Selective deposition modeling materials and method

• US 6,133,355 A
• Filed: 06/12/1997
• Issued: 10/17/2000
• Est. Priority Date: 09/27/1995
• Status: Expired due to Term

• Current Assignee: 3D Systems, Inc. (3D Systems Corporation)
• Original Assignee: 3D Systems, Inc. (3D Systems Corporation)
• Inventors: Hull, Charles W., Leyden, Richard N., That, Dinh Ton
• Primary Examiner(s): Lipman, Bernard
• Application Number:
  US08/873,389
• Time in Patent Office: 1,223 Days
• Field of Search: 524/277
• US Class Current: 524/277
• CPC Class Codes: B29C 64/112 using individual droplets, e.g. from jetting heads
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 70/00 Materials specially adapted for additive manufacturing

Abstract

A novel thermopolymer material adapted for use in thermal stereolithography. More particularly, a thermopolymer material comprising a mixture of: a low shrinkage polymer resin; a low viscosity material such as paraffin wax; at least one microcrystalline wax; a toughening polymer; a plasticizer. Alternative embodiments further include components to improve the materials ability to transfer heat and to improve strength. The subject material, together with the described process greatly reduce part building distortions while retaining desirable toughness, strength and jetting properties.

Claims

1. A material for use in selective deposition modeling by jetting from an ink jet print head to build a three-dimensional object in layerwise fashion comprising a mixture of:

a) between about 20 and 45% by weight of paraffin wax;

b) between about 20 and 50% by weight of a hydrocarbon resin, wherein the hydrocarbon resin is a copolymer of α

-methylstyrene and vinyl toluene;

c) between about 10 and 30% by weight of microcrystalline wax selected from the group consisting of a microcrystalline ester wax, a soft microcrystalline wax, a hard microcrystalline wax and mixtures thereof; and

d) between about 2 and 5% by weight of an ethylene-vinyl acetate copolymer,

wherein each % by weight is based on the total weight of the mixture, and wherein the material has a viscosity between about 7 and about 30 centipoise at at least one temperature between about 125 and about 135°

C.

2. The material of claim 1 for use in selective deposition modeling configured to have a viscosity of between about 18 and 25 centipoise at a temperature between about 125 and 130°

C.

3. The material of claim 2 for use in selective deposition modeling configured to have a surface tension of between about 24 and 29 dyne/cm.

4. The material of claim 2 for use in selective deposition modeling configured to have a volumetric shrinkage of less than 11% when cooling from between about 125 and about 130°

C.

5. The material of claim 2 for use in selective deposition modeling wherein said at least one microcrystalline wax comprises between 10 and 15%_w microcrystalline ester wax, between 5 and 20%_w soft microcrystalline wax, and between 5 and 10%_w hard microcrystalline wax.

10. The material of claim 1 or use in selective deposition modeling wherein the material has a shrinkage of about 11% or less when cooled from 130°

C. to 25°

C.

11. The material of claim 1 for use in selective deposition modeling wherein it is dispensed into an environment which is within about 10°

C. of the solidifying temperature of the material.

12. The material of claim 1 for use in selective deposition modeling having a viscosity between about 18 and about 25 centipoise at at least one temperature between about 125 and about 130°

C.

13. The material of claim 1 for use in selective deposition modeling wherein the material transforms from a liquid to a solid over a temperature range of more than about 10°

C.

14. The material of claim 1 for use in selective deposition modeling additionally comprising a coloring agent.

15. The material of claim 14 for use in selective deposition modeling comprising up to about 2.0%_w of the coloring agent.

16. The material of claim 1 wherein the ethylene-vinyl acetate copolymer has a viscosity of about 575 centipoise at 140°

C. and a melting point of between 85 and 95°

C.

6. The material of claim 6 for use in selective deposition modeling further comprising up to 4%_w of an antioxidant.

7. The material of claim 6 for use in selective deposition modeling wherein said at least one microcrystalline wax comprises about 12%_w of a microcrystalline ester wax;

about 5%_w of a hard microcrystalline wax; and

about 5%_w of a soft microcrystalline wax.

8. The material of claim 6 for use in selective deposition modeling further comprising between about 1 and 5%_w of dioctylterephthalate.

9. The material of claim 6 for use in selective deposition modeling further comprising between about 1 and 5%_w of diisononyl phthalate.