Microstrip patch antenna with fractal structure

• US 6,127,977 A
• Filed: 11/07/1997
• Issued: 10/03/2000
• Est. Priority Date: 11/08/1996
• Status: Expired due to Term

• Current Assignee: Fractal Antenna Systems Inc.
• Original Assignee: Nathan Cohen
• Inventors: Cohen, Nathan
• Primary Examiner(s): Wimer, Michael C.
• Application Number:
  US08/965,914
• Time in Patent Office: 1,061 Days
• Field of Search: 343/700 MS File, 343/792.5
• US Class Current: 343/700.0MS
• CPC Class Codes: H01Q 1/36 Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/44 using equipment having another main function to serve additionally as an antenna , e.g. means for giving an antenna an aesthetic aspectH01Q1/27 - H01Q1/34 take precedence
• CPC Class Codes: H01Q 9/0407 Substantially flat resonant element parallel to ground plane, e.g. patch antenna dipole H01Q9/285; monopole H01Q9/40

Abstract

A microstrip patch antenna having reduced size is implementing by providing a substrate having on one surface a conductive fractal pattern, and having on the other surface a conductive pattern that may (but need not) also be a fractal pattern. The fractal pattern is of order N≧1, and if fractal patterns are formed on each substrate surface, the fractal family and fractal iteration number may be different. So fractalizing at least one conductive surface permits reduction of substrate dimension may be reduced to one-eighth wavelength.

Claims

1. A microstrip patch antenna including:

a substrate having spaced-apart first and second surfaces, said substrate having a thickness substantially smaller than a wavelength at a frequency to be coupled to said antenna;

a conductive pattern defining a fractal of iteration order N disposed on the first surface, wherein said fractal is defined as a superposition over at least N=1 interations of a motiff, an iteration being placement of said motif upon a base figure through at least one positioning selected from a group consisting of (i) rotation, (ii) stretching, and (iii) translation;

wherein said motif is selected from a group consisting of (i) Koch, (ii) Minkowski, (iii) Cantor, (iv) torn square, (v) Mandelbrot, (vi) Caley tree, (vii) monkey'"'"'s swing, (viii) Sierpinski gasket, and (ix) Julia; and

a conductive pattern disposed on the second surface.

2. The antenna of claim 1, wherein said pattern on said second surface defines a fractal.

3. The antenna of claim 1, wherein said motif has x-axis, y-axis coordinates for a next iteration N+1 defined by x_N+1 =f(x_N, y_N) and y_N+1 =g(x_N, y_N), where x_N, y_N are coordinates for iteration N, and where f(x,y) and g(x,y) are functions defining said motif.

4. The antenna of claim 1, wherein said antenna has a perimeter compression parameter (PC) defined by:

##EQU1## where;

space="preserve" listing-type="equation">PC=A·

log [N(D+C)]

in which A and C are constant coefficients for a given said motif, N is an iteration number, and D is a fractal dimension given by log(L)/log(r), where L and r are one-dimensional antenna element lengths before and after fractalization, respectively.

5. The antenna of claim 1, in which said antenna is fabricated in a manner selected from the group consisting of (i) forming upon an insulator substrate a conductive layer defining said fractal, (ii) forming upon a flexible insulator substrate a conductive layer defining said fractal;

(iii) forming upon a semiconductor substrate a layer of conductive material to define said fractal, and (iv) removing from a substrate having a surface covered with conductive material a portion of said conductive material to form said fractal.

6. The antenna of claim 1, wherein said substrate is sized to less than one-quarter wavelength at a frequency of radio frequency signals to be coupled to said antenna.

7. The antenna of claim 1, wherein said substrate is sized to approximately one-eighth wavelength at a frequency of radio frequency signals to be coupled to said antenna.

8. The antenna of claim 7, wherein said frequency is approximately 900 MHz.

9. A microstrip patch antenna including:

a substrate having spaced-apart first and second surfaces, said substrate having a thickness substantially smaller than a wavelength at a frequency to be coupled to said antenna;

a conductive pattern defining a fractal of iteration order N disposed on the first surface, where said fractal is defined as a superposition over at least N=1 interations of a motiff, an iteration being placement of said motif upon a base figure through at least one positioning selected from a group consisting of (i) rotation, (ii) stretching, and (iii) translation;

wherein said antenna has a perimeter compression parameter (PC) defined by;

##EQU2## where;

space="preserve" listing-type="equation">PC=A·

log [N(D+C)]

in which A and C are constant coefficients for a given said motif, N is an iteration number, and D is a fractal dimension given by log(L)/log(r), where L and r are one-dimensional antenna element lengths before and after fractalization respectively; and

a conductive pattern disposed on the second surface.

