×

Apparatus and method for testing semiconductor devices formed on a semiconductor wafer

  • US 6,124,725 A
  • Filed: 11/25/1998
  • Issued: 09/26/2000
  • Est. Priority Date: 11/29/1997
  • Status: Expired due to Fees
First Claim
Patent Images

1. A testing apparatus for testing semiconductor devices formed on a semiconductor wafer, comprising:

  • a main chuck having a surface on which a semiconductor wafer is placed;

    a contactor which is brought into contact with the semiconductor wafer, said contactor having probe terminals which are simultaneously brought into electric contact with a plurality of semiconductor devices formed on the semiconductor wafer;

    a reliability test mechanism configured to test reliability of the semiconductor devices;

    an electric characteristic configured to test electric characteristics of the semiconductor devices; and

    a switch mechanism configured to switch between the reliability test mechanism and the electric characteristic test mechanism such that the reliability test mechanism and the electric characteristic test mechanism are sequentially connected to the contactor when the contactor is in contact with the semiconductor wafer placed on the main chuck.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×