Vertical magazine method for integrated circuit device dispensing, receiving, storing, testing or binning

• US 6,135,291 A
• Filed: 01/16/1998
• Issued: 10/24/2000
• Est. Priority Date: 01/16/1998
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micro Electronics Incorporated
• Inventors: Canella, Robert L.
• Primary Examiner(s): Walsh, Donald P.
• Assistant Examiner(s): Martin, Brett C.
• Application Number:
  US09/008,228
• Time in Patent Office: 1,012 Days
• Field of Search: 209/571, 209/573, 209/630, 209/702, 209/942
• US Class Current: 209/573
• CPC Class Codes: B07C 5/344 according to electric or electromagnetic properties sorting according to size measured electrically or electronically B07C5/08; material testing by magnetic means G01N24/00, G01N27/00, by electrical means G01N27/00; electrical measuring devices in general G01R; coin testing G07D5/00
• CPC Class Codes: G01R 31/2893 Handling, conveying or loading, e.g. belts, boats, vacuum fingers G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H01L21/67
• CPC Class Codes: Y10S 414/105 Shifted by article responsive means
• CPC Class Codes: Y10S 414/115 including article counter

Abstract

A method for dispensing, receiving, storing, testing or binning packaged integrated circuit devices using at least one vertically-oriented, removable, tubular magazine disposed above a controllably-driven, rod-like indexing element extending from a drive below the magazine. A magazine, with an associated indexing element and drive, is configurable as an individual magazine module. The indexing element, under power of the drive, raises or lowers a vertical stack of devices to a desired level adjacent the top of the magazine to dispense or receive an individual device from a feed mechanism, such as a pick-and-place mechanism. A number of magazine modules may be assembled in a multi-module array, which is particularly suitable for binning tested devices, with a sort category being directed to each magazine.

Claims

1. A method of testing and binning a plurality of semiconductor devices, comprising:

testing said plurality of semiconductor devices for selected characteristics;

sorting said tested plurality of semiconductor devices into at least two categories responsive to their exhibited characteristics under test;

placing a first semiconductor device in a first sort category into an upwardly-facing mouth of a first upright, elongated magazine;

supporting said first semiconductor device in said first sort category from below on a floor element movably disposed within said first magazine;

lowering said floor element of said first magazine to lower said first semiconductor device in said first sort category into said first magazine; and

placing another semiconductor device in said first sort category in said upwardly-facing mouth of said first magazine on top of said first semiconductor device in said first sort category.

2. The method of claim 1, further comprising:

placing a first semiconductor device in a second sort category into an upwardly-facing mouth of a second upright, elongated magazine; and

supporting said first semiconductor device in said second sort category from below on a floor element movably disposed within said second magazine.

3. The method of claim 2, further including lowering said floor element of said second magazine to lower said first semiconductor device in said second sort category into said second magazine, and placing another semiconductor device in said second sort category in said upwardly-facing mouth of said second magazine on top of said first semiconductor device in said second sort category.

4. The method of claim 1, further comprising disposing a plurality of mutually laterally adjacent upright elongated magazines in an array, said plurality of mutually laterally adjacent upright, elongated magazines being at least as great as a number of said sort categories.

5. The method of claim 4, further including placing sorted semiconductor devices into said plurality of mutually laterally adjacent upright, elongated magazines according to said sort categories until at least one magazine of said plurality of mutually laterally adjacent upright, elongated magazines is filled with semiconductor devices of a given sort category, removing said at least one filled magazine and replacing said at least one filled magazine with an empty magazine.

6. A method of binning a plurality of tested semiconductor devices sorted according to exhibited characteristics under test into a plurality of categories, comprising:

arranging a plurality of upright, elongated magazines in mutual lateral proximity, said plurality of magazines being at least as great as a number of said categories;

dispensing said plurality of tested semiconductor devices into said plurality of magazines according to said categories, with each magazine of said plurality of magazines receiving sorted semiconductor devices of only a single category;

contacting from below at least one sorted semiconductor device within at least one magazine of said plurality of magazines with an elevation assembly; and

regulating an internal volume of said at least one magazine available for receiving said sorted semiconductor devices with said elevation assembly.

7. The method of claim 6, further comprising indexing at least said at least one sorted semiconductor device a specified increment through said at least one magazine with said elevation assembly to effect said regulation of said internal volume of said at least one magazine.

8. The method of claim 6, further comprising labeling said plurality of magazines according to said category of said sorted semiconductor devices contained within said each magazine.

9. A method of binning semiconductor devices sorted into a plurality of categories comprised of:

providing a plurality of tubular magazines, each magazine of said plurality of tubular magazines orientated along a substantially vertical axis and having an upper opening;

disposing a first semiconductor device of a first category in said upper opening of one magazine of said plurality of tubular magazines;

supporting said first semiconductor device of said first category from below on a support structure movable through said one magazine; and

moving said support structure of said one magazine to move said first semiconductor device of said first category away from said upper opening of said one magazine.

