Semiconductor chip kit having frequency converter function

• US 6,125,451 A
• Filed: 06/11/1998
• Issued: 09/26/2000
• Est. Priority Date: 06/13/1997
• Status: Expired due to Fees

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Fukunaga, Takashi
• Primary Examiner(s): Elmore, Reba I.
• Assistant Examiner(s): Mai, Rijue
• Application Number:
  US09/095,892
• Time in Patent Office: 838 Days
• Field of Search: 713/500, 713/600, 713/601, 713/400, 713/501-503, 708/103, 341/61, 341/100, 358/13, 375/40, 375/371, 377/47, 712/10, 712/11, 712/221, 710/25
• US Class Current: 713/500
• CPC Class Codes: G06F 1/06 Clock generators producing several clock signals G06F1/08 - G06F1/14 take precedence
• CPC Class Codes: G06F 1/10 Distribution of clock signals , e.g. skew
• CPC Class Codes: H03K 23/667 by switching the base during a counting cycle

Abstract

A clock frequency converter circuit 30 is provided in a first IC 21 within a semiconductor chip kit SCK. Input clock signals CK1 different in clock frequency introduced from a clock generator 10 are converted into an output clock signal CK2 with a predetermined specific clock frequency in the clock frequency converter circuit 30, and the output clock signal CK2 is used as an activating clock signal of the fist IC 21, second IC 22 and third IC 23. Thus, the semiconductor chip kit can easily cope with changes in clock frequency of the input clock signal CK1.

Claims

1. A semiconductor chip kit, comprising:

a clock frequency converter circuit having a clock frequency change over switch which is switched depending on a frequency of an input clock signal having any one of different clock frequencies,

wherein said clock frequency converter circuit frequency-converts said input clock signal into an output clock signal having a predetermined specific clock frequency,

said clock frequency converter circuit includes a plurality of divider circuits for dividing the frequency of said input clock signal by different divisional ratios,

said divider circuits being connected in parallel,

one of said divider circuits being selected depending on the switching of said clock frequency change over switch to convert the clock frequency of said input clock signal into said specific clock frequency,

said semiconductor chip kit further comprises one or more integrated circuits supplied with and activated by said output clock signal from said clock frequency converter circuit, and

said integrated circuits are operative only when said integrated circuits receive said output clock signal of said specific clock frequency.

2. The semiconductor chip kit according to claim 1, further comprising an additional divider circuit in common serial connection with said plurality of divider circuits connected in parallel.

3. The semiconductor chip kit according to claim 2, wherein said clock frequency converter circuit includes:

a first internal switch inputting said input clock signal and outputting said input clock signal to one of said divider circuits, said first internal switch being switched by said clock frequency changeover switch; and

a second internal switch inputting said output clock signal from said one of said divider circuits and outputting said output clock signal to said additional divider circuit, said second internal switch being switched by said clock frequency changeover switch.

4. The semiconductor chip kit according to claim 2, wherein said specific clock frequency is a common divisor of said clock frequencies of said input clock signal.

5. The semiconductor chip kit according to claim 2, wherein said specific clock frequency is the greatest common divisor of said clock frequencies of said input clock signal.

6. The semiconductor chip kit according to claim 1, wherein said clock frequency converter circuit is provided within said integrated circuit, said output clock signal with said specific clock frequency being output from said integrated circuit to another integrated circuit.

7. The semiconductor chip kit according to claim 6, wherein said clock frequency converter circuit provided within said integrated circuit supplies said output clock signal directly to all of other said integrated circuits provided in said semiconductor chip kit.

8. The semiconductor chip kit according to claim 6, wherein said clock frequency converter circuit provided within said integrated circuit supplies said output clock signal to one or some of other said integrated circuits provided in said semiconductor chip kit, the other or others of other said integrated circuits being supplied with said output clock signal through said one or some of other said integrated circuits.

9. The semiconductor chip kit according to claim 1, wherein said clock frequency converter circuit is provided independently from said integrated circuit, and supplies said output clock signal of said specific clock frequency to said integrated circuits.

10. The semiconductor chip kit according to claim 9, wherein said clock frequency converter circuit provided independently supplies said output clock signal directly to all said integrated circuits provided in said semiconductor chip kit.

11. The semiconductor chip kit according to claim 9, wherein said clock frequency converter circuit provided independently supplies said output clock signal to one or some of said integrated circuits provided in said semiconductor chip kit, and said one or some of said integrated circuits supply said output clock signal to other integrated circuits.

12. The semiconductor chip kit according to claim 1, wherein a plurality of said integrated circuits include a receiving IF-IC which receives a wireless signal from the exterior to convert it into a base band signal, and a transmission IF-IC which receives said baseband signal and supplies it as a wireless signal to the exterior.

13. The semiconductor chip kit according to claim 1, wherein a plurality of said integrated circuits include a digital receiving IF-IC which receives a digital wireless signal from the exterior to convert it into a base band signal, an analog receiving IF-IC which receives an analog wireless signal from the exterior to convert it into the base band signal, a transmission IF-IC which receives the base band signal to supply it as a wireless signal to the exterior, and a PLL-IC for supplying a local signal.

14. The semiconductor chip kit according to claim 1, wherein said clock frequency converter circuit includes:

a first internal switch inputting said input clock signal and outputting said input clock signal to one of said divider circuits, said first internal switch being switched by said clock frequency changeover switch; and

a second internal switch inputting said output clock signal from said one of said divider circuits and outputting said output clock signal to said integrated circuits, said second internal switch being switched by said clock frequency changeover switch.

