Method of manufacturing a packaging substrate

• US 6,132,543 A
• Filed: 03/13/1998
• Issued: 10/17/2000
• Est. Priority Date: 03/14/1997
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Hayama, Masaaki, Mohri, Noboru, Murakami, Tomitarou, Matsunaga, Hayami
• Primary Examiner(s): MAYES, MELVIN C
• Application Number:
  US09/041,666
• Time in Patent Office: 949 Days
• Field of Search: 156/89.12, 156/230, 156/235, 156/241, 156/237, 101/100, 101/170, 29/851
• US Class Current: 156/89.12
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via
• CPC Class Codes: H05K 2201/0949 Pad close to a hole, not surrounding the hole
• CPC Class Codes: H05K 2201/09572 Solder filled plated through-hole in the final product
• CPC Class Codes: H05K 2201/09763 Printed component having superposed conductors, but integrated in one circuit layer
• CPC Class Codes: H05K 2203/0113 Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
• CPC Class Codes: H05K 2203/043 Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• CPC Class Codes: H05K 2203/0465 Shape of solder, e.g. differing from spherical shape, different shapes due to different solder pads
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: H05K 3/207 using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: H05K 3/3457 Solder materials or compositions; Methods of application thereof
• CPC Class Codes: H05K 3/3485 : Applying solder paste, slurry or powder thick film methods for applying conductive paste or ink patterns H05K3/12
• CPC Class Codes: H05K 3/386 : by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4061 : for via connections in inorganic insulating substrates
• CPC Class Codes: Y10T 29/49163 : with sintering of base

Abstract

The present invention provides a packaged substrate which has a superior positioning accuracy of wiring formed on a circuit substrate made of ceramics, and a conductive pattern with a thick film and yet a fine pattern. On a surface of flexible base member made of plastic, fine grooves are formed in a pattern corresponding to a first conductive pattern so that a cavity face is produced. Conductive paste is filled and into the grooves on this cavity face, and then dried. The cavity face and a circuit substrate are pasted with each other by applying predetermined heat and pressure. A pattern of the dried conductive paste is transcribed onto the circuit substrate, and then the first conductive pattern is formed by firing. A first ball solder is coupled with a second conductive pattern which is coupled to the first conductive pattern through an electrode in a through-hole of the circuit substrate.

Claims

1. A method of manufacturing a packaging substrate wherein a first conductor pattern is formed by intaglio printing on a circuit substrate and a first ball-shaped solder is joined to a second conductor pattern formed on the opposite side of said circuit substrate, said method comprising processes of:

(a) forming an intaglio on the surface of a flexible material by making a patterned groove corresponding to the first conductor pattern,

(b) repeatedly filling and drying a conductive paste in the groove of said intaglio,

(c) transferring the conductive paste pattern onto the circuit substrate by bonding the intaglio with said circuit substrate through applying heat and pressure, and then peeling off said intaglio from said circuit substrate,

(d) firing said circuit substrate and said transferred conductive paste pattern,

(e) forming said second conductor pattern printed on the side of the circuit substrate opposite to said first conductor pattern,

(f) connecting said second and first conductor patterns by means of a conductive material located in a through hole of the circuit substrate, and

(g) joining the first ball-shaped solder to said second conductor pattern on the circuit substrate,

wherein a surface roughness of said circuit substrate is made larger on a printing surface of the second conductor pattern than on a printing surface of the first conductor pattern.

2. A method of manufacturing a packaging substrate according to claim 1, further comprising a process of disposing an adhesive layer between said circuit substrate and said intaglio after the process of (b).

3. A method of manufacturing a packaging substrate according to claim 2, wherein said adhesive layer comprises a thermosetting resin or, thermoplastic resin.

4. A method of manufacturing a packaging substrate according to claim 2, wherein said adhesive layer has a thickness of 20 μ

m or less.

5. A method of manufacturing a packaging substrate according to claim 1, wherein said circuit substrate comprises an unfired green sheet.

6. A method of manufacturing a packaging substrate according to claim 1, wherein said circuit substrate is formed in a multilayer wiring configuration.

7. A method of manufacturing a packaging substrate according to claim 1, further comprising processes of forming a dielectric layer on top of a portion of the first conductor pattern or the second conductor pattern, and forming a third conductor pattern on top of said dielectric layer.

8. A method of manufacturing a packaging substrate according to claim 1, further comprising processes of covering at least a portion of said first conductor pattern with a first insulating layer, and

covering at least a portion of said second conductor pattern with a second insulating layer,

said first and said second insulating layers having a thermal expansion coefficient within ±

10% of the thermal expansion coefficient of the circuit substrate.

9. A method of manufacturing a packaging substrate according to claim 8, wherein said first and said second insulating layers are formed simultaneously.

10. A method of manufacturing a packaging substrate according to claim 1, further comprising processes of filling, melting, and solidifying a second solder in the empty space of said through hole of the circuit substrate, and

joining a first ball-shaped solder to said second solder and the second conductor pattern.

11. A method of manufacturing a packaging substrate according to claim 10, further comprising a process of making the height of the second solder uniform before joining said second solder with said ball shaped solder.

12. A method of manufacturing a packaging substrate according to claim 10, wherein said second solder has a higher melting point than the first ball-shaped solder.

13. A method of manufacturing a packaging substrate according to claim 1 or claim 10, further comprising processes of forming a first insulating layer covering at least a portion of the first conductor pattern,

filling a conductive paste in a via hole portion of said first insulating layer, and

forming a fourth conductor pattern on top of said first insulating layer.

14. A method of manufacturing a packaging substrate according to claim 13, wherein said first insulating layer is formed by laminating an unfired green sheet on top of the said first conductor pattern.

15. A method of manufacturing a packaging substrate according to claim 14, wherein said unfired green sheet comprises substantially the same thermal expansion coefficient values as the circuit substrate.

16. A method of manufacturing a packaging substrate according to claim 13, wherein a LSI chip is mounted by connecting bumps thereof to said fourth conductors on said via hole portions.

17. A method of manufacturing a packaging substrate according to claim 1 or claim 10, further comprising processes of melting a first solder by heating the circuit substrate,

forming a pillar shaped solder by disposing said first ball-shaped solder adjacent to a casting plate having holes corresponding in position to said first ball-shaped solder,

solidifying the pillar-shaped solder and removing said casting plate from said circuit substrate.

18. A method of manufacturing a packaging substrate comprising processes of:

(a) forming an intaglio on the surface of a flexible material by making a patterned groove corresponding to a first conductor pattern,

(b) repeatedly filling and drying a conductive paste in the patterned groove of said intaglio,

(c) transferring the conductive paste pattern onto the circuit substrate by bonding the intaglio with said circuit substrate through applying heat and pressure, and then peeling off said intaglio from said circuit substrate,

(d) firing said circuit substrate and said transferred conductive paste pattern, and

(e) forming a second conductor pattern printed on the side of the circuit substrate opposite to said first conductor pattern;

wherein a surface roughness of said circuit substrate is made larger on a printing surface of the second conductor pattern than on a printing surface of the first conductor pattern.

19. A method of manufacturing a packaging structure wherein a first conductor pattern is formed by intaglio printing on a circuit substrate and a first ball-shaped solder is joined to a second conductor pattern formed on the opposite side of said circuit substrate, said method comprising processes of:

(a) forming an intaglio on the surface of a flexible material by making a patterned groove corresponding to the first conductor pattern, wherein said forming an intaglio comprises forming a thinner land portion of the first conductor pattern in a shallower groove of the intaglio comprising at least two depths of grooves,

(b) repeatedly filling and drying a conductive paste in the groove of said intaglio,

(c) transferring the conductive paste pattern onto the circuit substrate by bonding the intaglio with said circuit substrate through applying heat and pressure, and then peeling off said intaglio from said circuit substrate,

(d) firing said circuit substrate and said transferred conductive paste pattern,

(e) forming said second conductor pattern printed on the side of the circuit substrate opposite to said first conductor pattern,

(f) connecting said second and first conductor patterns by means of a conductive material located in a through hole of the circuit substrate,

(g) joining the first ball-shaped solder to said second conductor pattern on the circuit substrate, and

(h) electrically connecting an LSI chip having bumps through said bumps by face-down mounting on said thinner land portion of the first conductor pattern.

20. A method of manufacturing a packaging substrate wherein a first conductor pattern is formed by intaglio printing on a circuit substrate and a first pillar-shaped solder is joined to a second conductor pattern formed on the opposite side of said circuit substrate, said method comprising processes of:

(a) forming an intaglio on the surface of a flexible material by making a patterned groove corresponding to the first conductor pattern,

(b) repeatedly filling and drying a conductive paste in the groove of said intaglio,

(c) transferring the conductive paste pattern onto the circuit substrate by bonding the conductive paste filled side of the intaglio with said circuit substrate through applying heat and pressure, and then peeling off said intaglio from said circuit substrate,

(d) firing said circuit substrate and said transferred conductive paste pattern,

(e) forming said second conductor pattern printed on the side of the circuit substrate opposite to said first conductor pattern,

(f) connecting said second and first conductor patterns by means of a conductive material located in a through hole of the circuit substrate,

(g) filling, melting, and solidifying a second solder in the empty space of said through hole of the circuit substrate,

(h) making a casting plate having holes come in close contact with a substrate surface of said circuit substrate on which the second conductor pattern is formed,

(i) applying a solder paste in the holes, or in the holes and their peripheral of said casting plate,

(j) pouring the solder into the holes of said casting plate by melting the solder paste thereby forming a first pillar-shaped solder, and

(k) removing said casting plate from said circuit substrate after said first pillar-shaped solder has been solidified,

wherein a surface roughness of said circuit substrate is made larger on a printing surface of the second conductor pattern than on a printing surface of the first conductor pattern.

21. A method of manufacturing a packaging substrate according to claim 20, wherein said second solder has a higher melting point than the first pillar-shaped solder.