Multi-layer piezoelectric transformer mounting device
First Claim
1. A packaged piezoelectric transformer, comprising:
- a multi-layer piezoelectric transformer;
said multi-layer piezoelectric transformer having a first piezoelectric ceramic wafer with first and second opposing electroded major faces and polarized normal to said first and second opposing electroded major faces;
said second opposing major face of said first piezoelectric ceramic wafer having a circular node thereon;
said multi-layer piezoelectric transformer having a second piezoelectric ceramic wafer with first and second opposing electroded major faces and polarized normal to said first and second opposing electroded major faces;
said second opposing major face of said second piezoelectric ceramic wafer having a circular node thereon;
said multi-layer piezoelectric transformer having an intermediate electrode layer bonded to said first major face of said first piezoelectric ceramic wafer and to said first major face of said second piezoelectric ceramic wafer;
a first conductive lead attachment plate having a first surface and a second surface, said first surface having a first leg having a circular segment footprint extending therefrom adapted to contact said circular node on said second opposing major face of said first piezoelectric ceramic layer; and
a second conductive lead attachment plate having a first surface and a second surface, said first surface having a second leg having a circular segment footprint extending therefrom adapted to contact said circular node on said second opposing major face of said second piezoelectric ceramic layer;
said second surfaces of each of said first and second conductive lead attachment plates being sufficient to permit attachment of electrical leads thereto.
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Accused Products
Abstract
A contact device for securely and reliably attaching electrical leads to a laminated multi-layer piezoelectric transformer and comprising a pair of conductive lead attachment plates, disposed on opposite sides of the laminated multi-layer piezoelectric transformer, each having first and second surfaces, the first surface having at least one leg extending therefrom to contact the laminated multi-layer piezoelectric transformer at a node and the second surface being sufficient to permit secure and durable attachment of electrical leads thereto. A variety of geometric configurations of the contact device of the present invention suitable or adaptable to a variety of laminated multi-layer piezoelectric transformer geometries are also described. Such a device, useful for the attachment of a laminated multi-layer piezoelectric transformer to a circuit board, is also described.
10 Citations
7 Claims
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1. A packaged piezoelectric transformer, comprising:
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a multi-layer piezoelectric transformer; said multi-layer piezoelectric transformer having a first piezoelectric ceramic wafer with first and second opposing electroded major faces and polarized normal to said first and second opposing electroded major faces; said second opposing major face of said first piezoelectric ceramic wafer having a circular node thereon; said multi-layer piezoelectric transformer having a second piezoelectric ceramic wafer with first and second opposing electroded major faces and polarized normal to said first and second opposing electroded major faces; said second opposing major face of said second piezoelectric ceramic wafer having a circular node thereon; said multi-layer piezoelectric transformer having an intermediate electrode layer bonded to said first major face of said first piezoelectric ceramic wafer and to said first major face of said second piezoelectric ceramic wafer; a first conductive lead attachment plate having a first surface and a second surface, said first surface having a first leg having a circular segment footprint extending therefrom adapted to contact said circular node on said second opposing major face of said first piezoelectric ceramic layer; and a second conductive lead attachment plate having a first surface and a second surface, said first surface having a second leg having a circular segment footprint extending therefrom adapted to contact said circular node on said second opposing major face of said second piezoelectric ceramic layer; said second surfaces of each of said first and second conductive lead attachment plates being sufficient to permit attachment of electrical leads thereto. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification