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Apparatus for electro-chemical deposition with thermal anneal chamber

  • US 6,136,163 A
  • Filed: 03/05/1999
  • Issued: 10/24/2000
  • Est. Priority Date: 03/05/1999
  • Status: Expired due to Term
First Claim
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1. An electro-chemical deposition system, comprising:

  • a) a mainframe having a mainframe wafer transfer robot;

    b) a loading station disposed in connection with the mainframe;

    c) one or more processing cells disposed in connection with the mainframe;

    d) an electrolyte supply fluidly connected to the one or more processing cells;

    e) a spin-rinse-dry (SRD) chamber disposed between the loading station and the mainframe; and

    f) a thermal anneal chamber disposed adjacent the loading station.

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