Semiconductor device having an SOI structure and manufacturing method therefor
First Claim
Patent Images
1. An insulated-gate semiconductor device having an SOI structure, said device comprising:
- a source region, a drain region and a channel forming region which are formed by using a crystalline semiconductor formed on an insulative substrate or an insulating layer; and
a gate insulating film and a gate electrode formed on the channel forming region,said channel forming region comprising;
carrier moving regions; and
impurity regions formed artificially and locally for pinning of a depletion layer developing from the drain region toward the channel forming region and the source region, said impurity regions containing an impurity element for shifting an energy band in such a direction that movement of electrons is obstructed.
1 Assignment
0 Petitions
Accused Products
Abstract
A fine semiconductor device having a short channel length while suppressing a short channel effect. Linearly patterned or dot-patterned impurity regions 104 are formed in a channel forming region 103 so as to be generally parallel with the channel direction. The impurity regions 104 are effective in suppressing the short channel effects. More specifically, the impurity regions 104 suppress expansion of a drain-side depletion layer, so that the punch-through phenomenon can be prevented. Further, the impurity regions cause a narrow channel effect, so that reduction in threshold voltage can be lessened.
640 Citations
35 Claims
-
1. An insulated-gate semiconductor device having an SOI structure, said device comprising:
-
a source region, a drain region and a channel forming region which are formed by using a crystalline semiconductor formed on an insulative substrate or an insulating layer; and a gate insulating film and a gate electrode formed on the channel forming region, said channel forming region comprising; carrier moving regions; and impurity regions formed artificially and locally for pinning of a depletion layer developing from the drain region toward the channel forming region and the source region, said impurity regions containing an impurity element for shifting an energy band in such a direction that movement of electrons is obstructed. - View Dependent Claims (5, 6, 7, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 21, 22)
-
-
2. An insulated-gate semiconductor device having an SOI structure, said device comprising:
-
a single crystal semiconductor substrate; an insulating layer in the single crystal substrate; a crystalline semiconductor on the insulating layer; a source region, a drain region, and a channel forming region being formed in the crystalline semiconductor, each of the source and drain regions including a first impurity; and a gate insulating film and a gate electrode being formed on the channel forming region, said channel forming region comprising; a plurality of carrier moving regions; and a plurality of impurity regions being formed artificially and locally for pinning of a depletion layer developing from the drain region toward the channel forming region and the source region, said impurity regions including a second impurity for shifting an energy band in such a direction that movement of holes is obstructed, wherein the second impurity has an opposite conductivity to the first impurity. - View Dependent Claims (8, 9, 23, 24)
-
-
3. An insulated-gate semiconductor device having an SOI structure, said device comprising:
-
a source region, a drain region and a channel forming region which are formed by using a crystalline semiconductor formed on an insulative substrate or an insulating layer; and a gate insulating film and a gate electrode formed on the channel forming region, said channel forming region comprising; carrier moving regions; and impurity regions formed artificially and locally by adding an impurity element to control a threshold voltage to a given value, said impurity element shifting an energy band in such a direction that movement of electrons is obstructed. - View Dependent Claims (20)
-
-
4. An insulated-gate semiconductor device having an SOI structure, said device comprising:
-
a single crystal semiconductor substrate; an insulating layer in the single crystal substrate; a crystalline semiconductor on the insulating layer; a source region, a drain region and a channel forming region being formed in the crystalline semiconductor, each of the source and drain regions including a first impurity; and a gate insulating film and a gate electrode being formed on the channel forming region, said channel forming region comprising; a plurality of carrier moving regions; and a plurality of impurity regions being formed artificially and locally by adding a second impurity to control a threshold voltage to a given value, said second impurity shifting an energy band in such a direction that movement of holes is obstructed, wherein the second impurity has an opposite conductivity to the first impurity.
-
-
25. An insulating gate semiconductor device having an SOI structure, said device comprising:
-
a single crystal semiconductor substrate; an insulating layer in the single crystal substrate; a single crystal semiconductor layer on the insulating layer; a source region, a drain region, and a channel forming region being formed in the single crystal semiconductor layer, each of the source and drain regions including a first impurity; and a gate electrode being formed over the channel forming region with a gate insulating film therebetween, said channel forming region comprising; a plurality of carrier moving regions; and a plurality of impurity regions each including a second impurity, wherein the second impurity has an opposite conductivity to the first impurity. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
-
Specification