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Variable doping of metal plugs for enhanced reliability

  • US 6,130,156 A
  • Filed: 03/30/1999
  • Issued: 10/10/2000
  • Est. Priority Date: 04/01/1998
  • Status: Expired due to Term
First Claim
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1. A method of fabricating an interconnect comprising the steps of:

  • (a) providing a first layer of electrically conductive interconnect;

    (b) forming a via defined by walls extending to said first layer;

    (c) forming a first layer of electrically conductive metal on the walls of said via having a predetermined etch rate relative to a specific etch species; and

    (d) forming a second layer of electrically conductive metal on said first layer having an etch rate relative to said specific etch species greater than said first layer.

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