Copper wire and process for making copper wire
First Claim
1. A process for making copper wire comprising:
- (A) cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a thickness of about 10 to about 250 microns and a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by having the property of a fatigue ductility of at least about 25% when it is annealed at 177°
C. for 15 minutes; and
(B) shaping said strand of wire to provide said strand with desired cross-sectional shape and size.
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Accused Products
Abstract
This invention relates to copper wire having a substantially uniform unoriented grain structure that is essentially columnar grain free. This invention also relates to a process for making copper wire comprising: cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by a fatigue ductility of at least about 25% after being annealed at 177° C. for 15 minutes; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size. This invention also relates to a process for making copper wire comprising: flowing an aqueous electrolyte solution between an anode and a cathode and applying an effective amount of voltage across the anode and the cathode to deposit copper foil on the cathode, said electrolyte solution being characterized by a chloride ion concentration of up to about 5 ppm and an organic additive concentration of up to about 0.2 ppm; cutting said foil to form at least one strand of wire; and shaping said strand of wire to provide said strand with desired cross-sectional shape and size.
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Citations
21 Claims
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1. A process for making copper wire comprising:
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(A) cutting copper foil to form at least one strand of copper wire, said copper foil being an annealable electrodeposited copper foil having a thickness of about 10 to about 250 microns and a substantially uniform unoriented grain structure that is essentially columnar grain free, said foil being characterized by having the property of a fatigue ductility of at least about 25% when it is annealed at 177°
C. for 15 minutes; and(B) shaping said strand of wire to provide said strand with desired cross-sectional shape and size. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification