Method of visually inspecting positioning of a pattern on a substrate

• US 6,127,069 A
• Filed: 10/20/1998
• Issued: 10/03/2000
• Est. Priority Date: 06/06/1995
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Long, David C., LaPlante, Mark Joseph, Kapfhammer, Mark William, Balz, James Gregory
• Primary Examiner(s): Chea, Thorl
• Application Number:
  US09/175,854
• Time in Patent Office: 714 Days
• Field of Search: 430/5, 430/18, 430/945, 430/271.1, 430/318, 364/474.08, 216/65, 216/94
• US Class Current: 430/5
• CPC Class Codes: G03F 1/68 Preparation processes not covered by groups G03F1/20 - G03F1/50
• CPC Class Codes: G03F 1/84 Inspecting
• CPC Class Codes: H05K 3/0002 for manufacturing artworks for printed circuits
• CPC Class Codes: Y10S 430/146 Laser beam

Abstract

Exposure masks and inspection masks for use in the electronics field may be made using laser beams wherein the mask comprises a substrate which is substantially unaffected by exposure to the laser beam and an opaque pattern forming layer on the substrate, which pattern forming layer absorbs the laser beam and is selectively etched when exposed to the laser beam. A preferred mask has an overcoat transparent layer. A cavity inspection mask is provided having a series of openings in the form of lines formed in the opaque pattern forming layer, the lines bounding the cavity walls, is the mask being used for determining if the cavity is centrally positioned on the substrate and/or that the cavity is of the desired size. Substrates containing identifying masks thereon which cannot be seen by the unaided eye for theft deterrence are also provided.

Claims

1. A method of visually inspecting positioning of a pattern on a substrate and/or the size of a pattern on a substrate comprising:

a) providing a patterned substrate to be inspected;

b) placing thereon a mask having a pattern corresponding to the pattern of the substrate to be inspected made by the method comprising;

i) providing a transparent substrate which is substantially unaffected by a laser beam;

ii) forming an opaque mask pattern forming layer having a thickness of about 10 Å

to 5000 Å

on the substrate, the mask pattern forming layer being a material which absorbs the laser beam;

iii) exposing the layered substrate to the laser beam in a predetermined pattern to etch the desired mask pattern in the mask pattern forming layer; and

c) visually inspecting said patterned substrate using said mask.

2. The method of claim 1 wherein the patterned substrate to be inspected has at least one line cavity pattern which line is elongated and has a first cavity edge and an opposed cavity edge wherein the mask pattern comprises at least two pairs of parallel centrality openings, each pair forming parallel elongated lines with one pair bounding the first cavity edge and the other pair bounding the opposed second cavity edge of the patterned substrate to be inspected, at least two pairs of parallel elongated cavity size openings, each pair forming parallel elongated lines with one pair bounding the first cavity edge and the other pair bounding the opposed second cavity edge of the patterned substrate to be inspected;

wherein when the mask is positioned on the substrate to be inspected it can be determined if the first cavity edge and the opposed cavity edge of the line cavity pattern are centrally positioned on the substrate and/or that the cavity is of desired size.

3. A method of visually inspecting positioning of a pattern on a substrate and/or the size of a pattern on a substrate comprising:

a) providing a patterned substrate to be inspected;

b) placing thereon a mask having a pattern corresponding to the pattern of the substrate to be inspected made by the method comprising;

i) providing a transparent substrate which is substantially unaffected by the laser beam;

ii) forming an opaque mask pattern forming layer having a thickness of about 10 Å

to 5000 Å

on the surface of the transparent substrate, the opaque mask pattern forming layer being a material which absorbs the laser beam; and

iii) exposing said opaque mask forming layer to the laser beam in a mask pattern to etch the mask pattern in the opaque mask pattern forming layer;

wherein the mask pattern comprises a plurality of connected circular openings etched in the opaque mask pattern forming layer;

c) visually inspecting said patterned substrate using said mask.

4. The method of claim 3 wherein the patterned substrate to be inspected has at least one line cavity pattern which is elongated and has a first cavity edge and an opposed second cavity edge wherein the mask pattern comprises at least two pairs of parallel centrality connected circular openings, each pair forming parallel elongated lines with one pair bounding the first cavity edge and the other pair bounding the opposed second cavity edge of the patterned substrate to be inspected, at least two pairs of parallel elongated cavity size connected circular openings, each pair forming parallel elongated lines with one pair bounding the first cavity edge and the other pair bounding the opposed second cavity edge of the patterned substrate to be inspected;

wherein when the mask is positioned on the substrate to be inspected it can be determined if the first cavity edge and the opposed cavity edge of the line cavity pattern are centrally positioned on the substrate and/or that the cavity is of desired size.