Radio frequency indentification stamp and radio frequency indentification mailing label

• US 6,130,613 A
• Filed: 09/11/1998
• Issued: 10/10/2000
• Est. Priority Date: 06/09/1998
• Status: Expired due to Term

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Reyes, Fernando, Eberhardt, Noel H., Vega, Victor Allen
• Primary Examiner(s): MULLEN, THOMAS J
• Application Number:
  US09/152,202
• Time in Patent Office: 760 Days
• Field of Search: 340/572.5, 340/572.7, 340/572.8, 340/572.1, 340/825.35, 340/825.54, 340/505, 340/10.1, 235/381, 235/375, 235/101, 235/487, 705/401, 705/404, 705/406, 705/408, 705/410, 700/213, 700/225
• US Class Current: 340/572.7
• CPC Class Codes: B65D 2203/10 Transponders
• CPC Class Codes: B65D 5/4233 Cards, coupons, labels or the like formed separately from the container or lid
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: G07B 2017/00629 Circuit, e.g. transponder
• CPC Class Codes: H01L 2224/24011 Deposited, e.g. MCM-D type
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/24225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/19043 being a resistor

Abstract

A radio frequency identification stamp (10) includes a substrate (24) with a first surface (12) and a second surface (18). The first surface (12) is printed with indicia indicating at least a postage value. An antenna (16) is formed on the second surface (18) and a radio frequency identification circuit chip (20) is secured to the second surface (18) and coupled to the antenna (16). A layer (22) of adhesive is also disposed on the second surface (18). A mailing label (600) includes indicia (614) printed on a first surface, and an antenna (616) coupled to a radio frequency identification circuit chip (620) on a second surface (618). A layer (622) of adhesive covers the second surface. The layer bonds the circuit chip (620) to the second surface and couples the circuit chip (620) to the antenna (616). The circuit chip (620) may retain a tracking number, and more preferably, retains sender information (601), recipient information (602), service type information (603) and billing instructions (604).

Claims

1. A radio frequency identification stamp comprising:

a substrate having a first surface and a second surface, the first surface printed with indicia indicating at least a postage value,

a first antenna element and a second antenna element formed on the second surface of the substrate;

a radio frequency identification circuit chip, having first and second conductive pads, secured to the first and second antenna elements, and

a layer of adhesive disposed on substantially all of the second surface of the substrate and the first and second antenna elements.

2. The radio frequency identification stamp of claim 1, the layer of adhesive substantially covering the second surface including the antenna and securing the radio frequency identification circuit chip to the first and second antenna elements.

3. The radio frequency identification stamp of claim 2, the layer of adhesive comprising an anisotropic adhesive.

4. The radio frequency identification stamp of claim 1, the radio frequency identification circuit chip comprising one of an inductive coupled device and a capacitive coupled device.

5. The radio frequency identification stamp of claim 1, the radio frequency identification circuit chip including stored information, the stored information comprising at least one of a postage value, a zip code and delivery information.

6. The radio frequency identification stamp of claim 1, the radio frequency identification circuit chip arranged to receive a data signal containing at least one of a postage value and a zip code, and to retain the at least one of a postage value and a zip code as stored information.

7. The radio frequency identification stamp of claim 1, the radio frequency identification circuit chip containing stored information and, responsive to an exciter signal, arranged to generate and send a read signal comprising the stored information.

8. The radio frequency identification stamp of claim 7, the radio frequency identification circuit chip arranged to electrostatically send the read signal.

9. The radio frequency identification stamp of claim 1 wherein the radio frequency identification stamp is for use in a capacitively powered data communication system.

10. A radio frequency identification stamp, for use in a capacitively powered data communication system, comprising:

a substrate, the substrate having a first surface and a second surface, the first surface printed with indicia indicating at least a postage value,

an antenna formed on the second surface;

a radio frequency identification circuit chip secured to the second surface and coupled to the antenna, and

a layer of adhesive disposed on the second surface,

wherein a recess is formed in the second surface and the radio frequency identification circuit chip being disposed within the recess.

