Micro-electro-mechanics systems (MEMS)
First Claim
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1. A microelectronics deformation sensor comprising:
- at least one stress sensor directly integrated on an extremity of a support of a deformable structure, said deformable structure being constructed of a single crystal material and having a reference plane, said deformable structure deforming in-plane relative to said reference plane, said at least one stress sensor sensing a stress in a vicinity of said extremity of said support and thereby quantitatively detecting a deformation of said deformable structure.
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Abstract
A microelectronics deformation sensor including at least one stress sensor directly integrated on at least one of an extremity of a supported deformable structure and a support of the deformable structure, the deformable structure being constructed of a single crystal material, the at least one stress sensor sensing a stress in a vicinity of the extremity and thereby sensing a deformation of the deformable structure.
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Citations
27 Claims
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1. A microelectronics deformation sensor comprising:
at least one stress sensor directly integrated on an extremity of a support of a deformable structure, said deformable structure being constructed of a single crystal material and having a reference plane, said deformable structure deforming in-plane relative to said reference plane, said at least one stress sensor sensing a stress in a vicinity of said extremity of said support and thereby quantitatively detecting a deformation of said deformable structure. - View Dependent Claims (2, 3, 4, 5, 7, 8, 9, 10, 11, 12, 13, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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6. A microelectronics deformation sensor comprising:
at least one stress sensor directly integrated on an extremity of a support of a deformable structure said deformable structure being constructed of a polysilicon and having a reference plane, said deformable structure deforming in-plane relative to said reference plane, said at least one stress sensor sensing a stress in a vicinity of said extremity of said support and thereby quantitatively detecting a de formation of said deformable structure.
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14. A method for sensing deformation of a microelectromechanic systems (MEMS), comprising the steps of:
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directly integrating at least one stress sensor on an extremity of a support of a deformable structure of said MEMS, said deformable structure being constructed of a single crystal material and having a reference plane, said deformable structure deforming in-plane relative to said reference plane; and sensing a stress in a vicinity of said extremity of said support with said at least one stress sensor, thereby quantitatively detecting a deformation of said deformable structure. - View Dependent Claims (27)
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15. A method for sensing deformation of a microelectromechanic systems (MEMS), comprising the steps of:
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directly integrating at least one stress sensor on an extremity of a support of a deformable structure of said MEMS, said deformable structure being constructed of a polysilicon and having a reference plane, said deformable structure deforming in-plane relative to said reference plane; and sensing a stress in a vicinity of said extremity of said support with said at least one stress sensor, thereby quantitatively detecting a deformation of said deformable structure.
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Specification