Method of shielding and obtaining access to a component on a printed circuit board

• US 6,136,131 A
• Filed: 06/02/1998
• Issued: 10/24/2000
• Est. Priority Date: 06/02/1998
• Status: Expired due to Term

• Current Assignee: Laird Technologies Incorporated (DuPont de Nemours, Inc.)
• Original Assignee: Instrument Specialties Co, Inc. (Laird Limited)
• Inventors: Sosnowski, Anthony Michael
• Primary Examiner(s): Mayes, Curtis
• Assistant Examiner(s): GRAY, LINDA LAMEY
• Application Number:
  US09/089,238
• Time in Patent Office: 875 Days
• Field of Search: 174/35 R, 174/67, 174/52.1, 257/660, 156/252, 156/256, 156/268, 156/257, 225/93, 83/33, 428/901, 428/43
• US Class Current: 156/256
• CPC Class Codes: H05K 9/0032 having multiple parts, e.g. frames mating with lids
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 156/1056 Perforating lamina
• CPC Class Codes: Y10T 156/1062 Prior to assembly
• CPC Class Codes: Y10T 156/1064 Partial cutting [e.g., grooving or incising]
• CPC Class Codes: Y10T 156/1082 Partial cutting bonded sandwich [e.g., grooving or incising]
• CPC Class Codes: Y10T 225/30 Breaking or tearing apparatus
• CPC Class Codes: Y10T 428/15 Sheet, web, or layer weakened to permit separation through thickness
• CPC Class Codes: Y10T 83/0495 Making and using a registration cut

Abstract

A method for shielding and obtaining access to a component on a printed circuit board including providing a printed circuit board having a component encompassed by a shielding enclosure including a plurality of side walls and an integral top surface having a scored line which defines an interior portion, severing the scored line, removing the interior portion leaving the shielding enclosure with a remaining perimeter rim and allowing access to the component, providing a replacement cover for the shielding enclosure, and attaching the replacement cover to the shielding enclosure to replace the interior portion and to thereby encompass and shield the component. The replacement cover may be attached by soldering or by an adhesive surface of the replacement cover.

Claims

1. A method for shielding and obtaining access to a component on a printed circuit board, said method comprising:

providing a printed circuit board having a component encompassed by a shielding enclosure including a plurality of side walls and an integral top surface having a scored line which defines an interior portion;

severing the scored line on the top surface of the shielding enclosure;

removing the interior portion of the top surface defined by the scored line, thereby leaving the shielding enclosure with a remaining perimeter rim and allowing access to the component within the shielding enclosure;

providing a replacement cover for the shielding enclosure;

attaching the replacement cover to the shielding enclosure to replace the interior portion and to thereby encompass and shield the component.

2. The method of claim 1, wherein said severing step further includes grasping a hole in the top surface of the shielding enclosure and applying force to thereby sever the scored line.

3. The method of claim 1, wherein said attaching step includes soldering the replacement cover to the perimeter rim of the shielding enclosure.

4. The method of claim 1, wherein said attaching step includes pressing an adhesive surface of the replacement cover onto the perimeter rim of the shielding enclosure.

5. The method of claim 4, wherein the replacement cover includes a plurality of side flanges and said attaching step further includes pressing the adhesive surface of the side flanges of the replacement cover onto the side walls of the shielding enclosure.

6. The method of claim 4, wherein the replacement cover includes a plurality of side flanges and a predefined bend line associated with each of the side flanges, said attaching step further including bending the side flanges along the predefined bend lines and pressing the adhesive surface of the side flanges of the replacement cover onto the side walls of the shielding enclosure.