11. A radio frequency identification stamp, for use in a capacitively powered data communication system, comprising:

a substrate, the substrate having a first surface and a second surface, the first surface printed with indicia indicating at least a postage value,

an antenna formed on the second surface;

a radio frequency identification circuit chip secured to the second surface and coupled to the antenna, and

a layer of adhesive disposed on the second surface,

wherein the substrate comprises a laminate of a first layer and a second layer, and at least one of the first layer and the second layer formed with an aperture and the radio frequency identification circuit chip disposed within the aperture.

12. A package of radio frequency identification stamps comprising:

a plurality of radio frequency identification stamps, each radio frequency identification stamp having;

a substrate including a first surface and a second surface, the first surface printed with an indicia, the indicia at least

indicating a postage value; and

a first antenna element and a second antenna element formed on the second surface of the substrate;

a radio frequency identification circuit chip, having first and second conductive pads, secured to the first and second antenna elements; and

an adhesive layer disposed on substantially all of the second surface of the substrate and the first and second antenna elements, the adhesive layer releasably securing the plurality of radio frequency identification stamps to the package.

13. The package of radio frequency identification stamps of claim 12, the adhesive layer arranged to, upon removal of a radio frequency identification stamp from the package, permanently secure the radio frequency identification stamp to an article.

14. A radio frequency identification mailing label comprising:

a substrate having a first surface and a second surface, the first surface printed with indicia indicative of delivery information;

a first antenna element and a second antenna element formed on the second surface of the substrate;

a radio frequency identification circuit chip, having first and second conductive pads, secured to the first and second antenna elements; and

a layer of adhesive disposed on substantially all of the second surface of the substrate and the first and second antenna elements.

15. The radio frequency identification mailing label of claim 14, the layer of adhesive covering substantially the second surface of the substrate including the first and second antenna elements and securing the radio frequency identification circuit chip to the first and second antenna elements.

16. The radio frequency identification mailing label of claim 15, the layer of adhesive comprising a conductive anisotropic adhesive, the layer of adhesive further coupling the radio frequency identification circuit chip to the first and second antenna elements.

17. The radio frequency identification mailing label of claim 14 the radio frequency identification circuit chip comprising one of an inductive coupled device and a capacitive coupled device.

18. The radio frequency identification mailing label of claim 14, the radio frequency identification circuit chip including stored information, the stored information comprising at least one of a sender information, a recipient information, a delivery service information and a billing instruction.

19. The radio frequency identification mailing label of claim 14, the radio frequency identification circuit chip arranged to receive a data signal containing at least one of a sender information, a recipient information, a delivery service information and a billing instruction, and to retain the at least one of a sender information, a recipient information, a delivery service information and a billing instruction as stored information.

20. The radio frequency identification mailing label of claim 14, the radio frequency identification circuit chip containing stored information and, responsive to an exciter signal, arranged to generate and send a read signal comprising the stored information.

21. The radio frequency identification mailing label of claim 20, the radio frequency identification circuit chip arranged to electrostatically send the read signal.

22. The radio frequency identification mailing label of claim 14 wherein the radio frequency identification mailing label is for use in a capacitively powered data communication system.

23. A radio frequency identification mailing label, for use in a capacitively coupled data communication system, comprising:

a substrate, the substrate having, a first surface and a second surface, the first surface printed with indicia indicative of delivery information;

an antenna formed on the second surface and a radio frequency identification circuit chip secured to the second surface and coupled to the antenna; and

a layer of adhesive disposed on the second surface,

wherein a recess is formed in the second surface and the radio frequency identification circuit chip being disposed within the recess.

24. A radio frequency identification mailing label, for use in a capacitively coupled data communication system, comprising:

a substrate, the substrate having a first surface and a second surface, the first surface printed with indicia indicative of delivery information;

an antenna formed on the second surface and a radio frequency identification circuit chip secured to the second surface and coupled to the antenna; and

a layer of adhesive disposed on the second surface,

wherein the substrate comprises a laminate of a first layer and a second layer, and at least one of the first layer and the second layer formed with an aperture and the radio frequency identification circuit chip disposed within the aperture.