Method of fabricating a fluid drop ejector

• US 6,127,198 A
• Filed: 10/14/1999
• Issued: 10/03/2000
• Est. Priority Date: 10/15/1998
• Status: Expired due to Term

• Current Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Original Assignee: Xerox Corporation (Xerox Holdings Corp.)
• Inventors: Feinberg, Kathleen A., Gooray, Arthur M., Coleman, Charles P., Roller, George J.
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): ROCCHEGIANI, RENZO
• Application Number:
  US09/416,290
• Time in Patent Office: 355 Days
• Field of Search: 438/21, 346/1.1, 346/140 R, 205/75, 347/1, 347/29, 347/20, 347/9, 347/3, 347/63, 347/68, 347/71, 216/27, 29/890.1
• US Class Current: 438/21
• CPC Class Codes: B41J 2/14314 Structure of ink jet print heads with electrostatically actuated membrane
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1626 etching
• CPC Class Codes: B41J 2/1634 laser machining
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: Y10T 29/49401 Fluid pattern dispersing device making, e.g., ink jet

Abstract

The silicon fluid ejector of the present invention includes an electrostatically actuated micromachined positive displacement mechanism consisting of a piston, piston containment structure, piston retraction mechanism and an ejection orifice. These features provide for very low cost of production, high reliability and "on demand" drop size, modulation. The fluid ejector mechanism can be easily produced via monolithic batch fabrication based on the common production technique of surface micromachining.

Claims

1. A method of fabricating a fluid drop ejector on a substrate surface, comprising the steps of:

(a) depositing a SiNi_x layer;

(b) depositing a polysilicon "0" layer;

(c) depositing a first sacrificial oxide layer;

(d) depositing a polysilicon "1" layer;

(e) depositing a second sacrificial oxide layer;

(f) depositing a polysilicon "2" layer;

(g) depositing a third sacrificial oxide layer; and

(h) depositing a polysilicon "3" layer,

the SiNi_x, polysilicon "0", first sacrificial oxide, polysilicon "1", second sacrificial oxide, polysilicon "2", and third sacrificial oxide layers comprising a containment wall;

the polysilicon "3" layer comprising a nozzle plate layer disposed on the containment wall, the nozzle plate layer including a nozzle opening;

the first sacrificial oxide and polysilicon "1" layers comprising a piston layer including a piston surface facing and substantially aligned with the nozzle opening,

the containment wall, nozzle plate layer and piston surface defining a cavity that is arranged for containing fluid,

the piston layer arranged for moving towards the nozzle opening when a fluid ejecting electric field is applied between the piston layer and the nozzle plate layer, thus causing fluid to be ejected through the nozzle opening.

2. The method of claim 1, the first sacrificial oxide layer comprising a plurality of piston springs radiating away from the piston surface and coupled to the substrate surface.

3. The method of claim 2, the plurality of piston springs comprising means for applying an ejecting signal to the piston layer.

4. The method of claim 1, the fluid comprising ink.

5. A method of fabricating a fluid drop ejector on a substrate surface, comprising the steps of:

(a) depositing a SiO₂ mask layer;

(b) depositing a SiNi_x layer;

(c) depositing a polysilicon "0" layer;

(d) depositing a first sacrificial oxide layer;

(e) depositing a polysilicon "1" layer;

(f) depositing a second sacrificial oxide layer;

(g) depositing a polysilicon "2" layer;

(h) depositing a third sacrificial oxide layer; and

(i) depositing a polysilicon "3" layer,

the SiO₂ mask, SiNi_x, polysilicon "0", first sacrificial oxide, polysilicon "1", second sacrificial oxide, polysilicon "2", and third sacrificial oxide layers comprising a containment wall;

the polysilicon "3" layer comprising a nozzle plate layer disposed on the containment wall, the nozzle plate layer including a nozzle opening;

the first sacrificial oxide and polysilicon "1" layers comprising a piston layer including a piston surface facing and substantially aligned with the nozzle opening,

the containment wall, nozzle plate layer and piston surface defining a cavity that is arranged for containing fluid,

the piston layer arranged for moving towards the nozzle opening when a fluid ejecting electric field is applied between the piston layer and the nozzle plate layer, thus causing fluid to be ejected through the nozzle opening.

6. The method of claim 5, the first sacrificial oxide layer comprising a plurality of piston springs radiating away from the piston surface and coupled to the substrate surface.

7. The method of claim 6, the plurality of piston springs comprising means for applying an ejecting signal to the piston layer.

8. The method of claim 5, the fluid comprising ink.