10. The antenna of claim 9, wherein said motif is selected from a family consisting of (i) Koch, (ii) Minkowski, (iii) Cantor, (iv) torn square, (v) Mandelbrot, (vi) Caley tree, (vii) monkey'"'"'s swing, (viii) Sierpinski gasket, and (ix) Julia.

15. The antenna of claim 9, wherein said antenna is fabricated in a manner selected from the group consisting of (i) forming upon an insulator substrate a conductive layer defining said fractal, (ii) forming upon a flexible insulator substrate a conductive layer defining said fractal;

(iii) forming upon a semiconductor substrate a layer of conductive material to define said fractal, and (iv) removing from a substrate having a surface covered with conductive material a portion of said conductive material to form said fractal.

11. A method of fabricating a microstrip patch antenna, the method including the following steps:

(a) providing a substrate having spaced-apart first and second surfaces and having a substrate thickness substantially smaller than a wavelength at a frequency to be coupled to said antenna;

(b) disposing on the first surface of said substrate a conductive pattern defining a fractal of iteration order N formed; and

(c) disposing on the second surface of said substrate a conductive pattern;

wherein said motif is selected from a family consisting of (i) Koch, (ii) Minkowski, (iii) Cantor, (iv) torn square, (v) Mandelbrot, (vi) Caley tree, (vii) monkey'"'"'s swing, (viii) Sierpinski gasket, and (ix) Julia.

12. The method of claim 11, wherein at step (c) said conductive pattern is formed so as to define a fractal.

13. The method of claim 11, wherein at step (b), said fractal on said first surface is defined as a superposition over at least N=1 iterations of a motif, an iteration being placement of said motif upon a base figure through at least one positioning selected from the group consisting of (i) rotation, (ii) stretching, and (iii) translation.

14. The method of claim 11, wherein said motif has x-axis, y-axis coordinates for a next iteration N+1 defined by x_N+1 =f(x_N, y_N) and y_N+1 =g(x_N, y_N), where x_N, y_N are coordinates for iteration N, and where f(x,y) and g(x,y) are functions defining said motif.

16. The method of claim 11, wherein said antenna has a perimeter compression parameter (PC) defined by:

##EQU3## where;

space="preserve" listing-type="equation">PC=A·

log [N(D+C)]

in which A and C are constant coefficients for a given said motif, N is an iteration number, and D is a fractal dimension given by log(L)/log(r), where L and r are one-dimensional antenna element lengths before and after fractalization, respectively.

17. The method of claim 11, in which said antenna is fabricated in a manner selected from the group consisting of (i) forming upon an insulator substrate a conductive layer defining said fractal, (ii) forming upon a flexible insulator substrate a conductive layer defining said fractal;

(iii) forming upon a semiconductor substrate a layer of conductive material to define said fractal, and (iv) providing a substrate having a surface covered with conductive material, and removing a portion of said conductive material to form said fractal.

18. The method of claim 11, wherein said substrate is sized to less than one-quarter wavelength at a frequency of radio frequency signals to be coupled to said antenna.

19. The method of claim 11, wherein at step (a) said substrate is sized to approximately one-eighth wavelength at a frequency of radio frequency signals to be coupled to said antenna.

20. The method of claim 19, wherein said frequency is approximately 900 MHz.

21. A method of fabricating a microstrip patch antenna, the method including the following steps:

(a) providing a substrate having spaced-apart first and second surfaces and having a substrate thickness substantially smaller than a wavelength at a frequency to be coupled to said antenna;

(b) disposing on the first surface of said substrate a conductive pattern defining a fractal of iteration order N formed; and

(c) disposing on the second surface of said substrate a conductive pattern;

wherein said antenna has a perimeter compression parameter (PC) defined by;

##EQU4## where;

space="preserve" listing-type="equation">PC=A·

log [N(D+C)]

in which A and C are constant coefficients for a given said motif, N is an iteration number, and D is a fractal dimension given by log(L)/log(r), where L and r are one-dimensional antenna element lengths before and after fractalization, respectively.

22. The method of claim 21, wherein at step (c) said conductive pattern is formed so as to define a fractal.

23. The method of claim 21, wherein said antenna is fabricated in a manner selected from the group consisting of (i) forming upon an insulator substrate a conductive layer defining said fractal, (ii) forming upon a flexible insulator substrate a conductive layer defining said fractal;

(iii) forming upon a semiconductor substrate a layer of conductive material to define said fractal, and (iv) providing a substrate having a surface covered with conductive material, and removing a portion of said conductive material to form said fractal.

24. The method of claim 21, wherein said substrate is sized to less than one-quarter wavelength at a frequency of radio frequency signals to be coupled to said antenna.

25. The method of claim 21, wherein at step (a) said substrate is sized to approximately one-eighth wavelength at a frequency of radio frequency signals to be coupled to said antenna.

26. The method of claim 25, wherein said frequency is approximately 900 MHz.