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Multi-chip module employing carrier substrate with micromachined alignment structures and method of forming

  • US 6,133,065 A
  • Filed: 01/16/1998
  • Issued: 10/17/2000
  • Est. Priority Date: 03/06/1997
  • Status: Expired due to Term
First Claim
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1. A method for producing a semiconductor carrier substrate, comprising:

  • providing a carrier substrate having a layer of semiconductor material with a substantially planar surface;

    forming at least one elongated mesa of semiconductor material defined by sidewalls extending upwardly to a top from at least one substrate plane of semiconductor material below said at least one elongated mesa by selectively removing material from said substantially planar surface of said layer of semiconductor material to a depth less than a thickness of the layer of semiconductor material;

    substantially simultaneously forming an insulating layer over said at least one substrate plane and said top and sidewalls of said at least one elongated mesa; and

    forming conductive traces on said insulating layer including mutually laterally spaced, substantially linear conductive trace segments oriented transversely to said at least one elongated mesa, said mutually laterally spaced, substantially linear conductive trace segments of said conductive traces each extending over at least one of said sidewalls of said at least one elongated mesa and onto said at least one substrate plane.

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