R 24/64 for high frequency, e.g. RJ 45
• CPC Class Codes: H04Q 1/14 Distribution frames
• CPC Class Codes: H04Q 2201/12 Printed circuits
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence

Abstract

The present invention discloses a new and novel patch panel and wall unit assembly for use in local area network (LAN) wiring and installation. The patch panels and wall units include a new printed circuit board designed to simplify the installation of LAN'"'"'s. The patch panels are designed to more closely mimic the wall unit configuration so that more understandable wiring layouts can be presented during LAN wiring installation.

Claims

1. A compact assembly for use with wiring node interconnection in a data network, using high performance data cable, comprising:

a patch panel having

at least one pair of 110 blocks;

modular jacks, said modular jacks arrayed in pairs between said pair of 110 blocks and arranged in vertical rows;

said 110 blocks arranged in pairs in vertical rows, each pair comprising one rack unit;

a first multilayer printed circuit board electrically connected to said modular jacks and said 110 blocks,

an information outlet having

a multiplicity of pairs of modular jacks;

a multiplicity of pairs of 110 blocks;

a second printed circuit board electrically identical to said first board and electrically connected to said jacks and said blocks.

2. The assembly of claim 1, wherein said information outlet includes a snap fitted molded wall plate covering said second printed circuit board.

3. The assembly of claim 1, wherein said information outlet jacks are arranged vertically corresponding to two of said vertical mounted modular jacks of said patch panel.

5. The assembly of claim 3, wherein said patch panel has a first set of labels and said information outlet has a second label, said second label corresponding to one of said first set of labels.

6. The assembly of claim 1, wherein said information outlet is preassembled.

7. The assembly of claim 1, wherein said first printed circuit board and said second printed circuit board includes lumped capacitive elements symmetrically applied to two of the wires which are the twisted pair, said capacitance being close to said modular jacks of said patch panel and said modular jacks of said information outlet.

8. The assembly of claim 7, wherein said capacitance is close to said 110 blocks.

9. The assembly of claim 7, wherein there is further included small capacitance between pins 1 and 4 of said modular jacks of said patch panel and said modular jacks of said information outlet.

10. The assembly of claim 7, wherein there is further included small capacitance between pins 5 and 8 of said modular jacks of said patch panel and said modular jacks of said information outlet.

13. The assembly of claim 1, wherein said 110 blocks are presfitted onto said second printed circuit board.

14. The assembly of claim 13, wherein said 110 blocks are presfitted onto said first printed circuit board.

15. The assembly of claim 14, wherein said modular jacks of said information outlet are wave soldered onto said second printed circuit board.

16. The assembly of claim 15, wherein said modular jacks of said patch panel are wave soldered onto said first printed circuit board.

31. The assembly of claim 1, wherein said first multilayer printed circuit board includes crosstalk cancellation means for cancelling crosstalk, said first multilayer printed circuit board being electrically connected with said crosstalk cancellation means to said modular jacks and said 110 blocks.

4. An assembly for use with wiring node interconnections in a local area network using unshielded, twisted pair telephone wire, comprising:

a patch panel having

modular jacks, said modular jacks arranged in short vertical rows extending the width of said panel;

110 blocks;

a first printed circuit board electrically connected to said modular jacks and said 110 blocks;

an information outlet having

a jack having means to attach to the wire;

a 110 block;

a second printed circuit board electrically connected to said jack and said block;

said jack having means for being electrically connected to one of said modular jacks;

said information outlet includes a second jack, said jacks being arranged vertically corresponding to two of said vertical mounted modular jacks of said patch panel; and

wherein said second printed circuit board includes a second printed circuit, and said first printed circuit board includes a first printed circuit for each two of said modular jacks;

said first printed circuit and said second printed circuit being substantially identical.

11. An assembly for use with wiring node interconnections in a local area network using unshielded, twisted pair telephone wire, comprising:

a patch panel having

modular jacks, said modular jacks arranged in short vertical rows extending the width of said panel;

110 blocks;

a first printed circuit board electrically connected to said modular jacks and said 110 blocks;

an information outlet having

a jack having means to attach to the wire;

a 110 block;

a second printed circuit board electrically connected to said jack and said block;

said jack having means for being electrically connected to one of said modular jacks;

said first printed circuit board and said second printed circuit board includes lumped capacitive elements symmetrically applied to two of the wires which are the twisted pair, said capacitance being close to said modular jacks and said jack; and

wherein said first and second printed circuit boards have a copper clad inner core, and a top and bottom layer said capacitance layers being placed on said copper clad inner core and having connecting traces on said top and bottom layer.

12. The assembly of claim 11, wherein said capacitance is located on the sides of said copper core inner core.

17. An assembly for use with wiring node interconnections in a local area network using unshielded, twisted pair telephone wire, comprising:

a patch panel having

modular jacks;

110 blocks;

a first printed circuit board electrically connected to said modular jacks and said 110 blocks;

an information outlet having

a jack having means to attach to the wire;

a 110 block;

a second printed circuit board electrically connected to said jack and said block;

said jack having means for being electrically connected to one of said modular jacks;

said first printed circuit board and said second printed circuit board include lumped capacitive elements symmetrically applied to two of the wires which are the twisted pair, said capacitance being close to said modular jacks and said jack;

said first and second printed circuit boards have a copper clad inner core, and a top and bottom layer, said capacitance being placed on said copper clad inner core and having connecting traces on said top and bottom layers; and

said capacitance is located on the sides of said copper clad inner core.

18. The assembly of claim 17, wherein said capacitance is close to said 110 blocks.

19. The assembly of claim 17, wherein there is further included small capacitance between pins 1 and 4 of said modular jacks and said jack.

20. The assembly of claim 17, wherein there is further included small capacitance between pins 5 and 8 of said modular jacks and said jack.

21. The assembly of claim 17, wherein said information outlet includes a snapfitted molded wall plate covering said fitted molded wall plate covering said second printed circuit board.

22. The assembly of claim 17, wherein

said information outlet includes a second jack;

said modular jacks being arranged in short vertical rows extending the width of said panel; and

said jacks being arranged vertically corresponding to two of said vertical mounted modular jacks, of said patch panel.

23. The assembly of claim 22 wherein said second printed circuit board includes a second printed circuit, and said first printed circuit board includes a first printed circuit for each two of said modular jacks;

said first printed circuit and said second printed circuit being substantially identical.

24. The assembly of claim 22, wherein said patch panel has a first set of labels and said information outlet has a second label, said second label corresponding to one of said first set of labels.

25. The assembly of claim 17, wherein said information outlet is preassembled.

26. The assembly of claim 17, wherein said first printed circuit board and said second printed circuit include means for suppressing crosstalk.

27. The assembly of claim 17, wherein said 110 block is presfitted onto said second printed circuit board.

28. The assembly of claim 27, wherein said 110 blocks are presfitted onto said first printed circuit board.

29. The assembly of claim 28, wherein said jack is wave soldered onto said second printed circuit board.

30. The assembly of claim 29, wherein said modular jacks are wave soldered onto said first printed circuit board.