Thermoplastic resin composition and heat-resistant tray for IC

• US 6,127,492 A
• Filed: 05/11/1999
• Issued: 10/03/2000
• Est. Priority Date: 05/13/1998
• Status: Active Grant

• Current Assignee: Sumitomo Chemical Company Limited
• Original Assignee: Sumitomo Chemical Company Limited
• Inventors: Nakamura, Hiroshi, Nagashima, Tohru, Maeda, Mituo
• Primary Examiner(s): Boykin, Terressa M.
• Application Number:
  US09/309,256
• Time in Patent Office: 511 Days
• Field of Search: 528/196, 528/198, 528/271, 528/272, 525/461
• US Class Current: 525/461
• CPC Class Codes: C08K 3/04 Carbon
• CPC Class Codes: C08K 7/06 Elements
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 69/00 Compositions of polycarbonates; Compositions of derivatives of polycarbonates
• CPC Class Codes: C08L 81/06 Polysulfones; Polyethersulfones

Abstract

A thermoplastic resin composition in which 5 to 45 parts by weight of carbon fiber and 0.1 to 10 parts by weight of conductive carbon black are compounded per 100 parts by weight of resin components comprising an aromatic polycarbonate resin and an aromatic polysulfone resin. The thermoplastic resin composition is excellent in heat-resistance and mechanical strength, and heat-resistant IC trays therefrom are useful products which can endure drying of IC at high temperature and are excellent in handling properties.

Claims

1. A thermoplastic resin composition in which 5 to 45 parts by weight of carbon fiber and 0.1 to 10 parts by weight of conductive carbon black having a DBP (dibutyl phthalate) oil absorption of 150 ml/100 g or more are compounded per 100 parts by weight of resin components comprising 15 to 55% by weight of an aromatic polycarbonate resin and 85 to 45% by weight of an aromatic polysulfone resin.

2. The thermoplastic resin composition according to claim 1, wherein the ratio (η

a/η

b) of the melt viscosity (η

a) of the aromatic polycarbonate resin to the melt viscosity (η

b) of the aromatic polysulfone resin as defined below is from 0.5 to 2.0;

η

a;

melt viscosity of an aromatic polycarbonate resin measured at a temperature of 340°

C. and a shearing rate of 1216/second;

η

b;

melt viscosity of an aromatic polysulfone resin measured at a temperature of 340°

C. and a shearing rate of 1216/second.

3. The thermoplastic resin composition according to claim 2, wherein the ratio (η

a/η

b) is from 0.8 to 1.8.

4. The thermoplastic resin composition according to claim 1, 2 or 3, wherein the aromatic polycarbonate resin is a copolycarbonate or homopolycarbonate using at least 30 mol % or more of bisphenol A as a raw material thereof.

5. The thermoplastic resin composition according to claim 1, 2 or 3, wherein the aromatic polysulfone resin contains 80 mol % or more of a repeating unit represented by the following formula:

##STR5##

6. A heat-resistant tray for IC obtained by molding the thermoplastic resin composition of claim 1, 2 or 3.