10. The method of claim 9, wherein said moving said support structure of said one magazine to move said first semiconductor device of said first category away from said upper opening of said one magazine comprises;

providing an indexing element associated with said support structure of said one magazine; and

indexing said support structure of said one magazine a distance approximately equal to a thickness of said semiconductor devices.

11. The method of claim 9, further comprising:

disposing a second semiconductor device of said first category in said upper opening of said one magazine;

placing said second semiconductor device of said first category on top of said first semiconductor device of said first category to form a stack of semiconductor devices of said first category; and

moving said support structure of said one magazine to move said stack of semiconductor devices of said first category away from, said upper opening of said one magazine.

12. The method of claim 11, wherein said forming a stack of semiconductor devices of said first category comprises forming a stack of at least three said semiconductor devices of said first category.

13. The method of claim 9, further comprising sensing a position of said first semiconductor device of said first category within said one magazine.

14. The method of claim 11, further comprising sensing a number of said semiconductor devices in said stack of semiconductor devices of said first category.

15. The method of claim 9, wherein supporting said first semiconductor device of said first category from below on said support structure comprises supporting said first semiconductor device substantially perpendicular to said vertical axis.

16. A method of binning semiconductor devices sorted into a plurality of categories comprising:

providing a plurality of tubular magazines, each magazine of said plurality of tubular magazines orientated along a substantially vertical axis and having a top surface, said each magazine including a plurality of internal cavities orientated generally parallel to said vertical axis;

disposing a first semiconductor device of a first category in a mouth of a first internal cavity of said plurality of internal cavities of a first magazine of said plurality of magazines, said mouth of said first internal cavity opening to said top surface of said first magazine;

placing said first semiconductor device of said first category on a support structure movable through said plurality of internal cavities of said first magazine;

disposing at least one other semiconductor device of said first category in a mouth of a second internal cavity of said plurality of internal cavities of said first magazine, said mouth of said second internal cavity opening to said too surface of said first magazine;

placing said at least one other semiconductor device of said first category on said support structure of said first magazine; and

moving said support structure to move said first semiconductor device and said at least one other semiconductor device of said first category away from said top surface of said first magazine.

17. The method of claim 16, wherein said moving said support structure to move said first semiconductor device and said at least one other semiconductor of said first category away from said top surface of said first magazine comprises:

providing an indexing element associates with said support structure; and

indexing said support structure a distance approximately equal to a thickness of said semiconductor devices.

18. The method of claim 16, further comprising:

disposing a third semiconductor device of said first category in said mouth of said first internal cavity of said first magazine on top of said first semiconductor device to form a first stack of semiconductor devices of said first category;

disposing a fourth semiconductor device of said first category in said mouth of said second internal cavity of said fist magazine on top of said at least one other semiconductor device to form a second stack of semiconductor devices of said first category; and

moving said support structure to move said first stack of semiconductor devices of said first category and said second stack of semiconductor devices of said first category away from said top surface of said first magazine.

19. The method of claim 18, wherein:

said forming a first stack of semiconductor devices of said first category comprises forming a stack of at least three said semiconductor devices of said first category; and

said forming a second stack of semiconductor devices of said first category comprises forming a stack of at least three said semiconductor devices of said first category.

20. The method of claim 16, further comprising:

disposing a third semiconductor device of said first category in a mouth of a third internal cavity of said plurality of internal cavities of said first magazine, said mouth of said third internal cavity opening to said top surface of said first magazine;

placing said third semiconductor device of said first category on said support structure of said first magazine;

disposing a fourth semiconductor device of said first category in a mouth of a fourth internal cavity of said plurality of internal cavities of said first magazine, said mouth of said fourth internal cavity opening to said top surface of said first magazine; and

placing said fourth semiconductor device of said first category on said support structure of said first magazine;

wherein said act of moving said support structure to move said first semiconductor device and said at least one other semiconductor device of said first category further comprises moving said third semiconductor device and said fourth semiconductor device of said first category away from said top surface of said first magazine.

21. The method of claim 16, further comprising:

disposing a first semiconductor device of a second category in a mouth of a first internal cavity of said plurality of internal cavities of a second magazine of said plurality of tubular magazines, said mouth of said first internal cavity opening to said top surface of said second magazine;

placing said first semiconductor device of said second category on a support structure movable through said plurality of internal cavities of said second magazine; and

moving said support structure of said second magazine to move said first semiconductor device of said second category away from said top surface of said second magazine.

22. The method of claim 21, further comprising:

disposing a second-semiconductor device of said second category in said mouth of said first internal cavity of said second magazine on top of said first semiconductor device of said second category to form a stack of semiconductor devices of said second category; and

moving said support structure of said second magazine to move said stack of semiconductor devices of said second category away from said top surface of said second magazine.

23. The method of claim 22, wherein said forming a stack of semiconductor devices of said second category comprises forming a stack of at least three said semiconductor devices of said second category.