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Reaction chamber component having improved temperature uniformity

  • US 6,123,775 A
  • Filed: 06/30/1999
  • Issued: 09/26/2000
  • Est. Priority Date: 06/30/1999
  • Status: Expired due to Term
First Claim
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1. A temperature controlled component useful in a reaction chamber for processing a semiconductor substrate, comprising:

  • a heat sink;

    a heated member comprising a showerhead or sputter target support supported by the heat sink; and

    a heat transfer member in thermal contact with the heat sink and a localized region of the heated member at which temperature buildup is highest across the heated member.

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