Thin film resistor for use in medical devices and method of making same
First Claim
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1. A method for providing a medical device including at least one resistor, the method comprising the steps of:
- providing a medical device having a housing;
providing one or more electrical circuits, wherein at least one of the one or more electrical circuits includes a resistor, and further wherein a composition of the resistor includes silicon, silicon carbide, and chromium diboride; and
enclosing the one or more electrical circuits within the housing of the medical device.
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Abstract
A method for forming a thin film resistor includes providing a sputter target having one or more silicon containing components and chromium diboride. For example, the one or more silicon containing components may include silicon and/or silicon carbide. The resistor film is then sputter deposited on a surface using a nitrogen containing sputter gas. The resistor material generally is sputtered to a thickness in the range of about 125 Å to about 500 Å while maintaining a desirable sheet resistance. The resistor film may be used in one or more electrical circuits, such as in an implantable medical device.
22 Citations
80 Claims
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1. A method for providing a medical device including at least one resistor, the method comprising the steps of:
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providing a medical device having a housing; providing one or more electrical circuits, wherein at least one of the one or more electrical circuits includes a resistor, and further wherein a composition of the resistor includes silicon, silicon carbide, and chromium diboride; and enclosing the one or more electrical circuits within the housing of the medical device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for providing a medical device including at least one resistor, the method comprising the steps of:
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providing a medical device having a housing; providing one or more electrical circuits, wherein at least one of the one or more electrical circuits includes a resistor, wherein a composition of the resistor includes one or more silicon containing components and chromium diboride, and further wherein the resistor has a thickness in the range of about 125 Å
to about 500 Å
; andenclosing the one or more electrical circuits within the housing of the medical device. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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- 17. A medical device comprising one or more electrical circuits, wherein at least one of the one or more electrical circuits includes a resistor, and further wherein a composition of the resistor includes silicon, silicon carbide, and chromium diboride.
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25. A medical device comprising one or more electrical circuits, wherein at least one of the one or more electrical circuits includes a resistor, wherein a composition of the resistor includes one or more silicon containing components and chromium diboride, and further wherein the resistor has a thickness in the range of about 125 Å
- to about 500 Å
. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32)
- to about 500 Å
- 33. A resistor comprising silicon, silicon carbide, and chromium diboride.
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41. A resistor comprising one or more silicon containing components and chromium diboride, wherein the resistor has a thickness in the range of about 125 Å
- to about 500 Å
. - View Dependent Claims (42, 43, 44, 45, 46, 47)
- to about 500 Å
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48. A method of forming a resistor on a surface, the method comprising the steps of:
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providing a sputter target, wherein the sputter target has a composition including one or more silicon containing components and chromium diboride; and sputter depositing a resistive material on the surface to a thickness in the range of about 125 Å
to about 500 Å
using a nitrogen containing sputter gas and the sputter target. - View Dependent Claims (49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64)
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65. A method of forming a resistor, the method comprising the steps of:
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providing a surface; exposing the surface to one or more sources of silicon, silicon carbide, chromium diboride, and nitrogen to form a resistive material on the surface; and annealing the resistive material. - View Dependent Claims (66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80)
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Specification