FET with source-substrate connection and method for producing the FET
First Claim
1. An FET with a source-substrate connection and a trench gate, comprising:
- a semiconductor substrate of a first conductivity type;
a semiconductor layer of the first conductivity type disposed on said semiconductor substrate, said semiconductor layer having first and second surfaces;
a drain zone of the first conductivity type disposed on said first surface of said semiconductor layer;
a trench gate substantially penetrating said semiconductor layer, said trench gate having an end and defining a region next to said trench gate on said second surface of said semiconductor layer;
a source zone of the first conductivity type disposed at said end of said trench gate on said second surface of said semiconductor layer, said source zone having a surface;
a semiconductor zone of the second conductivity type disposed in said region next to said trench gate on said second surface of said semiconductor layer, said semiconductor zone having a surface forming said second surface of said semiconductor layer together with said surface of said source zone; and
a buried highly conductive layer disposed between said second surface of said semiconductor layer and said semiconductor substrate.
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Accused Products
Abstract
An FET with a source-substrate connection (source-down FET) and a trench gate includes a drain zone of a first conductivity type provided on a first surface of a semiconductor layer of the first conductivity type that is disposed on a semiconductor substrate of the first conductivity type. The trench gate substantially penetrates the semiconductor layer. A source zone of the first conductivity type is provided at an end of the trench on a second surface of the semiconductor layer. A semiconductor zone of the second conductivity type is provided in a region next to the trench on the second surface of the semiconductor layer. The semiconductor zone has a surface which forms the second surface of the semiconductor layer together with the surface of the source zone. A method for producing the FET is also provided.
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Citations
26 Claims
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1. An FET with a source-substrate connection and a trench gate, comprising:
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a semiconductor substrate of a first conductivity type; a semiconductor layer of the first conductivity type disposed on said semiconductor substrate, said semiconductor layer having first and second surfaces; a drain zone of the first conductivity type disposed on said first surface of said semiconductor layer; a trench gate substantially penetrating said semiconductor layer, said trench gate having an end and defining a region next to said trench gate on said second surface of said semiconductor layer; a source zone of the first conductivity type disposed at said end of said trench gate on said second surface of said semiconductor layer, said source zone having a surface; a semiconductor zone of the second conductivity type disposed in said region next to said trench gate on said second surface of said semiconductor layer, said semiconductor zone having a surface forming said second surface of said semiconductor layer together with said surface of said source zone; and a buried highly conductive layer disposed between said second surface of said semiconductor layer and said semiconductor substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification