Area array (flip chip) probe card
First Claim
1. Apparatus for testing an integrated circuit (IC) die having a pattern of die bumps located thereon comprising:
- a probe card having a probe card surface;
a plurality of surface mount pads on the probe card surface arranged in a pattern substantially corresponding to the pattern of die bumps on the IC die;
a plurality of electrical probes each having a top end and a bottom end;
said plurality of electrical probes arranged in a pattern substantially corresponding to the pattern of the die bumps to be tested, each probe corresponding to a selected die bump;
said plurality of electrical probes further arranged such that in use said top end is in mechanical and electrical contact with said surface mount pads on the probe card and said bottom end is in electrical contact with said die bumps on the IC die;
a means for holding the probes together in the pattern;
a plurality of test contacts located around the periphery of the probe card surface;
means for electrically connecting each surface mount pad with a corresponding test contact; and
an integrated circuit tester having a plurality of test channels, each test channel being electrically connected to a selected test contact of the probe card, thereby forming a continuous conductive path between the integrated circuit tester and the die bumps on the IC die.
11 Assignments
0 Petitions
Accused Products
Abstract
A method and apparatus for testing an integrated circuit die including a probe card (10) having a plurality of surface mount pads (45) arranged in a pattern (50) substantially corresponding to an area array pattern of die bumps (25) on the IC die. The pads and the die bumps are respectively electrically connected to each other with conductive probes (30). A plurality of test contacts (55) located around the periphery of the probe card (10) are in electrical contact to each surface mount pad (45) with electrical traces (65). An integrated circuit tester (60) having a plurality of test channels is electrically connected to a selected test contact (55) of the probe card (10), thereby forming a continuous conductive path between the integrated circuit tester (60) and the die bumps (25) on the IC die.
23 Citations
14 Claims
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1. Apparatus for testing an integrated circuit (IC) die having a pattern of die bumps located thereon comprising:
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a probe card having a probe card surface; a plurality of surface mount pads on the probe card surface arranged in a pattern substantially corresponding to the pattern of die bumps on the IC die; a plurality of electrical probes each having a top end and a bottom end; said plurality of electrical probes arranged in a pattern substantially corresponding to the pattern of the die bumps to be tested, each probe corresponding to a selected die bump; said plurality of electrical probes further arranged such that in use said top end is in mechanical and electrical contact with said surface mount pads on the probe card and said bottom end is in electrical contact with said die bumps on the IC die; a means for holding the probes together in the pattern; a plurality of test contacts located around the periphery of the probe card surface; means for electrically connecting each surface mount pad with a corresponding test contact; and an integrated circuit tester having a plurality of test channels, each test channel being electrically connected to a selected test contact of the probe card, thereby forming a continuous conductive path between the integrated circuit tester and the die bumps on the IC die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. Apparatus for testing an integrated circuit die having a pattern of die bumps located thereon comprising:
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a probe card having a plurality of surface mount pads arranged in a pattern substantially corresponding to the pattern of die bumps on the IC die, a plurality of test contacts located around the periphery of the probe card, and means for electrically connecting each surface mount pad with a corresponding test contact; an integrated circuit tester having a plurality of test channels, each test channel being electrically connected to a selected test contact of the probe card; a plurality of collapsible electrical probes arranged in a pattern substantially corresponding to the pattern of the die bumps, said collapsible probes being held compressibly between said plurality of surface mount pads and said corresponding pattern of die bumps, wherein a continuous conductive path between the integrated circuit tester and the die bumps is formed. - View Dependent Claims (10)
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11. A method for testing an integrated circuit wafer having multiple integrated circuit (IC) dies formed therein, the IC dies having a pattern of die bumps located thereon, comprising the steps of:
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(a) providing a probe card having a plurality of surface mount pads arranged in a pattern substantially corresponding to the pattern of die bumps on the IC die and a plurality of test contacts located around the periphery of the probe card; (b) providing a plurality of electrical probes arranged in a pattern substantially corresponding to the pattern of the die bumps to be tested, each probe corresponding to a selected die bump and each probe having a top end and a bottom end; (c) positioning the wafer near the probe card; (d) engaging a plurality of probes with a first IC die on the wafer, the probes electrically and mechanically connecting to the surface mount pads and electrically connecting to selected ones of the die bumps, thereby forming a continuous conductive path between the test contacts and the die bumps; (e) connecting at least one test channel of an integrated circuit tester having a plurality of test channels to a selected test contact of the probe card; and (f) testing the integrated circuit die with the integrated circuit tester. - View Dependent Claims (12, 13, 14)
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Specification