Apparatus and method for testing semiconductor devices formed on a semiconductor wafer
First Claim
1. A testing apparatus for testing semiconductor devices formed on a semiconductor wafer, comprising:
- a main chuck having a surface on which a semiconductor wafer is placed;
a contactor which is brought into contact with the semiconductor wafer, said contactor having probe terminals which are simultaneously brought into electric contact with a plurality of semiconductor devices formed on the semiconductor wafer;
a reliability test mechanism configured to test reliability of the semiconductor devices;
an electric characteristic configured to test electric characteristics of the semiconductor devices; and
a switch mechanism configured to switch between the reliability test mechanism and the electric characteristic test mechanism such that the reliability test mechanism and the electric characteristic test mechanism are sequentially connected to the contactor when the contactor is in contact with the semiconductor wafer placed on the main chuck.
1 Assignment
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Accused Products
Abstract
The present specification and drawings disclose a testing apparatus designed for testing semiconductor elements formed on a semiconductor wafer. The testing apparatus comprises a main chuck having a surface on which a semiconductor wafer is placed, a contactor which is brought into contact with the semiconductor wafer, the contactor having probe terminals which are simultaneously brought into electric contact with a plurality of semiconductor elements formed on the semiconductor wafer, a reliability test mechanism for testing reliability of the semiconductor elements, an electric characteristic test mechanism for testing electric characteristics of the semiconductor element, and a switch mechanism for switching between the reliability test mechanism and the electric characteristic test mechanism such that the reliability test mechanism and the electric characteristic test mechanism are sequentially connected to the contactor when this contactor is in contact with the semiconductor wafer placed on the main chuck.
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Citations
10 Claims
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1. A testing apparatus for testing semiconductor devices formed on a semiconductor wafer, comprising:
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a main chuck having a surface on which a semiconductor wafer is placed; a contactor which is brought into contact with the semiconductor wafer, said contactor having probe terminals which are simultaneously brought into electric contact with a plurality of semiconductor devices formed on the semiconductor wafer; a reliability test mechanism configured to test reliability of the semiconductor devices; an electric characteristic configured to test electric characteristics of the semiconductor devices; and a switch mechanism configured to switch between the reliability test mechanism and the electric characteristic test mechanism such that the reliability test mechanism and the electric characteristic test mechanism are sequentially connected to the contactor when the contactor is in contact with the semiconductor wafer placed on the main chuck. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A testing method for testing semiconductor devices formed on a semiconductor wafer, comprising the steps of:
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placing a semiconductor wafer on a main chuck; bringing a contactor into contact with the semiconductor wafer, said contactor having probe terminals which are simultaneously brought into electric contact with electrodes of a plurality of semiconductor devices formed on the semiconductor wafer; executing a reliability test by use of the contactor which is in contact with the semiconductor wafer; and executing an electric characteristic test by use of the contactor which is in contact with the semiconductor wafer. - View Dependent Claims (8, 9, 10)
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Specification