15. A semiconductor chip kit, comprising:

a receiving IF-IC which receives a wireless signal and converts said wireless signal into a base band signal;

a transmission IF-IC which receives said base band signal and transmits said base band signal as a wireless signal; and

a clock frequency converter circuit provided in one of said receiving IF-IC and said transmission IF-IC,

wherein said clock frequency converter circuit has a clock frequency change over switch which is switched depending on a frequency of an input clock signal having any one of different clock frequencies,

said clock frequency converter circuit frequency-converts said input clock signal into an output clock signal having a predetermined specific clock frequency,

said clock frequency converter circuit includes a plurality of divider circuits for dividing the frequency of said input clock signal by different divisional ratios,

said divider circuits being connected in parallel,

one of said divider circuits being selected depending on the switching of said clock frequency change over switch to convert the clock frequency of said input clock signal into said specific clock frequency,

one of said receiving IF-IC and said transmission IF-IC is supplied with and activated by said output clock signal from said clock frequency converter circuit, and

one of said receiving IF-IC and said transmission IF-IC is operative only when one of said receiving IF-IC and said transmission IF-IC receive said output clock signal of said specific clock frequency.

16. The semiconductor chip kit according to claim 15, wherein said specific clock frequency is a common divisor of said clock frequencies of said input clock signals.

17. The semiconductor chip kit according to claim 15, wherein said specific clock frequency is the greatest common divisor of said clock frequencies of said input clock signals.

18. A semiconductor chip kit, comprising:

a digital receiving IF-IC which receives a digital wireless signal and converts said digital wireless signal into a base band signal;

an analog receiving IF-IC which receives an analog wireless signal and converts said analog wireless signal into the base band signal;

a transmission IF-IC which receives said base band signal and transmits said base band signal as a wireless signal;

a PLL-IC for supplying a local signal; and

a clock frequency converter circuit provided in said PLL-IC,

wherein said clock frequency converter circuit has a clock frequency change over switch which is switched depending on a frequency of an input clock signal having any one of different clock frequencies,

said clock frequency converter circuit frequency-converts said input clock signal into an output clock signal having a predetermined specific clock frequency,

said clock frequency converter circuit includes a plurality of divider circuits for dividing the frequency of said input clock signal by different divisional ratios,

said divider circuits being connected in parallel,

one of said divider circuits being selected depending on the switching of said clock frequency change over switch to convert the clock frequency of said input clock signal into said specific clock frequency,

one of said digital receiving IF-IC, said analog receiving IF-IC and said transmission IF-IC is supplied with and activated by said output clock signal from said clock frequency converter circuit, and

one of said digital receiving IF-IC, said analog receiving IF-IC and said transmission IF-IC is operative only when one of said digital receiving IF-IC, said analog receiving IF-IC and said transmission IF-IC receive said output clock signal of said specific clock frequency.

19. The semiconductor chip kit according to claim 18, wherein said specific clock frequency is a common divisor of said clock frequencies of said input clock signals.

20. The semiconductor chip kit according to claim 18, wherein said specific clock frequency is the greatest common divisor of said clock frequencies of said input clock signals.

21. A semiconductor chip kit, comprising:

a clock frequency converter circuit having a clock frequency change over switch which is switched depending on a frequency of an input clock signal having any one of different in clock frequencies,

wherein said clock frequency converter circuit frequency-converts said input clock signal into an output clock signal having a predetermined specific clock frequency,

said clock frequency converter circuit includes a plurality of divider circuits for dividing the frequency of said input clock signal into said output clock signal having said predetermined specific clock frequency which is a common divisor of clock frequencies of said input clock signal and for supplying said output clock signal,

said divider circuits being connected in parallel,

one of said divider circuits being selected depending on the switching of said clock frequency change over switch to convert the clock frequency of said input clock signal into said specific clock frequency,

said semiconductor chip kit further comprises one or more integrated circuits supplied with and activated by said output clock signal from said clock frequency converter circuit, and

said integrated circuits are operative only when said integrated circuits receive said output clock signal of said specific clock frequency.

22. A mobile wireless system using a semiconductor chip kit, said semiconductor chip kit comprising:

a clock frequency converter circuit having a clock frequency change over switch which is switched depending on a frequency of an input clock signal having any one of different clock frequencies,

wherein said clock frequency converter circuit frequency-converts said input clock signal into an output clock signal having a predetermined specific clock frequency,

said clock frequency converter circuit includes a plurality of divider circuits for dividing the frequency of said input clock signal by different divisional ratios,

said divider circuits being connected in parallel,

one of said divider circuits being selected depending on the switching of said clock frequency change over switch to convert the clock frequency of said input clock signal into said specific clock frequency,

said semiconductor chip kit further comprises one or more integrated circuits supplied with and activated by said output clock signal from said clock frequency converter circuit, and

said integrated circuits are operative only when said integrated circuits receive said output clock signal of said specific clock frequency.

23. The mobile wireless system according to claim 22, wherein said clock frequency converter circuit includes an additional divider circuit in common serial connection with said plurality of divider circuits connected in parallel.

24. The mobile wireless system according to claim 22, wherein said specific clock frequency is a common divisor of the frequencies of said input clock signals.

25. The mobile wireless system according to claim 22, wherein said specific clock frequency is the greatest common divisor of the frequencies of said input clock signals.